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특허 상세정보

Sub-ambient temperature electronic package

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/34    H01L-023/38   
미국특허분류(USC) 257/712 ; 257/930 ; 361/704 ; 361/717
출원번호 US-0426286 (1995-04-21)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 54  인용 특허 : 32
초록

An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric devi...

대표
청구항

A package for enclosing an integrated circuit chip, comprising: a multiple stage thermoelectric device including a first plate, a second plate and a third plate thermally connected to one another by a first plurality and a second plurality of conducting elements; and a package substrate having a cavity defined therein, the package substrate for attaching to the first plate such that a hermetically sealed chamber is formed, wherein the first plate forms a top wall of the chamber and the second plate is disposed within the chamber apart from the package su...

이 특허에 인용된 특허 (32)

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  5. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Tokyo JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko. Cooling system for an electronic circuit device. USP1992065126919.
  6. Go Hiroshi (Zama JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX). Electronic apparatus cooling system. USP1992095144531.
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  8. Matsunaga Katsuki (Kawasaki JPX) Kojima Yasushi (Kawasaki JPX) Yamazaki Naoya (Kawasaki JPX) Yoshida Kiyoshi (Kawasaki JPX) Hoshino Yoshinori (Kawasaki JPX). Heat radiating apparatus for semiconductor device. USP1994125375652.
  9. Harrison John D. (Palo Alto CA) Jervis James E. (Menlo Park CA). Heat recoverable metallic coupling. USP1977074035007.
  10. Ishida Yoshio (Osaka JPX). Heat sink. USP1996075535816.
  11. Tata Peter D. (Johnston RI) Rife William B. (Greenville RI). Heat sink assembly for solid state devices. USP1994055313099.
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  14. Wojnarowski Robert J. (Ballston Lake NY) Eichelberger Charles W. (Schenectady NY). High density interconnect structure with top mounted components. USP1993045200810.
  15. Lee James C. K. (Los Altos Hills CA). Integrated circuit packaging systems with double surface heat dissipation. USP1986104620215.
  16. Swiatosz Edmund (Maitland FL). Integrated circuit temperature gradient and moisture regulator. USP1981034253515.
  17. Mansuria Mohanlal S. (Coral Springs FL) Mosley Joseph M. (Boca Raton FL) Musa Richard D. (Boca Raton FL) Shutler William F. (Wappingers Falls NY) Tuozzolo Vito J. (Boca Raton FL). Integrated thermoelectric cooling. USP1991075032897.
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  19. Nakajima Tadakatsu (Ibaraki JPX) Ohashi Shigeo (Tsuchiura JPX) Kuwahara Heikichi (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Sato Motohiro (Ibaraki JPX) Hatsuda Toshio (Ibaraki JPX) Daikoku Takah. Liquid impingement cooling module for semiconductor devices. USP1993125270572.
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  22. Hanson, Richard A.. Method and apparatus for producing a controlled preload on a transducer assembly by means of a composite material sleeve. USP1985124555945.
  23. Yoshida, Toshio. Method of lining inner wall surfaces of hollow articles. USP1983034377894.
  24. Hulburd William G. (San Diego CA) Picoraro Theodore A. (El Cajon CA). Miniature heat exchanger. USP1993115263536.
  25. Ohashi Yoshihisa (Takarazuka JPX) Nakanishi Mutsuo (Kobe JPX) Takai Shigeharu (Nishinomiya JPX) Kikuchi Junichi (Nishinomiya JPX) Fukuda Tadashi (Amagasaki JPX) Hiraishi Nobushige (Nishinomiya JPX). Process for manufacturing clad metal tubing. USP1991105056209.
  26. Osada Mitsuo (Hyogo JPX) Abe Yugaku (Hyogo JPX). Radiating fin having an improved life and thermal conductivity. USP1995095448107.
  27. Heckaman Douglas E. (Indialantic FL) Perkins Gilbert R. (Palm Bay FL) Higman Roger H. (Palm Bay FL). Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing. USP1989124890195.
  28. Shibata, Takaaki; Yamamoto, Tetsuhiro. Sealing method using heat-shrinkable film. USP1983044379009.
  29. Sawaya Hiromichi (Kawasaki JPX). Semiconductor device including a package having a plurality of bumps arranged in a grid form as external terminals. USP1993035191511.
  30. Koyanagi Tadamasa (Yasatomachi JPX) Oohira Tsunehiro (Tsukuba JPX). Thermoelectric element sheet in which thermoelectric semiconductors are mounted between films. USP1995075430322.
  31. Fritz Robert E. (2041 Vista Del Mar San Mateo CA 94404) Monkowski Joseph R. (1850 Lawrence Rd. Danville CA 94506). Thermoelectric module having reduced spacing between semiconductor elements. USP1995075434744.
  32. Pence ; IV William E. (Tarrytown NY). Thermoelectric piezoelectric temperature control. USP1993025188286.

