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Method for the polishing and finishing of optical lenses 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
  • B24B-007/19
  • B24B-007/30
출원번호 US-0695511 (1996-08-12)
발명자 / 주소
  • Lindholm Gene O. (River Falls WI) Follensbee Robert A. (Cottage Grove MN)
출원인 / 주소
  • Minnesota Mining and Manufacturing Company (St. Paul MN 02)
인용정보 피인용 횟수 : 35  인용 특허 : 79

초록

A method for polishing an optical quality surface, such an ophthalmic lens, to finish which can accept a hardenable protective coating without using an abrasive slurry or gel, including the steps of: (a) providing an optical lens having a first major surface, the first major surface having an initia

대표청구항

A method for polishing an optical quality surface comprising the step of: providing an optical quality surface having a first major surface, said first major surface having an initial Rtm value of greater than 0.35 micrometers; bringing said first major surface into a frictional contacting relations

이 특허에 인용된 특허 (79)

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  50. Rouser Forrest J. (San Rafael CA) Erwin Robert L. (Rohnert Park CA), Method of attaching articles and a pair of articles fastened by the method.
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  55. Pannbacker Helmut (Hemmingen DEX), Motor vehicle brake antilocking system.
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  60. Leitheiser Melvin A. (Stillwater MN) Sowman Harold G. (Maplewood MN), Non-fused aluminum oxide-based abrasive mineral.
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  68. Dejaiffe Robert (Oak Ridge NJ), Reflective particles.
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  71. Martens John A. (White Bear Lake MN), Shaped plastic articles having replicated microstructure surfaces.
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  73. Zador Eugene (Ballston Lake NY) Hsu Shyiguei (Watervliet NY) Kaczmarek Wesley R. (Ballston Lake NY) Ravipati Sitaramaiah (Latham NY) Supkis Stanley (Averill Park NY) Vogel Richard H. (Saratoga Spring, Single step, radiation curable ophthalmic fining pad.
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이 특허를 인용한 특허 (35)

  1. Fletcher,Timothy D.; Lugg,Paul S.; Romero,Vincent D., Abrasive agglomerate polishing method.
  2. Mujumdar,Ashutosh N.; Christianson,Todd J.; Schwabel,Mark G., Abrasive article and methods for grinding glass.
  3. Woo Edward J., Abrasive article comprising a barrier coating.
  4. Brain D. Goers ; Scott W. Peterson ; Edward J. Woo, Abrasive article suitable for abrading glass and glass ceramic workpieces.
  5. Goers, Brian D.; Peterson, Scott W.; Woo, Edward J., Abrasive article suitable for abrading glass and glass ceramic workpieces.
  6. Manning, James J.; Sternberg, Mark E.; Wang, Jianna, Abrasive products and methods for fine polishing of ophthalmic lenses.
  7. Manning, James J.; Wang, Jianna; Herbert, Charles G.; Rice, William C.; Seth, Anuj, Abrasive products and methods for finishing coated surfaces.
  8. Manning, James J.; Sternberg, Mark E.; Wang, Jianna, Abrasive products and methods for finishing hard surfaces.
  9. Manning, James J.; Sternberg, Mark E.; Wang, Jianna, Abrasive products and methods for finishing hard surfaces.
  10. Cai, Ying; Manning, James J.; Wang, Jianna, Abrasive products and methods for finishing surfaces.
  11. Goulet, Michael; Dooley, Jonathan M., Apparatus for finishing optical surfaces, including a pad compensation device.
  12. Kendall, Philip E.; Park, Soon C.; Bruxvoort, Wesley J.; Culler, Scott R.; Williams, Jerry W., Dual cured abrasive articles.
  13. Kinisky Thomas G. ; Swei Gwo Shin ; Arvidson ; Jr. Dean B. ; Laconto ; Sr. Ronald W. ; Schlair Rami, Fixed abrasives for optical polishing.
  14. Kuta,Terry Mitchell, Headlight lens resurfacing apparatus and method.
  15. Thiessen Jeffrey S., Magnetic head and tape path cleaning tape.
  16. Woo,Edward J.; Bange,Donna W.; Lamphere,Craig F., Method of abrading a workpiece.
  17. Sventek, Bruce A.; Lamphere, Craig F.; Graf, Timothy L.; Barry, John L., Method of cleaning glass.
  18. Ono,Koichi; Shimomura,Tetsuo; Nakamori,Masahiko; Yamada,Takatoshi; Komai,Shigeru; Tsutsumi,Masayuki, Method of producing polishing pad.
  19. Laconto ; Sr. Ronald W. ; Schlair Rami, Optical polishing formulation.
  20. Sutton, Stephen P.; Sutton, William T., Optical polishing pitch formulations.
  21. Sutton, Stephen P.; Sutton, William T., Optical polishing pitch formulations.
  22. Vangsness, Jean; Hsu, Oscar Kai Chi; Potnis, Alaka, Polishing pad.
  23. Vangsness,Jean; Hsu,Oscar Kai Chi; Potnis,Alaka, Polishing pad.
  24. Ono, Koichi; Shimomura, Tetsuo; Nakamori, Masahiko; Yamada, Takatoshi; Komai, Shigeru; Tsutsumi, Masayuki, Polishing pad and cushion layer for polishing pad.
  25. Ono, Koichi; Shimomura, Tetsuo; Nakamori, Masahiko; Yamada, Takatoshi; Komai, Shigeru; Tsutsumi, Masayuki, Polishing pad and cushion layer for polishing pad.
  26. Cherian, Isaac K.; Anjur, Sriram P.; Grumbine, Steven K., Polishing pad comprising particles with a solid core and polymeric shell.
  27. Anjur Sriram P. ; Downing William C., Polishing pad for a semiconductor substrate.
  28. Ono,Koichi; Shimomura,Tetsuo; Nakamori,Masahiko; Yamada,Takatoshi; Komai,Shigeru; Tsutsumi,Masayuki, Polishing pad, method of producing the same, and cushion layer for polishing pad.
  29. Hsu, Oscar K.; Vangsness, Jean K.; Billings, Scott C.; Gilbride, David S., Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles.
  30. Hsu, Oscar K.; Vangsness, Jean K.; Billings, Scott C.; Gilbride, David S., Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles.
  31. Fletcher,Timothy D.; Lugg,Paul S.; Romero,Vincent D., Self-contained conditioning abrasive article.
  32. Carlson, David W., Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates.
  33. Carlson, David W., Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates.
  34. Carlson, David W., Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates.
  35. Carlson,David W., Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates.
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