초록 ▼

A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard stora

A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated enviroment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.

대표청구항 ▼

A method of transferring a substrate in a substrate processing apparatus including a processing chamber, a primary substrate storage, and a secondary substrate storage, the method comprising the steps of: (a) providing a substrate transfer mechanism having a mechanical arm, a generally flat substrat

A method of transferring a substrate in a substrate processing apparatus including a processing chamber, a primary substrate storage, and a secondary substrate storage, the method comprising the steps of: (a) providing a substrate transfer mechanism having a mechanical arm, a generally flat substrate carrying blade at the leading end of the mechanical arm, and a substrate supporting tray; (b) engaging the undersurface of a substrate in said primary substrate storage with said blade; (c) transferring the engaged substrate from said primary substrate storage to said secondary substrate storage by means of said substrate transfer mechanism; (d) mounting said tray onto said blade; (e) engaging the undersurface of a substrate located in said secondary storage with said tray mounted on said blade; and (f) transferring the substrate, having its undersurface engaged by said tray, from said secondary storage to said chamber by means of said substrate transfer mechanism.