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High performance fan heatsink assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0270193 (1994-07-01)
발명자 / 주소
  • Barker
  • III Charles R. (Harvard MA) Olson Richard E. (Boylston MA) Lindquist Stephen E. (Boylston MA) Hartsarich Massimo (Kunzelsau DEX) Cease David A. (Avon CT) Sobolewski Robert S. (Woodbury CT)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 103  인용 특허 : 10

초록

A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. Th

대표청구항

A fan heatsink assembly comprising: a heat dissipating member including a base, a truncated conical shaped central member disposed over a central portion of said base, wherein said central member maybe a truncated hyperbolic shade, and a plurality of fins supported on said base; and a fan assembly d

이 특허에 인용된 특허 (10)

  1. Gutzwiller Howard L. (Zelienople PA), Axial fan turning diffuser.
  2. Rodewald Wilhelm H. A. (31 George Starck Drive Oostersee ; Cape Province ZAX), Blower for agricultural spraying.
  3. Grabbe Dimitry G. (Middletown PA), Chip carrier with energy storage means.
  4. Mita Yoshiyuki (Shizuoka JPX) Ono Yuichi (Numazu JPX), Fan with a resistant plate.
  5. Steffen James E. (Woodbury MN) Grannis Vaughn B. (Inver Grove Heights MN) Schroder Frank S. (Afton MN), Heat exchanger.
  6. Arnold Allen J. (Lagrangeville NY) Sutton Kerry L. (Wappingers Falls NY), Heat sink.
  7. Higgins ; III. Leo M. (Middleboro MA), Heat sink apparatus.
  8. Higgins ; III Leo M. (Middleboro MA), Heat sink apparatus with an air deflection member.
  9. Gabuzda Paul G. (Laguna Beach CA), Heat sink device assembly for encumbered IC package.
  10. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Staggered radial-fin heat sink device for integrated circuit package.

이 특허를 인용한 특허 (103)

