초록 ▼

A surface mountable integrated circuit and a method of manufacture are disclosed. A wafer 110 has a die with an integrated circuit 119 in one surface of the wafer. A via 130 extends to the opposite surface. The via has a sidewall oxide 131 and is filled with a conductive material such as metal or do

A surface mountable integrated circuit and a method of manufacture are disclosed. A wafer 110 has a die with an integrated circuit 119 in one surface of the wafer. A via 130 extends to the opposite surface. The via has a sidewall oxide 131 and is filled with a conductive material such as metal or doped polysilicon. The metal may comprise a barrier layer and an adhesion layer. The second end of the via can be fashioned as a prong 233 or a receptacle 430. Dies with vias can be stacked on top of each other or surface mounted to printed circuit boards or other substrate.

대표청구항 ▼

A method for fabricating surface mountable integrated circuits comprising the steps of: providing a wafer of semiconductor material with first and second surfaces and with integrated circuits formed on the first surface of said wafer; forming a via comprising a first open end on the first surface of

A method for fabricating surface mountable integrated circuits comprising the steps of: providing a wafer of semiconductor material with first and second surfaces and with integrated circuits formed on the first surface of said wafer; forming a via comprising a first open end on the first surface of the wafer, an elongated, open passage extending from said open end a controlled depth into the wafer and toward said second surface of said wafer and terminating at a second end closed by said semiconductor material, said via having an interior surface defined by said semiconductor material; depositing a conductive material in the via over the interior surface and the closed end of the via; removing semiconductor material from the second surface of said wafer to expose the conductive material over the via interior surface.