$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatus for dissipating heat in a hinged computing device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0683022 (1996-07-15)
발명자 / 주소
  • Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ)
출원인 / 주소
  • Intel Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 75  인용 특허 : 11

초록

A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allo

대표청구항

A heat transfer apparatus providing thermal coupling between an electronic component in a first member having a first edge and a second member rotatably attached to the first member allowing pivotal motion along an axis substantially parallel to the first edge, comprising: a heat conductive mounting

이 특허에 인용된 특허 (11)

  1. Dolbear Thomas P. (Austin TX) Nelson Richard D. (Austin TX) Gibson David A. (Austin TX) Gupta Omkarnath R. (Fremont CA), Coiled spring heat transfer element.
  2. Tat-Kee Chan (Kowloon HKX), Data processor flush hinge assembly.
  3. Swindler Dan (Austin TX), Heat sink/component access door for portable computers.
  4. Cullimore Brent A. (49 Dawn Heath Cir. Littleton CO 80127), Heat transfer system having a flexible deployable condenser tube.
  5. Griffin Wayne L. (St. Joseph MI) Fuhs Eric D. (Stevensville MI) Kohtz Robert A. (St. Joseph MI) Ojeda Peter A. (St. Joseph MI), Heat-exchange panel for portable computer.
  6. Ohgami Keizo (Tokyo) Hosoi Takashi (Tokyo JPX), Hinge device for coupling rotatable member to another member.
  7. Holmberg ; Jr. Arthur (Cypress CA) Wilson David E. (Huntington Beach CA), Low torque hinged heat transfer joint.
  8. Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX), Packaging structure of small-sized computer.
  9. Kirchner ; Richard K. ; Andreadakis ; Nicholas Cleanthis ; Mayer ; Wil liam Norman, Portable keyboard/display terminal.
  10. LaPointe Brion (Sunnyvale CA) Northway David (Palo Alto CA) Riccomini Robert (Saratoga CA) Weber Ken (San Jose CA) Wood Jeff (Sunnyvale CA), Structural frame for portable computer.
  11. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.

