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A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding

A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360°for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.

대표청구항 ▼

An electrode forming apparatus for chip components for forming external electrodes on projected portions of chip components held by a holding plate, said apparatus comprising: a dipping machine provided with a dipping vessel having a horizontal bottom surface capable of being coated with a thin film

An electrode forming apparatus for chip components for forming external electrodes on projected portions of chip components held by a holding plate, said apparatus comprising: a dipping machine provided with a dipping vessel having a horizontal bottom surface capable of being coated with a thin film of electrode paste, and a chucking portion arranged above said dipping vessel for horizontally engaging a holding plate which is structured and arranged to hold a plurality of chip components having projected portions downwardly directed toward said dipping vessel and for vertically moving said holding plate downward into said dipping vessel to apply electrode paste, when present on said bottom surface of said dipping vessel, to said downwardly projected portions of said chip components to form electrode surfaces on said projected portions; a drying furnace for receiving said holding plate with the electrode surfaces of said chip components directed downward and for continuously heating and drying said electrode surfaces of said chip components held by said holding plate, said drying furnace having an inlet through which said holding plate can pass into said furnace and an outlet through which said holding plate can pass out of said furnace; and a conveyor for horizontally transferring said holding plate and said chip components from said dipping machine to said drying furnace, for carrying said holding plate into said drying furnace along a carrying-in path, and for carrying said holding plate out of said drying furnace along a carrying-out path, said carrying-in path and said carrying-out path both being located on a same side of said drying furnace; said drying furnace comprising a rotor for supporting a plurality of holding plates and being intermittently rotated, a heater for heating and drying said electrode surfaces of said chip components held by said holding plates, and an introduction and extraction device for introducing said holding plates one by one into said rotor, and for extracting said holding plates one by one from said rotor; wherein said rotor is constructed so as to support and rotate said plurality of holding plates through a 360°rotation.