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One piece open and closable metal RF shield 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-009/00
출원번호 US-0417131 (1995-03-31)
발명자 / 주소
  • Gorenz
  • Jr. Harold J. (Lisle IL) Hasler Jeffery P. (Schaumburg IL) Mudra James R. (Cary IL) Schulz Gary D. (Cary IL)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 63  인용 특허 : 0

초록

An RF shield for use on tightly packed printed circuit boards has a normally-closed lid that can be opened to provide repair access to shielded components and then reclosed. The shield is a five-sided metal can having a top surface (12) with a lid defined on one edge by a fold line (20) and on the o

대표청구항

An R.F. shield comprising an enclosure defining an interior space in which electrical components to be shielded will reside, the enclosure being formed of metal of a first thickness and having an aperture therethrough for providing access to said interior space, said aperture being closable by a lid

이 특허를 인용한 특허 (63)

  1. Kurz, Arthur; Schneider, Michael; Barry, Bret, Aluminum EMI / RF shield.
  2. Ziberna,Frank J., Apparatus and method for shielding printed circuit boards.
  3. Toy,Wilson Wai; Yates,Christopher Paul; Krzeminski,Paul Allen; Tornoe,Robert N.; Davies,Edmund Thomas, Breach lock mechanism for seating vacuum electron device.
  4. Ruble ; III Robert Raymond, Carrier tape and method for washing of components in carrier tape.
  5. Davis, Terry W.; Son, Sun Jin, Conformal shield on punch QFN semiconductor package.
  6. Hayward C. Michael ; Rehlander Richard N., Connectors having a folded-path geometry for improved crosstalk and signal transmission characteristics.
  7. Doyle,Peter John; English,Gerald Robert; Zuehlsdorf,Allan Richard; Pirkhalo,Aleksey, Cover for an EMI shield assembly.
  8. Leal, Jeffrey S., EMI shield.
  9. Doyle,Peter John; English,Gerald Robert; Zuehlsdorf,Allan Richard; Pirkhalo,Aleksey, EMI shield assembly.
  10. Zuehlsdorf,Allan; Vinokur,Igor, EMI shields and related manufacturing methods.
  11. Spann Charles L. ; Lynch Michael J., Electro-magnetic interference shield for a telephone handset.
  12. Horng,Chin Fu, Electromagnetic interference shielding structure.
  13. Crotty, Jr.,Paul W., Electromagnetic interference shields and related manufacturing methods.
  14. Tan, Zheng-Ping; Chen, Kuan-Hung; Wang, Yao, Electromagnetic shielding device.
  15. Arnaud Flegeo FR, Electromagnetic shielding screen and circuit supporting substrate fitted out with such a screen.
  16. Anthony Michael Sosnowski, Electromagnetic shielding system for printed circuit board.
  17. Aguirre, Sergio Alfredo Mendoza; Inda, Carlos Gonzalez; Vera, Julio Cesar Ayala, Fastener, shield, and corresponding systems and methods.
  18. Doyle,Peter John; English,Gerald Robert; Zuehlsdorf,Allan Richard; Pirkhalo,Aleksey, Frame for an EMI shield assembly.
  19. Toy,Wilson Wai; Yates,Christopher Paul; Krzeminski,Paul Allen; Tornoe,Robert N.; Davies,Edmund Thomas, High voltage connection for vacuum electron device.
  20. Jang, Jae-gwon; Lee, Baik-woo; Kim, Young-jae, Magneto-resistive chip package including shielding structure.
  21. Hsu,Che Yuan; Yang,Yonk, Metal enclosure for portable electronic device.
  22. Sosnowski Anthony Michael, Method of shielding and obtaining access to a component on a printed circuit board.
  23. Liu, Hsin-Hung; Hsieh, Tsung-Lin, Mobile phone with metal hinged shield.
  24. Malek, Shayan; Myers, Scott A.; Wittenberg, Michael B., Molded EMI and thermal shield.
  25. Kurz, Arthur; Andrews, Mark; Schneider, Michael, Multi-piece shield.
  26. Kurz, Arthur; Andrews, Mark; Schneider, Michael, Multi-piece shield.
  27. Kurz, Arthur; Andrews, Mark; Schneider, Michael, One-piece board level shielding with peel-away feature.
  28. Koivusilta, Raimo, One-piece manufactured shielding casing for accommodating electronic functional elements.
