초록 ▼

There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductiv

There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.

대표청구항 ▼

A semiconductor package, comprising: at least one semiconductor device bonded to a first side of a thermal dissipator; said thermal dissipator having a first side and an opposing second side and being selected from the group consisting of aluminum, titanium, zinc, magnesium and alloys thereof with a

A semiconductor package, comprising: at least one semiconductor device bonded to a first side of a thermal dissipator; said thermal dissipator having a first side and an opposing second side and being selected from the group consisting of aluminum, titanium, zinc, magnesium and alloys thereof with a density less than 5 g/cm3; an anodization layer coating said thermal dissipator; a leadframe providing electrical interconnection between said semiconductor device and the exterior of said semiconductor package wherein the thickness of said thermal dissipator is greater than the thickness of said leadframe; and a molding resin encapsulating said semiconductor device and at least a portion of said thermal dissipator.