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Heat radiating apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-011/00
출원번호 US-0590083 (1996-01-26)
우선권정보 JP-0031579 (1995-01-27)
발명자 / 주소
  • Ishida Yoshio (Osaka JPX)
출원인 / 주소
  • Diamond Electric Mfg. Co., Ltd. (Osaka JPX 03)
인용정보 피인용 횟수 : 61  인용 특허 : 0

초록 ▼

A heat radiating apparatus includes a metal pipe attached to at least one side of a metal plate, a heat pipe inserted into an internal hollow of the metal pipe, the hollow being filled with grease having high thermal conductivity, a sleeve seal provided at least one longitudinal end of the metal pip

대표청구항 ▼

A heat radiating apparatus comprising: a metal pipe attached to at least one side of a metal plate; a heat pipe inserted into an internal hollow of said metal pipe, the hollow being filled with grease having high thermal conductivity; a sleeve seal provided at least one longitudinal end of said meta

이 특허를 인용한 특허 (61)

  1. Xu, Shou-Biao; Zhou, Shi-Wen; Chen, Chun-Chi, Active heat sink for use with electronic device.
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  2. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
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  3. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
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  4. Robert L. McMahan ; Damon W. Broder, Apparatus and method for cooling a heat generating component in a computer.
    상세보기
  5. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
    상세보기
  6. Bhatia, Rakesh, Apparatus for cooling a heat dissipating device located within a portable computer.
    상세보기
  7. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
    상세보기
  8. Webb Matthew L., Computer having a heat sink structure incorporated therein.
    상세보기
  9. Webb Matthew L., Computer having a heat sink structure incorporated therein.
    상세보기
  10. Cipolla Thomas Mario ; Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Mok Lawrence Shungwei ; Wong Tin-Lup, Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity.
    상세보기
  11. Park,Jong Hoon, Cooling device for folder type portable wireless terminal.
    상세보기
  12. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
    상세보기
  13. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
    상세보기
  14. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
    상세보기
  15. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
    상세보기
  16. Wang, Hwai-Ming; Chiang, Wei-Chieh; Liu, Hsien-Tsang, Cooling system for hinged portable computing device.
    상세보기
  17. Sakata, Tatsuya; Miyashita, Makoto; Takahashi, Toyoki; Adachi, Daiki; Koyama, Sachiko, Display device.
    상세보기
  18. Sakata, Tatsuya; Miyashita, Makoto; Takahashi, Toyoki; Adachi, Daiki; Koyama, Sachiko, Display device.
    상세보기
  19. MacDonald, Mark; Nishi, Yoshifumi Yoshi, Electronic device having a passive heat exchange device.
    상세보기
  20. Nishi, Yoshifumi; MacDonald, Mark; Heymann, Douglas, Electronic device having passive cooling.
    상세보기
  21. Tanahashi Makoto,JPX ; Asawa Tsutomu,JPX ; Ichikawa Mitsuru,JPX, Electronic device with improved heat dissipation.
    상세보기
  22. Shigeo Ohashi JP; Takashi Naganawa JP; Tadakatsu Nakajima JP; Tsuyoshi Nakagawa JP; Masaaki Eishima JP; Yoshihiro Kondo JP, Electronic equipment.
    상세보기
  23. Hong Chen Fu-In (No. 3 ; Lane 45 ; Yi-Yung Road Kaohsiung TWX), Fan assembly for an integrated circuit.
    상세보기
  24. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.
    상세보기
  25. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
    상세보기
  26. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
    상세보기
  27. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
    상세보기
  28. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
    상세보기
  29. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
    상세보기
  30. Cipolla, Thomas Mario; Mok, Lawrence Shungwei, Formed hinges with heat pipes.
    상세보기
  31. Koichi Inoue JP; Chiyoshi Sasaki JP, Heat conducting apparatus and electronic apparatus having the same.
    상세보기
  32. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
    상세보기
  33. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
    상세보기
  34. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.
    상세보기
  35. Altic James E. ; Karl Rex A. ; Vinson Samuel L., Heat frame for portable computer.
    상세보기
  36. Ito Akira,JPX, Heat pipe method for making the same and radiating structure.
    상세보기
  37. Lee Chuan-Yuan,TWX ; Chang Hui-Lian,TWX ; Yuan Ming,TWX, Heat-dissipating device for an electronic component.
    상세보기
  38. Wang, Feng Ku; Cheng, Yi Lun; Lin, Chun Lung; Yang, Chih Kai; Liu, Cheng Shi, Heat-dissipating module and electronic apparatus.
    상세보기
  39. Blanco, Jr., Richard Lidio; Heirich, Douglas L., Heat-transfer mechanism including a liquid-metal thermal coupling.
    상세보기
  40. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
    상세보기
  41. Kobayashi Takashi,JPX, Information processing apparatus and its heat spreading method.
    상세보기
  42. Meyer ; IV George A. ; Toth Jerome E. ; Tran Mai-Loan ; Taylor Attalee S., Integrated circuit heat seat.
    상세보기
  43. Bhatia Rakesh, Keyboard having an integral heat pipe.
    상세보기
  44. Mok Lawrence Shungwei, Laptop computer with slideable keyboard for exposing a heat generating surface for more efficient heat dissipation.
    상세보기
  45. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
    상세보기
  46. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
    상세보기
  47. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
    상세보기
  48. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
    상세보기
  49. Ali, Ihab A., Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies.
    상세보기
  50. Ishida Yoshio,JPX, Movably mounted heat receiving plate.
    상세보기
  51. Cipolla Thomas Mario ; Mok Lawrence Shungwei, Portable computer rotational heat pipe heat transfer.
    상세보기
  52. Satake Shigeru,JPX, Portable information apparatus with heat sink for promoting heat radiation from circuit components.
    상세보기
  53. Holung Joseph Anthony ; Wong Tin-Lup ; Kamath Vinod, Quick-release hinge joint for heat pipe.
    상세보기
  54. Takehiko Noguchi JP; Masato Anzai JP, Radiation structure for electronic equipment and computer apparatus.
    상세보기
  55. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
    상세보기
  56. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
    상세보기
  57. Mok Lawrence Shungwei, Spring loaded heat pipe connector for hinged apparatus package.
    상세보기
  58. Refai-Ahmed, Gamal; Ramalingam, Suresh; Philofsky, Brian D.; Torza, Anthony, Stacked silicon package having a thermal capacitance element.
    상세보기
  59. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
    상세보기
  60. James Carl Canfield ; Michael L. Dougherty, Sr. ; James Allen Beyer ; Dale Linwood Sleep, Thermal management system for positive crankcase ventilation system.
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  61. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.
    상세보기

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