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Method of making multilayer circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/36
출원번호 US-0277336 (1994-07-19)
발명자 / 주소
  • DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA) Karavakis Konstantine N. (Cupertino CA) Kovac Zlata (Los Gatos CA) Fjelstad Joseph (Sunnyvale CA)
출원인 / 주소
  • Tessera, Inc. (San Jose CA 02)
인용정보 피인용 횟수 : 99  인용 특허 : 26

초록 ▼

An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circu

대표청구항 ▼

A method of making a multilayer circuit comprising the steps of: (a) stacking a circuit panel and an interposer so that a first surface of said interposer confronts a surface of said panel, said interposer having a body and conductors having ends adjacent a surface of the body and having a contact a

이 특허에 인용된 특허 (26)

  1. Dery Ronald A. (Winston-Salem NC) Jones Warren C. (Winston-Salem NC) Lynn William J. (Groveland MA) Rowlette John R. (Clemmons NC), Anisotropically conductive adhesive composition.
    상세보기
  2. Grabbe Dimitry G. (Middletown PA), Area array connector.
    상세보기
  3. Wiley John P. (Vestal NY), Bondable via.
    상세보기
  4. Patraw Nils E. (Redondo Beach CA), Compressive pedestal for microminiature connections.
    상세보기
  5. Patraw Nils E. (Redondo Beach CA), Compressive pedestal for microminiature connections.
    상세보기
  6. Patraw Nils E. (Redondo Beach CA), Connector system for coupling to an integrated circuit chip.
    상세보기
  7. Ehrenberg Scott G. (Fishkill NY) Herron L. Wynn (Hopewell Junction NY) Miersch Ekkehard F. (Schoenaich NY DEX) Park Jae (Somers NY) Poetzinger Janet L. (Pleasant Valley NY), Discrete fabrication of multi-layer thin film, wiring structures.
    상세보기
  8. Zifcak Mark S. (Putnam CT) Kosa Bruce G. (Woodstock CT), Electrical circuit board interconnect.
    상세보기
  9. Evans William R. (Clemons NC) Sinisi David B. (Harrisburg PA), Electrical connector for interconnecting arrays of conductive areas.
    상세보기
  10. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
    상세보기
  11. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Electrical socket.
    상세보기
  12. Bindra Perminder S. (South Salem NY) Canfield Dennis A. (Montrose PA) Markovich Voya R. (Endwell NY) McKeveny Jeffrey (Binghamton NY) Ruane Robert E. (Endicott NY) Thomas Edwin L. (Apalachin NY), Encapsulated circuitized power core alignment and lamination.
    상세보기
  13. Dux John B. (Millbrook NY) Poetzinger Janet L. (Pleasant Valley NY) Prestipino Roseanne M. (Beacon NY) Siefering Kevin L. (Cary NC), Fabrication of discrete thin film wiring structures.
    상세보기
  14. Grabbe Dimitry G. (Middletown PA), Field emitter array integrated circuit chip interconnection.
    상세보기
  15. Grabbe Dimitry G. (Middletown PA), High density electrical connector system.
    상세보기
  16. Ciccio Joseph A. (Winchester MA) Thun Rudolf E. (Carlisle MA) Fardy Harry J. (Chelmsford MA), Integrated circuit device package interconnect means.
    상세보기
  17. Patraw Nils E. (Redondo Beach CA), Inverted chip carrier.
    상세보기
  18. Burger Henry A. (Tempe AZ) White Harold E. (Scottsdale AZ), Method of fabricating a multilayer circuit board assembly.
    상세보기
  19. Fox Leslie R. (Boxborough MA) Wade Paul C. (Shirley MA) Schmidt William L. (Acton MA), Method of packaging and powering integrated circuit chips and the chip assembly formed thereby.
    상세보기
  20. Walkup William B. (79 Balance Rock Rd. ; Apt. 22 Seymour CT 06483), Multi-chip module connector element and system.
    상세보기
  21. King Michael M. (Vashon WA) Walter Helen J. (Seattle WA), Multi-layer circuit board bonding method utilizing noble metal coated surfaces.
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  22. DiStefano Thomas H. (Bronxville NY) Khandros Igor Y. (Peekskill NY) Grube Gary W. (Monroe NY), Multi-layer circuit construction methods with customization features.
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  23. Crepeau Philip C. (San Diego CA), Multilayer printed circuit board.
    상세보기
  24. Benarr, Garry M.; Burns, Terry A.; Walker, William J., Pinless connector interposer and method for making the same.
    상세보기
  25. Kurosawa Keiji (Nagano JPX) Yamamoto Kenji (Nagano JPX) Yamashita Mirsuo (Nagano JPX) Mitsui Hisami (Nagano JPX) Miyabara Ayako (Nagano JPX) Miyagawa Kiyotaka (Suzaka JPX) Imura Takayoshi (Nagano JPX, Process for manufacturing hollow multilayer printed wiring board.
    상세보기
  26. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.
    상세보기

