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Chemical/mechanical planarization (CMP) apparatus and polish method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0585068 (1996-01-11)
발명자 / 주소
  • Tsai Chia S. (Hsin-chu TWX) Tseng Pin-Nan (Hsin-chu TWX)
출원인 / 주소
  • Taiwan Semiconductor Manufacturing Company Ltd. (Hsin-Chu TWX 03)
인용정보 피인용 횟수 : 174  인용 특허 : 8

초록 ▼

An improved and new apparatus and process for chemical/mechanical planarization (CMP) of a substrate surface, wherein the slurry concentration between the wafer and polishing pad is controlled through the application of an electric field between the wafer carrier and polishing platen, has been devel

대표청구항 ▼

An apparatus for planarizing semiconductor wafers comprising: a rotatable platen and polishing pad for chemical/mechanical polishing (CMP) a surface of a semiconductor wafer; a reservoir for a polishing slurry and means to dispense the slurry onto the polishing pad; an electrode embedded in said rot

이 특허에 인용된 특허 (8)

  1. Yu Chris C. (Boise ID) Sandhu Gurtej S. (Boise ID), Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection.
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  2. Burke Peter A. (Austin TX) Freeman Eric H. (Underhill Center VT) Ross Gilbert H. (Burlington VT), Chemical-mechanical polishing tool with end point measurement station.
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  3. Kordonsky William I. (Minsk BYX) Prokhorov Igor V. (Minsk BYX) Gorodkin Sergei R. (Minsk BYX) Gorodkin Gennadii R. (Minsk BYX) Gleb Leonid K. (Minsk BYX) Kashevsky Bronislav E. (Minsk BYX), Magnetorheological polishing devices and methods.
    상세보기
  4. Kato Koji (3-16-8 Yagiyamaminami Sendai City ; Miyagi Prefecture JPX) Umehara Noritsugu (Sendai JPX) Adachi Shigeru (Izumi JPX) Sato Shin (Natori JPX), Method for grinding using a magnetic fluid and an apparatus thereof.
    상세보기
  5. Roth Scott S. (Austin TX) Ray Wayne J. (Austin TX) Kirsch Howard C. (Austin TX), Method for planarizing a layer of material.
    상세보기
  6. Schultz Laurence D. (Boise ID) Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID), Method for planarizing semiconductor wafers with a non-circular polishing pad.
    상세보기
  7. Choi Sangsoo (Chungnam KRX), Method of patterning fine line width semiconductor topology using a spacer.
    상세보기
  8. Malik Farid A. (Beaverton OR), Post-polish cleaning of oxidized substrates by reverse colloidation.
    상세보기

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