  29. Kurz, Arthur A.; Dunn, Wayne R., One-piece shielding enclosure with selective interior access, and method and blank therefor.
  30. Seidler,Jack, Openable one-piece electrical RF shield and method of manufacturing the same.
  31. Yamaguchi,Shingo, Printing mechanism for wireless devices.
  32. Shlahtichman, Anatoliy; Vinokur, Igor; Shkarovsky, Igor; Pirkhalo, Vladislav, Push-fit shield.
  33. Hauk ; Jr. Karel, RF shield having removable cover.
  34. Toy,Wilson Wai; Yates,Christopher Paul; Krzeminski,Paul Allen; Tornoe,Robert N.; Davies,Edmund Thomas, Radio frequency isolation system and cover assembly for vacuum electron device.
  35. Honeycutt Robert M. ; Kossor Michael G. ; Witty Richard G., Radio frequency shield can cover with internal fingers.
  36. West, David Owen, Radio frequency shield for electronic equipment.
  37. Gallahan, Ron W.; Perry, Richard S.; Stewart, Michael; Gutierrez, Pedro A.; Hammon, Donald M., Reworkable RF shield.
  38. Han, Yi Seul; Lee, Tae Yong; Ryu, Ji Yeon, Semiconductor device and method of manufacturing thereof.
  39. Naval, Herbert delos Santos; Sur, Noel A.; Soriano, John A., Semiconductor device having EMI shielding and method therefor.
  40. Berry, Christopher J.; Scanlan, Christopher M., Semiconductor device having RF shielding and method therefor.
  41. Olson, Timothy L.; Scanlan, Christopher M.; Berry, Christopher J., Semiconductor device having RF shielding and method therefor.
  42. Jeon, Jun Ho; Seong, Kyeong Sool; Na, Seok Ho; Kim, Jeong Il; Kim, Young Kyu; Jeon, Sung Ho; Lim, Deok In; Hong, Sung Moo; Kim, Sung Jung; Ryu, Sung Han; Kang, Kyung Nam; Yoo, Seong Hak, Semiconductor device having conductive wire with increased attachment angle and method.
  43. Park, Sung Sun; Jun, Ik Su; Ahn, Ye Sul, Semiconductor device with electromagnetic interference shielding.
  44. Hartmann, Samuel; Guillon, David; Hajas, David; Thut, Markus, Semiconductor module with ultrasonically welded terminals.
  45. Chun, Jong Ok; Karim, Nozad; Chen, Richard; Selli, Giuseppe; Kelly, Michael, Shield lid interconnect package and method.
  46. Fuentes, Ruben; Miller, Jr., August Joseph, Shielded electronic component package and method.
  47. Foster, Donald Craig, Shielded package having shield fence.
  48. Foster, Donald Craig, Shielded package having shield lid.
  49. Foster, Donald Craig, Shielded package having shield lid.
  50. Foster, Donald Craig, Shielded package having shield lid.
  51. Ziberna, Frank J., Shielding arrangement for electronic device.
  52. Cao, Guang-Fei, Shielding assembly.
  53. Horng,Chin Hsing, Shielding cover.
  54. Lei, Gao-Bing, Shielding device with a replaceable top.
  55. Blersch, Werner, Shielding element for electric and/or electronic components of an electric and/or electronic circuit.
  56. St. Amand, Roger D.; Karim, Nozad O.; Longo, Joseph M.; Smith, Lee J.; Darveaux, Robert F.; Chun, Jong Ok; Mao, Jingkun, Shielding for a semiconductor package.
  57. Alvarez, Victor; Buttars, Scott K.; Vandervoort, Steven R.; He, Shijiang, Socket cover with heat flow for surface mount solder reflow.
  58. Fuentes, Ruben; Scanlan, Christopher; Chun, Jong, System and method for RF shielding of a semiconductor package.
  59. Bolognia, David; Kelly, Mike; Smith, Lee, System and method for compartmental shielding of stacked packages.
  60. Kelly, Michael G.; Cambas, John; Tan, Francis; Montero, Pam, System and method for lowering contact resistance of the radio frequency (RF) shield to ground.
  61. Scanlan, Christopher M., System and method for shielding of package on package (PoP) assemblies.
  62. Bolognia, David, System and method to reduce shorting of radio frequency (RF) shielding.
  63. Chun, Jong Ok; Karim, Nozad; Chen, Richard; Selli, Giuseppe; Kelly, Michael, Top feature package and method.
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