초록 ▼

A thin IC card which is highly reliable, simple in construction and structure, to which a function section relating to main information processing can be easily attached, and which has improved portability, and a method for producing it are disclosed. This thin IC card is characterized by including

A thin IC card which is highly reliable, simple in construction and structure, to which a function section relating to main information processing can be easily attached, and which has improved portability, and a method for producing it are disclosed. This thin IC card is characterized by including a plate type IC module in which a semiconductor device having at least memory function and CPU function has its one side sealed or molded with a resin, and flat type externally connecting terminals have their one end connected to the input/output terminals of the semiconductor device and the other end led and exposed to a non-resin sealed or molded side, and a card-like support which has a fitting section for fitting the plate type IC module with the surface of the externally connecting terminals of the plate type IC module exposed to be substantially flush with the surface of the card, a required circuit wiring, an antenna for sending and receiving a signal without contacting, and if necessary an oscillator for specifying a frequency and a power supply battery.

대표청구항 ▼

A thin IC card comprising: a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external term

A thin IC card comprising: a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and a card-like support having a first area and a second area formed outside of the first area, a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.