이 특허를 인용한 특허 (75)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
  2. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
  3. Robert L. McMahan ; Damon W. Broder, Apparatus and method for cooling a heat generating component in a computer.
  4. Bhatia, Rakesh, Apparatus for cooling a heat dissipating device located within a portable computer.
  5. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
  6. Borkar Shekhar Yeshwant ; Dreyer Robert S. ; Mulder Hans J., Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply.
  7. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  8. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  9. Sagal, E. Mikhail, Capacitor post with improved thermal conductivity.
  10. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  11. Cipolla Thomas Mario ; Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Mok Lawrence Shungwei ; Wong Tin-Lup, Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity.
  12. Teraki, Junichi; Oguri, Akihiko; Kita, Masanobu, Cooler, electrical component unit, and refrigeration apparatus.
  13. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
  14. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  15. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  16. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  17. Wang, Hwai-Ming; Chiang, Wei-Chieh; Liu, Hsien-Tsang, Cooling system for hinged portable computing device.
  18. Haley Kevin ; O'Connor Michael ; Bhatia Rakesh, Cooling system for integrated circuit chips in a portable computer.
  19. Haley Kevin ; O'Connor Michael ; Bhatia Rakesh, Cooling system for integrated circuit chips in a portable computer lid assembly.
  20. Ito Susumu,JPX ; Tanahashi Makoto,JPX ; Goto Teiyu,JPX ; Asawa Tsutomu,JPX, Electronic device and electronic device battery.
  21. MacDonald, Mark; Nishi, Yoshifumi Yoshi, Electronic device having a passive heat exchange device.
  22. Nishi, Yoshifumi; MacDonald, Mark, Electronic device having passive cooling.
  23. Nishi, Yoshifumi; MacDonald, Mark; Heymann, Douglas, Electronic device having passive cooling.
  24. Tanahashi Makoto,JPX ; Asawa Tsutomu,JPX ; Ichikawa Mitsuru,JPX, Electronic device with improved heat dissipation.
  25. Shigeo Ohashi JP; Takashi Naganawa JP; Tadakatsu Nakajima JP; Tsuyoshi Nakagawa JP; Masaaki Eishima JP; Yoshihiro Kondo JP, Electronic equipment.
  26. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.
  27. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
  28. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  29. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  30. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  31. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  32. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  33. Hsu Richard T., Heat dissipation system for a laptop computer using a heat pipe.
  34. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
  35. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.
  36. Bhatia Rakesh, Heat exchanger system for cooling a hinged computing device.
  37. Cipolla Thomas Mario, Heat pipe arrangement for enhancing the cooling capacity of a laptop computer.
  38. Bhatia Rakesh ; Haley Kevin, Heat pipe exchanger system for cooling a hinged computing device.
  39. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  40. Shou Yong Kung,TWX ; Chiang Feng-Yu,TWX, Heat transfer device.
  41. Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Heat transfer in electronic apparatus.
  42. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
  43. Miller, James D.; Sagal, E. Mikhail; McCullough, Kevin A., Highly thermally conductive electronic connector.
  44. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
  45. Cipolla Thomas Mario ; Coteus Paul William ; Mok Lawrence Shungwei, Hinge incorporating a helically coiled heat pipe for a laptop computer.
  46. Zocchi, Michael R., Integrated lancet and blood glucose meter system.
  47. Bhatia Rakesh, Keyboard having an integral heat pipe.
  48. Borkar Shekhar Yeshwant ; Dreyer Robert S. ; Mulder Hans ; Obinata Naomi ; Wells Calvin E., Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling.
  49. Shekhar Yeshwant Borkar ; Robert S. Dreyer ; Hans J. Mulder, Method and apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply.
  50. Sagal, E. Mikhail, Method of making a capacitor post with improved thermal conductivity.
  51. McCullough, Kevin A., Method of manufacturing a structural frame.
  52. Noble,Scott; Lee,Seri, Method, apparatus and system for enclosure enhancement.
  53. Ali, Ihab A., Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies.
  54. Miller,James D.; Sagal,E. Mikhail; McCullough,Kevin A., Molded electronic connector formed from a thermally conductive polymer composition and method of making the same.
  55. Moore David A., Molded heat exchanger structure for portable computer.
  56. Ishida Yoshio,JPX, Movably mounted heat receiving plate.
  57. Kobayashi Takashi,JPX ; Nonaka Takashi,JPX ; Sumi Noriaki,JPX ; Nakaoka Kunio,JPX, Notebook computer storage case.
  58. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  59. Cipolla Thomas Mario ; Mok Lawrence Shungwei, Portable computer rotational heat pipe heat transfer.
  60. Progl Curtis L. ; Zhang Allen P., Portable computer with flexible heat spreader plate structure therein.
  61. Holung Joseph Anthony ; Wong Tin-Lup ; Kamath Vinod, Quick-release hinge joint for heat pipe.
  62. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  63. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  64. Mok Lawrence Shungwei, Rotational joint for hinged heat pipe cooling of a computer.
  65. Zocchi,Michael R., Sensor array.
  66. Rossi,Thomas M.; Pokharna,Himanshu, System to improve display efficiency based on recycling local heat source.
  67. Crooijmans, Wilhelmus; Een, Joshua, Thermal conductors in electronic devices.
  68. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  69. Janak G. Patel, Thermal transfer hinge for hinged mobile computing device and method of heat transfer.
  70. Kevin A. McCullough ; E. Mikhail Sagal ; James D. Miller, Thermally conductive electronic device case.
  71. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient computer incorporating deploying CPU module.
  72. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  73. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.
  74. Tuma, Phillip E., Variable position cooling apparatus.
  75. Tao Chian,TWX ; Chang Eric,TWX ; Lin Chia-Jui,TWX, Winding chain dissipating unit suitable for electronic device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로