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[미국특허] Suspended single crystal silicon structures and method of making same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/058
  • H01L-029/06
출원번호 US-0321299 (1994-10-11)
발명자 / 주소
  • Reay Richard J. (Palo Alto CA) Klaassen Erno H. (San Jose CA)
출원인 / 주소
  • The Board of Trustees of the Leeland Stanford Junior University (Palo Alto CA 02)
인용정보 피인용 횟수 : 56  인용 특허 : 4

초록

Temperature-sensitive transducers and other circuitry are manufactured by an electrochemical post-processing etch on an integrated circuit fabricated using a conventional CMOS process. Tetramethyl ammonium hydroxide or another anisotropic etchant having similar characterisics is used to selectively

대표청구항

An integrated circuit incorporating a suspended single crystal silicon structure, comprising: a p-substrate; a pit etched in said p-substrate; at least one dielectric beam extending over said pit; an n-well suspended over said pit by said at least one dielectric beam, said at least one dielectric be

이 특허에 인용된 특허 (4) 인용/피인용 타임라인 분석

  1. Bohrer Philip J. (Minneapolis MN) Johnson Robert G. (Minneapolis MN), Flow sensor.
  2. Liddiard Kevin C. (Adelaide AUX), Semiconductor film bolometer thermal infrared detector.
  3. Bu Jong U. (Seoul KRX), Thermal comfort sensing device.
  4. Higashi Robert E. (Bloomington MN) Holmen James O. (Minnetonka MN) Johnson Robert G. (Minnetonka MN), Thermal sensor.

