초록 ▼

A vertically integrated sensor structure (60) includes a base substrate (71) and a cap substrate (72) bonded to the base substrate (71). The base substrate (71) includes a transducer (78) for sensing an environmental condition. The cap substrate (72) includes electronic devices (92) formed on one su

A vertically integrated sensor structure (60) includes a base substrate (71) and a cap substrate (72) bonded to the base substrate (71). The base substrate (71) includes a transducer (78) for sensing an environmental condition. The cap substrate (72) includes electronic devices (92) formed on one surface to process output signals from the transducer (78). The sensor structure (60) provides an integrated structure that isolates sensitive components from harsh environments.

대표청구항 ▼

A vertically integrated sensor device comprising: a base substrate having a first major surface, a second major surface opposite the first major surface, and a cavity extending from the second major surface to form a diaphragm, and wherein the base substrate comprises a semiconductor material; a tra

A vertically integrated sensor device comprising: a base substrate having a first major surface, a second major surface opposite the first major surface, and a cavity extending from the second major surface to form a diaphragm, and wherein the base substrate comprises a semiconductor material; a transducer formed on the diaphragm; a cap substrate having a third major surface and a fourth major surface opposite the third major surface, wherein the third major surface is connected to the first major surface to provide a hermetically sealed chamber, and wherein the cap substrate comprises a semiconductor material; and an electronic device formed on the fourth major surface, wherein the electronic device is electrically coupled to the transducer.