초록 ▼

An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of c

An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric device. By disposing an integrated circuit chip on the second plate and evaluating the chamber, the integrated circuit chip may be cooled to a sub-ambient temperature without internal or external condensation.

대표청구항 ▼

A package for enclosing an integrated circuit chip, comprising: a multiple stage thermoelectric device including a first plate, a second plate and a third plate thermally connected to one another by a first plurality and a second plurality of conducting elements; and a package substrate having a cav

A package for enclosing an integrated circuit chip, comprising: a multiple stage thermoelectric device including a first plate, a second plate and a third plate thermally connected to one another by a first plurality and a second plurality of conducting elements; and a package substrate having a cavity defined therein, the package substrate for attaching to the first plate such that a hermetically sealed chamber is formed, wherein the first plate forms a top wall of the chamber and the second plate is disposed within the chamber apart from the package substrate for receiving the integrated circuit chip, further wherein the third plate is disposed between the first and second plates and apart from the package substrate such that the first plurality of conducting elements is connected between the first plate and the third plate and the second plurality of conductive elements is connected between the second plate and the third plate wherein the integrated circuit chip is thermally coupled to the second plate, the second plate cooling the integrated circuit chip to a sub-ambient temperature in response to an externally supplied current applied to the first plate.