  1. Tai, Chun I; Huang, Wen Chung; Lai, Cheng Hsing, Apparatus for wave energy harnessing.
  2. Horng, Alex; Yin, Tso-Kuo, Blower casing.
  3. Horng,Alex; Yin,Tso Kuo, Blower casing.
  4. Horng,Alex; Yin,Tso Kuo, Blower casing.
  5. Horng,Alex; Yin,Tso Kuo, Blower casing.
  6. O'Connor, John F.; Dickinson, Roger B., Centrifugal blower with partitioned scroll diffuser.
  7. Fujimoto, Seiya; Fukuda, Takako; Suzuki, Yuzuru; Ogushi, Masaki, Centrifugal fan.
  8. Huang,Chu Tsai, Circular heat sink assembly.
  9. Wattelet, Jonathan P.; Garner, Scott D., Combination tower and serpentine fin heat sink device.
  10. Lopatinsky, Edward; Fedoseyev, Lev A.; Fedosov, Yuriy Igorevich; Askhatov, Nil, Cooler for electronic devices.
  11. Lopatinsky,Edward; Fedoseyev,Lev; Askhatov,Nil, Cooler with blower comprising heat-exchanging elements.
  12. Wagner, Guy R., Cooling apparatus.
  13. Wysk, Hans-Joachim; Glatz, Karl-Heinz, Cooling apparatus for an electronic device to be cooled.
  14. Searby,Tom J., Cooling apparatus for electronic devices.
  15. Suntio Teuvo,FIX ; Maki Jarmo,FIX, Cooling element for an unevenly distributed heat load.
  16. Saito Kohichi,JPX, Cooling fan and cooling fan assembly.
  17. Kamekawa Yutaka,JPX ; Nakayama Kiyoshi,JPX ; Nakamura Satoshi,JPX, Cooling radiator.
  18. Winkler Wolfgang Arno,DEX, Cover for a fan.
  19. Oyamada Takashi,JPX, Device having an efficient heat radiation casing.
  20. Carter,Daniel P.; Crocker,Michael T., Electronic assemblies with high capacity bent fin heat sinks.
  21. Carter, Daniel P.; Crocker, Michael T.; Broili, Ben M.; Byquist, Tod A.; Llapitan, David J., Electronic assemblies with high capacity curved fin heat sinks.
  22. Carter,Daniel P.; Crocker,Michael T.; Broili,Ben M.; Byquist,Tod A.; Llapitan,David J., Electronic assemblies with high capacity heat sinks and methods of manufacture.
  23. Watanabe, Michinori; Ogawara, Toshiki; Iijima, Masayuki; Maruyama, Haruhisa, Electronic component cooling apparatus.
  24. Watanabe,Michinori; Ogawara,Toshiki; Iijima,Masayuki; Maruyama,Haruhisa, Electronic component cooling apparatus.
  25. Hunt, Mickey Jay; Proctor, Christopher Michael William, Electronic device with combination heat sink/blower or fan assembly.
  26. Hunt, Mickey Jay; Craig, Randy Wayne; Proctor, Christopher Michael William, Electronic device with combination heat sink/blower or fan assembly having air duct.
  27. Kaori Yasufuku JP; Taiji Hosaka JP; Masaaki Miyazawa JP, Electronic module.
  28. Webster ; Jr. Leo H. ; Mok Lawrence Shungwei ; Kamath Vinod ; Mansuria Mohanlal S., Forced air cooling apparatus for semiconductor chips.
  29. Smith, Grant M.; Wessel, Mark W., Forced convection heat sink system with fluid vector control.
  30. Hul Chun Hsu TW, Geometrical streamline flow guiding and heat-dissipating structure.
  31. Chou, Chia-Shin; Chen, Xiao-Zhu; Ye, Zhen-Xing, Heat dissipating apparatus for chips.
  32. Wang,Dong; Lee,Tsung Lung; He,Li, Heat dissipating device.
  33. Chang, Kuo Ta, Heat dissipating device for central processor.
  34. Lee, Hsieh Kun; Chen, Chun-Chi; Lan, Chin Hsien; Fu, Meng, Heat dissipation device.
  35. Chung, Chao-Tsai; Cheng, Cheng-Chen; Lin, Po-Yao, Heat dissipation module.
  36. Kogure Eiji,JPX ; Fukushima Tadashi,JPX ; Tsukahara Hiroaki,JPX ; Imai Toshihisa,JPX ; Oshima Takao,JPX ; Kaga Kunihiko,JPX, Heat radiating plate.
  37. Jeon, Sung Ho, Heat radiation member, heat radiation circuit board, and heat emission device package.
  38. Lin, Sheng-Huang, Heat radiator.
  39. Checchetti Maurizio,ITX, Heat sink.
  40. Lin, Sheng Huang, Heat sink.
  41. Tan,Li Kuang; Huang,Yu Hung; Wu,Wei Fan; Lin,Kuo Cheng; Huang,Wen Shi, Heat sink.
  42. Tsan-Wen Chuang TW; Jr. Chou TW, Heat sink.
  43. Watanabe, Michinori; Ogawara, Toshiki; Iijima, Masayuki; Maruyama, Haruhisa, Heat sink.
  44. Watanabe,Michinori; Ogawara,Toshiki; Iijima,Masayuki; Maruyama,Haruhisa, Heat sink.
  45. Liang, Chuan-Yi; Sun, Sho-Chang, Heat sink apparatus.
  46. Bamford, William C.; Wotring, Blaine C.; Wyler, Gregory T., Heat sink assembly.
  47. Chun-Chi Chen TW, Heat sink assembly with dual fans.
  48. Otsuki,Takaya; Ishikawa,Masahiro, Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan.
  49. Delano, Andrew Douglas; Rubenstein, Brandon Aaron, Heat sink fin with stator blade.
