초록 ▼

A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip ther

A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.

대표청구항 ▼

A semiconductor device, comprising: a substrate having upper and lower major surfaces; solder bumps provided on said lower major surface of said substrate; a semiconductor chip provided on said upper major surface of said substrate; a resin package body provided on said upper major surface of said s

A semiconductor device, comprising: a substrate having upper and lower major surfaces; solder bumps provided on said lower major surface of said substrate; a semiconductor chip provided on said upper major surface of said substrate; a resin package body provided on said upper major surface of said substrate so as to bury said semiconductor chip therein, said resin package body having an upper major surface and side walls surrounding said package body; a thermally conductive frame member having a thermal conductivity substantially greater than that of said resin package body and extending along to and in an intimate contact with said side walls of said resin package body thereby leaving the upper major surface of said resin package body exposed to the air; said thermally conductive frame having a flange part supporting said substrate thereon at a rim part of said substrate.