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  1. Hougham, Gareth; McVicker, Gerard; Gu, Xiaoxiong; Kang, Sung K.; Libsch, Frank R.; Liu, Xiao H., Axiocentric scrubbing land grid array contacts and methods for fabrication.
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  2. Hougham, Gareth; McVicker, Gerard; Gu, Xiaoxiong; Kang, Sung K.; Libsch, Frank R.; Liu, Xiao H., Axiocentric scrubbing land grid array contacts and methods for fabrication.
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  3. Hougham, Gareth; McVicker, Gerard; Gu, Xiaoxiong; Kang, Sung K.; Libsch, Frank R.; Liu, Xiao H., Axiocentric scrubbing land grid array contacts and methods for fabrication.
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  4. Beroz Masud ; Haba Belgacem, Components with conductive solder mask layers.
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  5. Beroz,Masud; Haba,Belgacem, Components with conductive solder mask layers.
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  6. Peters, Michael G.; McCormack, Mark Thomas; Bernales, Aris, Composite interposer and method for producing a composite interposer.
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  7. DiStefano Thomas H. ; Fjeslstad Joseph ; Smith John W., Connection component and method of making same.
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  8. DiStefano,Thomas H.; Fjelstad,Joseph; Haba,Belgacem; Jamil,Owais; Karavakis,Konstantine; Light,David; Smith,John W., Connection component with peelable leads.
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  15. Dittmann,Larry E., Deep drawn electrical contacts and method for making.
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  16. Belke, Jr., Robert Edward; Jairazbhoy, Vivek A.; Krautheim, Thomas B.; Quitty, Jr., William F., Electrical circuit board and a method for making the same.
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  18. DiStefano, Thomas H.; Fjelstad, Joseph, Electrical connection with inwardly deformable contacts.
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  22. Light, David Noel; Kalakkad, Dinesh Sundararajan; Nguyen, Peter Tho, Electrical connector and method of making it.
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  24. Light, David Noel; Wang, Hung-Ming; Baker, David Rodney; Nguyen, Peter Tho; Pao, Dexter Shih-Wei, Electrical connector with electrical contacts protected by a layer of compressible material and method of making it.
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  26. Dalton, Timothy J.; Petrarca, Kevin S.; Volant, Richard P., Encapsulated energy-dissipative fuse for integrated circuits and method of making the same.
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  28. Godana, Ken; Erven, Dusty; Foreman, Kevin; Miller, Paul, Flexible electrical connector insert with conductive and non-conductive elastomers.
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  30. Smith John W. ; Haba Belgacem, Flexible lead structures and methods of making same.
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  46. Neuman David, Method for manufacturing printed circuit board assembly.
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  47. Lu You ; Steve Avanzino ; Fei Wang, Method for preventing damage of low-k dielectrics during patterning.
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  48. Razon Eli ; Von Seggern Walter, Method of forming a chip scale package, and a tool used in forming the chip scale package.
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  50. Wang,Alan E.; Olson,Kevin C.; Di Stefano,Thomas H., Method of making a circuit board.
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  53. Kawasaki,Yogo; Satake,Hiroaki; Iwata,Yutaka; Tanabe,Tetsuya, Method of manufacturing multi-layer printed circuit board.
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  55. Blish ; II Richard C. ; Hatchard Colin ; Morgan Ian, Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts.
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  56. Chambers, Douglas C., Methods and apparatus for a flexible circuit interposer.
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  57. Chambers,Douglas C, Methods and apparatus for a flexible circuit interposer.
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  58. Masud Beroz, Methods of making a connection component using a removable layer.
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  59. DiStefano Thomas H. ; Smith John W. ; Karavakis Konstantine N. ; Kovac Zlata ; Fjelstad Joseph, Methods of making microelectronic components having electrophoretically deposited layers.
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  60. Geen, John A., Micro-machined device structures having on and off-axis orientations.
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