이 특허를 인용한 특허 (22)

1. Benton,William J.; Magri,Neal F., Alkali metal tungstate compositions and uses thereof.

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2. Man, Hau-chung; Ng, Wing-yan; Yeung, Chi-hung; Lee, Chi-yung; Siu, Cho-lung; Tsui, Rick Y. C.; Yeung, Kinny L. K., Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings.

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3. Man, Hau-chung; Ng, Wing-yan; Yeung, Chi-hung; Lee, Chi-yung; Siu, Cho-lung; Tsui, Rick Y. C.; Yeung, Kinny L. K., Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles.

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4. Wirth, Alexandra, Compositions for the currentless deposition of ternary materials for use in the semiconductor industry.

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5. Wirth, Alexandra, Compositions for the currentless deposition of ternary materials for use in the semiconductor industry.

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6. Weidman, Timothy W.; Wijekoon, Kapila P.; Zhu, Zhize; Gelatos, Avgerinos V. (Jerry); Khandelwal, Amit; Shanmugasundram, Arulkumar; Yang, Michael X.; Mei, Fang; Moghadam, Farhad K., Contact metallization scheme using a barrier layer over a silicide layer.

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7. Vaskelis, Algirdas; Jagminiene, Aldona; Stankeviciene, Ina; Norkus, Eugenijus, Electroless deposition of cobalt alloys.

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8. Vaskelis, Algirdas; Jagminiene, Aldona; Stankeviciene, Ina; Norkus, Eugenijus, Electroless deposition of cobalt alloys.

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9. Stewart, Michael P.; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Eaglesham, David J., Electroless deposition process on a silicon contact.

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10. Stewart, Michael P.; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Eaglesham, David J., Electroless deposition process on a silicon contact.

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11. Nye, Aurora Marie Fojas; Du, Jerry G.; Andre, Robert C., Electroless nickel alloy plating bath and process for depositing thereof.

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12. Hui Wen Hua, Method and apparatus for depositing Ni-Fe-W-P alloys.

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13. Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor C., Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation.

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14. Lopatin,Sergey; Shanmugasundram,Arulkumar; Lubomirsky,Dmitry; Pancham,Ian A., Method for forming CoWRe alloys by electroless deposition.

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15. Edelstein, Daniel C.; Kang, Sung Kwon; McGlashan-Powell, Maurice; O'Sullivan, Eugene J.; Walker, George F., Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped.

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16. Edelstein, Daniel C.; Kang, Sung Kwon; McGlashan-Powell, Maurice; O'Sullivan, Eugene J.; Walker, George F., Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped.

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17. Edelstein,Daniel C.; Kang,Sung Kwon; McGlashan Powell,Maurice; O'Sullivan,Eugene J.; Walker,George F., Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped.

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18. Wen Hua Hui, Ni-Fe-Co electroplating bath.

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19. Lubomirsky, Dmitry; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Kovarsky, Nicolay Y.; Wijekoon, Kapila, Process for electroless copper deposition.

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20. Weidman,Timothy W., Ruthenium containing layer deposition method.

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21. Tangi Abdallah,MAX ; Elhark Mohamed,MAX ; Bachir Ali Ben,MAX ; Shriri Abdallah,MAX ; Cherkaoui Mohamed,MAX ; Ebntouhami Mohamed,MAX ; Saaoudi El Mustapha,MAX, Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate.

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22. Tangi Abdallah,MAX ; Elhark Mohamed,MAX ; Ben Bachir Ali,MAX ; Srhiri Abdellah,MAX ; Cherkaoui Mohamed,MAX ; Ebntouhami Mohamed,MAX ; Saaoudi El Mustapha,MAX, Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate.

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