초록 ▼

An electronics device has unpackaged chips or other small components mounted on a carrier and wire-bonded to carrier wiring traces. The rear chip faces have a layer of adhesive which overlies a layer of solder or other fusible material, and which adheres to a pad area of the carrier. To replace a ch

An electronics device has unpackaged chips or other small components mounted on a carrier and wire-bonded to carrier wiring traces. The rear chip faces have a layer of adhesive which overlies a layer of solder or other fusible material, and which adheres to a pad area of the carrier. To replace a chip, its solder layer is melted, and the chip and adhesive are pulled off. Reapplying an adhesive layer allows a new chip to be mounted on the carrier and bonded to the traces.

대표청구항 ▼

A method of fabricating an electronics apparatus including components each having a relatively large flat face at a pad location of a carrier having wiring means for interconnecting such components and possibly other components, comprising: coating said carrier at said pad locations with a layer of

A method of fabricating an electronics apparatus including components each having a relatively large flat face at a pad location of a carrier having wiring means for interconnecting such components and possibly other components, comprising: coating said carrier at said pad locations with a layer of fusible material having a selected melting temperature; coating said layer of fusible material with a layer of adhesive material having a melting temperature substantially greater than said selected melting temperature; fixedly attaching said components to said layer of adhesive material at said pad location; connecting said components to said wiring means on said carrier; determining that one of said original components at one of said pad locations must be replaced; applying heat to said fusible layer sufficient to melt it at said one pad location while not affecting said layer of adhesive material; mechanically separating said one component and all of said layer of adhesive material at said one pad location, from said carrier; replacing said layer of adhesive material above said layer of fusible material at said one pad location; fixedly attaching a replacement component at said one pad location; and connecting said replacement component to said wiring means on said carrier.