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Method of making a semiconductor device having a silicide local interconnect 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/28
출원번호 US-0527893 (1995-09-14)
우선권정보 JP-0211279 (1993-08-26); JP-0078977 (1995-04-04)
발명자 / 주소
  • Hayashi Hiromi (Kawasaki JPX) Fushida Atsuo (Kawasaki JPX) Izawa Tetsuo (Kawasaki JPX) Katsube Masaki (Kawasaki JPX) Yamazaki Tatsuya (Kawasaki JPX)
출원인 / 주소
  • Fujitsu Limited (Kawasaki JPX 03)
인용정보 피인용 횟수 : 46  인용 특허 : 0

초록

On a semiconductor substrate with an exposed silicon region, a metal layer such as Co is deposited and a silicide layer is formed by heat treatment. Thereafter, a metal layer such as Ni and a silicon layer are deposited, and one of them is patterned. The metal layer and silicon layer are heated for

대표청구항

A method of manufacturing a semiconductor device comprising the steps of: forming a locally oxidized field oxide film by selectively oxidizing the surface of a silicon semiconductor substrate and defining a silicon surface surrounded at least partially by a locally oxidized field oxide film; deposit

이 특허를 인용한 특허 (46)

  1. Lee, Whonchee; Hu, Yongjun Jeff, Composition for selectively etching against cobalt silicide.
  2. Jung Jong Wan,KRX, Forming a silicide in predetermined areas of a semiconductor device.
  3. Michael Mark W. ; Dawson Robert ; Fulford ; Jr. H. Jim ; Gardner Mark I. ; Hause Frederick N. ; Moore Bradley T. ; Wristers Derick J., Integrated circuit having an interlevel interconnect coupled to a source/drain region(s) with source/drain region(s) boundary overlap and reduced parasitic capacitance.
  4. Kim Sung-bong,KRX ; Kim Kyeong-tae,KRX, Integrated circuits including metal silicide contacts extending between a gate electrode and a source/drain region.
  5. Cantell Marc W. ; Lasky Jerome B. ; Line Ronald J. ; Murphy William J. ; Peterson Kirk D. ; Tiwari Prabhat, Integrated cobalt silicide process for semiconductor devices.
  6. Cantell, Marc W.; Lasky, Jerome B.; Line, Ronald J.; Murphy, William J.; Peterson, Kirk D.; Tiwari, Prabhat, Integrated cobalt silicide process for semiconductor devices.
  7. Mantl Siegfried,DEX, Layered structure with a silicide layer and process for producing such a layered structure.
  8. Ahn,Byung Chul; Lim,Byung Ho; Yoo,Soon Sung; Kim,Yong Wan; Ha,Young Hun, Liquid crystal display device having particular connections among drain and pixel electrodes and contact hole.
  9. En William G. ; Chan Darin A. ; Foote David K. ; Wang Fei ; Ngo Minh Van, Local interconnects for improved alignment tolerance and size reduction.
  10. Jun Young Kwon,KRX, Metal wire of semiconductor device and method for forming the same.
  11. Lee Whonchee ; Hu Yongjun Jeff, Method and composition for selectively etching against cobalt silicide.
  12. Lee, Whonchee; Hu, Yongjun Jeff, Method and composition for selectively etching against cobalt silicide.
  13. Lee, Whonchee; Hu, Yongjun Jeff, Method and composition for selectively etching against cobalt silicide.
  14. Lee,Whonchee; Hu,Yongjun Jeff, Method and composition for selectively etching against cobalt silicide.
  15. En William George ; Mehta Sunil ; Wang Fei ; Logie Stewart Gordon, Method and system for providing electrical insulation for local interconnect in a logic circuit.
  16. Murphy William J. ; Tiwari Prabhat, Method for depositing cobalt.
  17. Fang,Sunfei; Cabral, Jr.,Cyril; Dziobkowski,Chester T.; Ellis Monaghan,John J.; Lavoie,Christian; Luo,Zhijiong; Nakos,James S.; Steegen,An L.; Wann,Clement H., Method for forming self-aligned dual salicide in CMOS technologies.
  18. Yongjun Hu, Method for making a low resistivity electrode having a near noble metal.
  19. Hsu Sheng Teng, Method for manufacturing a CMOS self-aligned strapped interconnection.