이 특허를 인용한 특허 (56) 인용/피인용 타임라인 분석

  1. Landsberger, Leslie M.; Grudin, Oleg, Compensating for linear and non-linear trimming-induced shift of temperature coefficient of resistance.
  2. King, William P.; Lee, Jungchul, Device for calorimetric measurement.
  3. Hou, Kuan-Chou; Ou-Yang, Mang; Chiou, Jin-Chern, Electrical calibrated radiometer.
  4. Euisik Yoon KR; Kwang Hyun Lee KR; Hyung Kew Lee KR, Electrothermal integrator and audio frequency filter.
  5. Maes, Ben; Van Buggenhout, Carl; Van Der Wiel, Appolonius Jacobus, Etching of infrared sensor membrane.
  6. Seki,Koji; Zushi,Nobuhiko; Ike,Shinichi; Nakano,Seishi; Nakata,Tarou; Kamiunten,Shoji, Flow sensor and method of manufacturing the same.
  7. Dhuler Vijayakumar R. ; Hill Edward ; Cowen Allen, In-plane MEMS thermal actuator and associated fabrication methods.
  8. Merrill Richard Billings ; Lee Tsung-Wen, Integrated inductor with filled etch.
  9. Faralli, Dino; Vigna, Benedetto; Castoldi, Laura Maria, MEMS device incorporating a fluidic path, and manufacturing process thereof.
  10. Agrawal, Vivek; Wood, Robert L.; Mahadevan, Ramaswamy, MEMS microactuators located in interior regions of frames having openings therein and methods of operating same.
  11. Dhuler Vijayakumar R. ; Hill Edward A. ; Mahadevan Ramaswamy ; Walters Mark David ; Wood Robert L., MEMS variable optical attenuator.
  12. Wu Zhiqiang ; Li Li ; Figura Thomas A.,JPX ; Parekh Kunal R. ; Pan Pai-Hung ; Reinberg Alan R. ; Ma Kin F., Material removal method for forming a structure.
  13. Wu, Zhiqiang; Li, Li; Figura, Thomas A.; Parekh, Kunal R.; Pan, Pai-Hung; Reinberg, Alan R.; Ma, Kin F., Material removal method for forming a structure.
  14. Wu, Zhiqiang; Li, Li; Figura, Thomas A.; Parekh, Kunal R.; Pan, Pai-Hung; Reinberg, Alan R.; Ma, Kin F., Material removal method for forming a structure.
  15. Wu, Zhiqiang; Li, Li; Figura, Thomas A.; Parekh, Kunal R.; Pan, Pai-Hung; Reinberg, Alan R.; Ma, Kin F., Material removal method for forming a structure.
  16. Zhiqiang Wu ; Li Li ; Thomas A. Figura JP; Kunal R. Parekh ; Pai-Hung Pan ; Alan R. Reinberg ; Kin F. Ma, Material removal method for forming a structure.
  17. Grudin,Oleg; Landsberger,Leslie M., Measuring and trimming circuit components embedded in micro-platforms.
  18. Chen, Chung-Nan; Hsiao, Chien-Hua; Huang, Wen-Chie, Metallic silicide resistive thermal sensor and method for manufacturing the same.
  19. Dhuler Vijayakumar R. ; Wood Robert L. ; Mahadevan Ramaswamy, Method of fabricating a microelectro mechanical structure having an arched beam.
  20. Verhaverbeke Steven, Methods for treating semiconductor wafers.
  21. Wu Zhiqiang ; Li Li ; Figura Thomas A. ; Parekh Kunal R. ; Pan Pai-Hung ; Reinberg Alan R. ; Ma Kin F., Methods of making implanted structures.
  22. Hill, Edward; Wood, Robert L.; Mahadevan, Ramaswamy, Methods of overplating surfaces of microelectromechanical structure.
  23. Dhuler Vijayakumar R. ; Walters Mark David, Microactuators including a metal layer on distal portions of an arched beam.
  24. Dhuler Vijayakumar R., Microelectromechanical device having single crystalline components and metallic components.
  25. Dhuler, Vijayakumar R., Microelectromechanical device having single crystalline components and metallic components.
  26. Dhuler Vijayakumar R. ; Wood Robert L., Microelectromechanical positioning apparatus.
  27. Hill Edward A., Microelectromechanical rotary structures.
  28. Vijayakumar R. Dhuler ; Mark David Walters, Microelectromechanical valves including single crystalline material components.
  29. Shorrocks Nicholas M,GBX ; Walker Martin J,GBX ; Nicklin Ralph,GBX ; Parsons Andrew D,GBX, Micromachined devices having microbridge structure.
  30. Lee, Dae Sung; Lee, Kyung Il; Hwang, Hak In, Microwave power sensor and method for manufacturing the same.
  31. Conta,Renato; Piano,Mara, Monolithic printhead with built-in equipotential network and associated manufacturing method.
  32. Conta,Renato; Piano,Mara, Monolithic printhead with built-in equipotential network and associated manufacturing method.
  33. Chavan, Abhijeet V.; Logsdon, James H.; Chilcott, Dan W.; Lee, Han-Sheng S.; Lambert, David K.; Vas, Timothy A., Monolithically-integrated infrared sensor.
  34. Hill Edward A. ; Dhuler Vijayakumar R., Multi-dimensional scalable displacement enabled microelectromechanical actuator structures and arrays.
  35. Saul Cyro K.,BRX ; Zemel Jay N., Multi-purpose integrated intensive variable sensor.
  36. Zhan, Changqing; Schuele, Paul J.; Conley, Jr., John F.; Hartzell, John W., Piezo-diode cantilever MEMS.
  37. Chan, Lap; Chu, Sanford; Ng, Chit Hwei; Verma, Purakh; Zheng, Jia Zhen; Chew, Johnny; Sia, Choon Beng, Process to reduce substrate effects by forming channels under inductor devices and around analog blocks.
  38. Chan,Lap; Chu,Sanford; Ng,Chit Hwei; Verma,Purakh; Zheng,Jia Zhen; Chew,Johnny; Sia,Choon Beng, Process to reduce substrate effects by forming channels under inductor devices and around analog blocks.
  39. Noda, Takafumi, Pyroelectric detector, pyroelectric detection device, and electronic instrument.
  40. Johansson, Ted; Norstr?m, Hans, Selective base etching.
  41. Lescouzeres Lionel,FRX ; Lorenzo Alexandra,FRX ; Scheid Emmanual,FRX, Semiconductor chemical sensor device and method of forming a thermocouple for a semiconductor chemical sensor device.
  42. Merassi, Angelo Antonio; Ferrera, Marco; Mantovani, Marco; Ferrari, Paolo; Vigna, Benedetto, Semiconductor integrated device with mechanically decoupled active area and related manufacturing process.
  43. Im, Yun-Hyeok; Park, Kyol; Hwang, Hee-Jung, Semiconductor package and electronic system including the same.
  44. Opitz, Bernhard; Feyh, Ando; Herrmann, Daniel; Wolst, Oliver, Sensor.
  45. Hill Edward ; Wood Robert L. ; Mahadevan Ramaswamy, Temperature compensated microelectromechanical structures and related methods.
  46. Milley, Andrew Joseph; Ricks, Lamar Floyd; Becke, Craig Scott, Temperature compensation module for a fluid flow transducer.
  47. Lukashevich, Dzianis, Temperature stabilized circuitry.
  48. Wood Robert L. ; Dhuler Vijayakumar R., Thermal arched beam microelectromechanical actuators.
  49. Dhuler Vijayakumar R. ; Wood Robert L. ; Mahadevan Ramaswamy, Thermal arched beam microelectromechanical devices and associated fabrication methods.
  50. Dhuler Vijayakumar R. ; Wood Robert L. ; Mahadevan Ramaswamy, Thermal arched beam microelectromechanical structure.
  51. Dhuler Vijayakumar R. ; Wood Robert L. ; Mahadevan Ramaswamy, Thermal arched beam microelectromechanical valve.
  52. Noda, Takafumi; Takizawa, Jun, Thermal detector, thermal detection device, and electronic instrument.
  53. Dries Michael F. ; Roisen Roger L., Thermally isolated integrated circuit.
  54. Wojciechowski, Kenneth; Olsson, Roy H.; Clews, Peggy J.; Bauer, Todd, Thermally-isolated silicon-based integrated circuits and related methods.
  55. Liu Chien-Chang ; Mastrangelo Carlos H., Uncooled infrared focal plane imager and microelectromechanical infrared detector for use therein.
  56. Verhaverbeke Steven ; McConnell Christopher F. ; Trissel Charles F., Wet processing methods for the manufacture of electronic components using sequential chemical processing.

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