  50. Ghosh,Debashis; Bhatti,Mohinder Singh; Reyzin,Ilya; Parisi,Mark Joseph, Heat sink for an electronic device.
  51. Yang, He Shun; Wu, Meng Chai, Heat sink for illuminating device.
  52. O'Sullivan, Michael; Regnier, Kent E.; Woting, Blaine C., Heat sink retainer and Heat sink assembly using same.
  53. Chroneos ; Jr. Robert J. ; Banerjee Koushik, Heat slug design which facilitates mounting of discrete components on a package without losing lands or pins in the package.
  54. Kaslusky, Scott F.; St. Rock, Brian; Whiton, John H.; Nardone, Vincent C., Heat transfer device with fins defining air flow channels.
  55. Lee, Seri; Pollard, II, Lloyd L., Heat-dissipating devices, systems, and methods with small footprint.
  56. Budelman Gerald A., Heatsink with integrated blower for improved heat transfer.
  57. Patel, Janak G.; Zalesinski, Jerzy M., High efficiency heat sink/air cooler system for heat-generating components.
  58. Seri Lee ; Lloyd L. Pollard, II ; Craig M. Randleman, High performance air cooled heat sinks used in high density packaging applications.
  59. Hegde, Shankar, High performance cooling device.
  60. Hegde, Shankar, High performance cooling device.
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  62. Shankar Hegde IN, High performance cooling device.
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  65. Hegde, Shankar, High performance passive cooling device with ducting.
  66. Shih, Chuan-Feng; Fu, Sheng-Wen; Wu, Hsuan-Ta; Lai, Chih-Ming, Illumination device.
  67. Ghosh, Debashis; Bhatti, Mohinder Singh, Impingement cooled heat sink with low pressure drop.
  68. Bhatti,Mohinder Singh; Ghosh,Debashis; Joshi,Shrikant Mukund, Impingement cooled heat sink with uniformly spaced curved channels.
  69. Shih, Chuan-Feng; Fu, Sheng-Wen; Wu, Hsuan-Ta; Lai, Chih-Ming, Lighting fixture.
  70. Pollard, II, Lloyd L.; Tirumala, Murli; Noval, Jim, Manufacturing process for a radial fin heat sink.
  71. Gerald A. Budelman, Method and apparatus for improving the thermal performance of heat sinks.
  72. Robert J. Chroneos, Jr. ; Koushik Banerjee, Method and apparatus for polygonal heat slug.
  73. Shah,Ketan R., Method of making split fin heat sink.
  74. Horng, Alex; Yin, Tso-Kuo, Min fan casing.
  75. Horng, Alex; Yin, Tso Kuo, Mini fan casing.
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  85. Horng,Alex; Yin,Tso Kuo, Mini fan casing.
  86. Lopatinsky,Edward; Shostak,Naum; Fedoseyev,Lev, Multi-heatsink integrated cooler.
  87. St. Rock, Brian; Kaslusky, Scott F., Non-circular radial heat sink.
  88. Ohgami Keizo,JPX ; Shibasaki Kazuya,JPX ; Itoh Hironori,JPX, Portable electronic apparatus having the heat radiation device for circuit module.
  89. Petruzzi, Vasco; Vigliano, Pierfilippo; Vigliano, legal representative, Paolo; Imperiale, legal representative, Paola, Pyramidal case, for computer, with high ability to dissipate the heat.
  90. Wei, Wen; Stapleton, Michael A.; Guarnero, Richard F., Radial base heatsink.
  91. Ghosh,Debashis; Bhatti,Mohinder Singh; Reyzin,Ilya; Parisi,Mark Joseph, Radial flow micro-channel heat sink with impingement cooling.
  92. Crocker, Michael T.; Carter, Daniel P.; Byquist, Tod A.; Broili, Ben M., Radial folded fin heat sinks and methods of making and using same.
  93. Yano,Hiroshi; Shimomura,Kenji, Radiator for semiconductor.
  94. Takahashi, Osamu, Rolling bearing apparatus.
  95. Ushijima, Koichi; Hussein, Khalid Hassan; Saito, Shoji, Semiconductor device and semiconductor module having cooling fins.
  96. Ushijima, Koichi; Hussein, Khalid Hassan; Saito, Shoji, Semiconductor device and semiconductor module having cooling fins.
  97. Rogers, C. James; Hughes, Gregory G.; Zhang, L. Winston; Grippe, Frank M.; Cheema, Rifaquat, Serpentine, slit fin heat sink device.
  98. Shah, Ketan R., Split fin heat sink.
  99. Khalili, Kaveh; Rockenfeller, Uwe, Spot cooler for heat generating electronic components.
  100. Jeong,Kwang Jin, Structure for heat dissipation of integrated circuit chip and display module including the same.
  101. Fargo Chou TW, Structure of computer CPU heat dissipation module.
  102. Yuan, Mei-Hua; Li, Li-Hua, Thermal module with quick assembling structure.
  103. Cho, Eric; Lai, Carey; Lin, Mark, Turbinate heat sink.
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