  20. O'Brien Sean C., Method of fabricating self-aligned silicide.
  21. Nishihara, Shinji; Ikeda, Shuji; Hashimoto, Naotaka; Momiji, Hiroshi; Abe, Hiromi; Fukada, Shinichi; Suzuki, Masayuki, Method of fabricating semiconductor integrated circuit device.
  22. Nishihara, Shinji; Ikeda, Shuji; Hashimoto, Naotaka; Momiji, Hiroshi; Abe, Hiromi; Fukada, Shinichi; Suzuki, Masayuki, Method of fabricating semiconductor integrated circuit device.
  23. Nishihara, Shinji; Ikeda, Shuji; Hashimoto, Naotaka; Momiji, Hiroshi; Abe, Hiromi; Fukada, Shinichi; Suzuki, Masayuki, Method of fabricating semiconductor integrated circuit device.
  24. Nishihara,Shinji; Ikeda,Shuji; Hashimoto,Naotaka; Momiji,Hiroshi; Abe,Hiromi; Fukada,Shinichi; Suzuki,Masayuki, Method of fabricating semiconductor integrated circuit device.
  25. Nishihara,Shinji; Ikeda,Shuji; Hashimoto,Naotaka; Momiji,Hiroshi; Abe,Hiromi; Fukada,Shinichi; Suzuki,Masayuki, Method of fabricating semiconductor integrated circuit device with 99.99 wt% cobalt.
  26. Liang Kuei-Chang,TWX ; Yang Yu-Hao,TWX, Method of forming local interconnection of a static random access memory.
  27. Hause Fred N. ; Dawson Robert ; May Charles E., Method of forming uniform sheet resistivity salicide.
  28. Lin Xi-Wei, Method of improving process robustness of nickel salicide in semiconductors.
  29. Uno,Shouochi; Maekawa,Atsushi; Yunogami,Takashi; Tago,Kazutami; Nojiri,Kazuo; Machida,Shuntaro; Tokunaga,Takafumi, Method of manufacture of semiconductor integrated circuit.
  30. Hashimoto Koichi,JPX ; Hayashi Hiromi,JPX, Method of manufacturing a semiconductor device with local interconnect of metal silicide.
  31. Matsubara Yoshihisa,JPX, Method of manufacturing semiconductor device.
  32. Abbott, Todd; Tirvedi, Jigish D.; Violette, Mike; Dennison, Chuck, Method of selectively forming local interconnects using design rules.
  33. Abbott, Todd; Trivedi, Jigish D.; Violette, Mike; Dennison, Chuck, Method of selectively forming local interconnects using design rules.
  34. Abbott, Todd; Trivedi, Jigish D.; Violette, Mike; Dennison, Chuck, Method of selectively forming local interconnects using design rules.
  35. William G. En ; Darin A. Chan ; David K. Foote ; Fei Wang ; Minh Van Ngo, Methods and arrangements for insulating local interconnects for improved alignment tolerance and size reduction.
  36. Kim Sung-bong,KRX ; Kim Kyeong-tae,KRX, Methods of fabricating integrated circuits including metal silicide contacts extending between a gate electrode and a source/drain region.
  37. Breil, Nicolas L.; Makela, Neal A.; Adusumilli, Praneet; Ferrer, Domingo A., Multiple step thin film deposition method for high conformality.
  38. Liu Wei-Hua ; Burnett David ; Swift Craig, Process for forming a semiconductor device having a conductive member that protects field isolation during etching.
  39. Nishihara, Shinji; Ikeda, Shuji; Hashimoto, Naotaka; Momiji, Hiroshi; Abe, Hiromi; Fukada, Shinichi; Suzuki, Masayuki, Process for producing semiconductor integrated circuit device.
  40. Breitwisch, Matthew J.; Brown, Jeffrey S.; Hook, Terence B.; Mann, Randy W.; Putnam, Christopher S.; Younus, Mohammad I., Selective silicide blocking.
  41. Breitwisch, Matthew J.; Brown, Jeffrey S.; Hook, Terence B.; Mann, Randy W.; Putnam, Christopher S.; Younus, Mohammad I., Selective silicide blocking.
  42. Asamura, Takeshi, Semiconductor device and method of making thereof.
  43. Hashimoto Koichi,JPX ; Hayashi Hiromi,JPX, Semiconductor device with local interconnect of metal silicide.
  44. Huang Jenn Ming,TWX, Silicide and salicide on the same chip.
  45. Ostermayr, Martin; Sarma, Chandrasekhar, Transistor level routing.
  46. Ostermayr, Martin; Sarma, Chandraserhar, Transistor level routing.
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