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Apparatus for non-conductively interconnecting integrated circuits using half capacitors 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/02
  • H05K-001/16
출원번호 US-0265607 (1994-06-24)
발명자 / 주소
  • Knight Thomas F. (Belmont MA) Salzman David B. (Washington DC)
출원인 / 주소
  • Polychip, Inc. (Bethesda MD 02)
인용정보 피인용 횟수 : 201  인용 특허 : 0

초록 ▼

A method and apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/repa

대표청구항 ▼

An apparatus for interconnecting electronic circuits comprising: a lower substrate having substantially planar lower and upper surfaces, said upper surface having a plurality of half-capacitors and a plurality of lines connected to said half-capacitors; an upper substrate having a substantially plan

이 특허를 인용한 특허 (201)

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