초록 ▼

Method and device for molding integrated circuit packages using dambarless lead frames are disclosed. The mold dies and the lead frame have means for preventing resin leakage out of the mold dies during the package molding step. The leakage preventing means may comprise a tape put on the leads, an e

Method and device for molding integrated circuit packages using dambarless lead frames are disclosed. The mold dies and the lead frame have means for preventing resin leakage out of the mold dies during the package molding step. The leakage preventing means may comprise a tape put on the leads, an enlarged area sections provided on each lead and notches formed on each lead. The leakage preventing means may comprise projections formed on a lead pressing frame of one of the mold dies. In another embodiment, an auxiliary lead frame, which has a plurality of rectangular openings and will be fixed to a bottom mold die, is used as the resin leakage preventing means. When using the auxiliary lead frame, the dambarless lead frame is laid on the auxiliary lead frame and clamped by a top mold die. The enlarged area sections may be formed on the inner leads exclusively or on both the inner and outer leads.

대표청구항 ▼

A method of molding an integrated circuit package including an integrated circuit chip comprising the steps of: a) providing a dambarless lead frame having inner leads and outer leads with an enlarged area section on each inner lead at a position where the inner leads extend outside a package molded

A method of molding an integrated circuit package including an integrated circuit chip comprising the steps of: a) providing a dambarless lead frame having inner leads and outer leads with an enlarged area section on each inner lead at a position where the inner leads extend outside a package molded part of the lead frame; b) bonding an IC chip to said lead frame; c) bonding bond wires to inner leads of said lead frame from the chip; d) providing a bottom mold die and a top mold die, said dies having peripheral surfaces forming an interior die cavity, at least one of said peripheral surfaces including a plurality of spaced projections; e) placing a tape on at least one of the top and bottom surfaces of said enlarged area sections at a position aligned with said peripheral surfaces for reducing resin leaking during molding and for binding the inner leads together; f) placing the dambarless lead frame between the dies, said lead frame having a thickness substantially equal to the height of the plurality of projections on said peripheral surfaces, each outer lead having a width substantially equal to a spacing between adjacent ones of said plurality of projections and a thickness substantially equal to a height of said plurality of projections; g) clamping the lead frame between said dies, with the plurality of projections fitting between every two adjacent ones of said outer leads to prevent leakage of molding resin from the die cavity; and h) injecting a molding resin into the die cavity such that the molding resin is substantially prevented from leaking out from the mold dies.