이 특허를 인용한 특허 (50) 인용/피인용 타임라인 분석

1. Tanida, Katsunori, Apparatus for manufacturing semiconductor device.

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2. Andrade,Thomas L., Capacitive sensor system with improved capacitance measuring sensitivity.

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3. Mutz, Dieter; Waible, Hans-Peter, Casting mold for producing an optical semiconductor module.

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4. Park, Sung Sun; Jun, Ik Su; Lee, Do Won, Concentrated photovoltaic receiver module with improved optical light guide assembly.

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5. Pycroft, Garry, Concentrated photovoltaic receiver package with built-in connector.

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6. Nickelsen, Jr., John M.; Sung, Pil Je; Pycroft, Garry, Concentrated photovoltaic receiver package with stacked internal support features.

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7. Selli, Giuseppe; DeVita, Michael; Kuo, Bob Shih-Wei, Conductive paste and mold for electrical connection of photovoltaic die to substrate.

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8. Chiu, Anthony M.; Siegel, Harry Michael, Embedded flat film molding.

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9. Chiu,Anthony M.; Siegel,Harry Michael, Embedded flat film molding.

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10. Fisher, Edward C.; Latham, Lawrence T., Encapsulation for particle entrapment.

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11. Fisher,Edward C.; Latham,Lawrence T., Encapsulation for particle entrapment.

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12. Fisher,Edward C.; Latham,Lawrence T., Encapsulation for particle entrapment.

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13. Okada,Akira; Sakoda,Hideharu; Hayakawa,Michio; Taniguchi,Fumihiko, Fingerprint sensor apparatus and manufacturing method thereof.

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14. Kuo, Bob Shih-Wei; Park, SungSun, Frame interconnect for concentrated photovoltaic module.

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15. Salatino Matthew M. ; Studebaker S. James ; VanVonno Nicolaas W., Integrated circuit device having an opening exposing the integrated circuit die and related methods.

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16. Salatino, Matthew M.; Weber, Patrick O., Integrated circuit package including opening exposing portion of an IC.

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17. Schuurmans, Johan; Betts, William R.; Diels, Roger; Hill, Adrian, Integrated sensor packages and methods of making the same.

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18. Schuurmans, Johan; Betts, William R.; Diels, Roger; Hill, Adrian, Integrated sensor packages and methods of making the same.

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19. Kuo, Bob Shih Wei; Nickelsen, Jr., John Merrill; Olson, Timothy L., Leadframe structure for concentrated photovoltaic receiver package.

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20. Ziglioli, Federico Giovanni; Shaw, Mark Andrew, Manufacturing method of an electronic device including overmolded MEMS devices.

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21. Magni, Pierangelo; Cigada, Andrea, Manufacturing method of an electronic device package.

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22. Magni,Pierangelo; Cigada,Andrea, Manufacturing method of an electronic device package.

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23. Brand,Joseph M., Method and apparatus for removing encapsulating material from a packaged microelectronic device.

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24. Brand,Joseph M., Method and apparatus for removing encapsulating material from a packaged microelectronic device.

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25. Raben,Jurgen Leonardus Theodorus Maria, Method for encapsulating a chip and/or other article.

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26. Manfred Brandl AT, Method for housing sensors in a package.

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27. Uchida, Kenji; Hirasawa, Koki, Method of manufacturing semiconductor device in which functional portion of element is exposed.

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28. Hundt, Michael J.; Zhou, Tiao, Method of packaging integrated circuits.

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29. Salatino,Matthew M.; Weber,Patrick O., Methods and apparatus for making integrated circuit package including opening exposing portion of the IC.

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30. Zhao, Sam Ziqun; Khan, Rezaur Rahman, Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader.

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31. Simion, Bogdan M., Mold chase for integrated circuit package assembly and associated techniques and configurations.

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32. Hundt, Michael J.; Zhou, Tiao, Mold with compensating base.

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33. Zhou,Tiao; Hundt,Michael J., Molded integrated circuit package with exposed active area.

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34. Zhou,Tiao; Hundt,Michael J., Molded integrated circuit package with exposed active area.

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35. Kuo, Bob Shih-Wei, Molded light guide for concentrated photovoltaic receiver module.

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36. Muraki, Shinji, Molding apparatus for manufacturing a semiconductor device and method using the same.

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37. Muraki, Shinji, Molding apparatus for manufacturing semiconductor device.

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38. Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Li Yun, Open-cavity semiconductor die package.

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39. Crane, Jr., Sanford W.; Krishnapura, Lakshminarasimha; Li, Yun, Open-cavity semiconductor die package.

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40. Stanford W. Crane, Jr. ; Lakshminarasimha Krishnapura ; Yun Li, Open-cavity semiconductor die package.

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41. De Pauw, Piet, Optical data transceivers.

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42. Koike,Masahiro; Narita,Hirochika, Resin molded semiconductor device and mold.

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43. Do, Byung Tai; Trasporto, Arnel; Chua, Linda Pei Ee; Yusof, Asri, Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package.

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44. Kolleth, Tobias; Stumpf, Pascal; Joos, Christian, Semiconductor housing and method for the production of a semiconductor housing.

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45. Andrade,Thomas L., Surface capacitance sensor system using buried stimulus electrode.

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46. Chiu, Anthony M., Surface mount package for linear array sensors.

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47. Hembree, David R.; Akram, Salman; Farnworth, Warren M.; Wood, Alan G.; Gochnour, Derek; Jacobson, John O.; Wark, James M.; Ahmad, Syed Sajid, Test carrier with molded interconnect for testing semiconductor components.

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48. Hembree, David R.; Akram, Salman; Farnworth, Warren M.; Wood, Alan G.; Gochnour, Derek; Jacobson, John O.; Wark, James M.; Ahmad, Syed Sajid, Test carrier with molded interconnect for testing semiconductor components.

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49. Pycroft, Garry; Kuo, Bob-Shih Wei; Reed, Frederick, Through wafer via structures for concentrated photovoltaic cells.

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50. Schuurmans,Johan, Tire pressure sensors and methods of making the same.

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