이 특허를 인용한 특허 피인용횟수: 54

  1. Fredeman, John A.; Gardell, David L.; Knox, Marc D.; LaForce, Mark R.. Actively controlled heat sink for convective burn-in oven. USP2003016504392.
  2. Tayebati, Parviz; Cranton, Brian; Vakhshoori, Daryoosh; Azimi, Masud E.; McCallion, Kevin J.. Apparatus and method for providing auxiliary cooling and thermal stability to an opto-electronic component. USP2004076762938.
  3. Newman Robert ; Lee Chu-Chung. Ball grid array package having thermoelectric cooler. USP2001036196002.
  4. Aoki, Russell S.; Crocker, Michael T.; Carter, Daniel P.. Chamber sealing valve. USP2010117836748.
  5. Aoki,Russell S.; Crocker,Michael T.; Carter,Daniel P.. Chamber sealing valve. USP2008097418998.
  6. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G.. Circuit assemblies including thermoelectric modules. USP2014028649179.
  7. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G.. Circuit assemblies including thermoelectric modules. USP2016049322580.
  8. Lofy, John. Climate controlled seating assembly with sensors. USP2016059335073.
  9. Ahn,Kie Y.; Forbes,Leonard; Cloud,Eugene H.. Compact system module with built-in thermoelectric cooling. USP2006047022553.
  10. Lofy, John. Condensation and humidity sensors for thermoelectric devices. USP20190310228166.
  11. Lofy, John D.. Condensation and humidity sensors for thermoelectric devices. USP2017059651279.
  12. Turner William Evans ; Seppa Ronald ; Turner William Edward. Cooled electrical system for use downhole. USP1999085931000.
  13. Turner William Evans ; Seppa Ronald ; Turner William Edward ; Sallwasser Alan J.. Cooled electrical system for use downhole. USP2000106134892.
  14. Prasher, Ravi. Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel. USP2009127633752.
  15. Tohru Nakanishi JP; Yasuharu Yamada JP; Masanori Kuzuno JP; Toshihiko Nishio JP. Cooling method and device for notebook personal computer. USP2002026351382.
  16. Fry, Steven J.. Dual oven oscillator using a thermoelectric module. USP2003096621361.
  17. Goenka Lakhi Nandlal. Electrical circuit board and method for making the same. USP2001126327149.
  18. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E.. Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication. USP2004076767766.
  19. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E.. Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication. USP2003046548894.
  20. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons. Electronic module with integrated thermoelectric cooling assembly. USP2002126489551.
  21. Brykalski, Michael J.; Terech, John; Petrovski, Dusko. Environmentally-conditioned bed. USP20190310226134.
  22. Brykalski, Michael J.; Terech, John; Petrovski, Dusko. Environmentally-conditioned bed. USP2017049622588.
  23. Macris, Chris. Heat dissipating IC devices. USP2004066743972.
  24. Macris, Chris. Heat dissipating silicon-on-insulator structures. USP2004116818817.
  25. Petrovski, Dusko. Heating and cooling systems for seating assemblies. USP20180610005337.
  26. Refai-Ahmed, Gamal. Holistic thermal management system for a semiconductor chip. USP2011118058724.
  27. Mathews, Charles R.; Santana, Jr., Miguel; Herrera, Alfredo. Integrated circuit cooling device. USP2004106800933.
  28. Meissner Edward G.. Integrated circuit package having a thermoelectric cooling element therein. USP2000036043982.
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  35. Fornara, Pascal; Rivero, Christian. Method of wireless communication using thermoelectric generators. USP20190410249679.
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  43. Xing, Andrew. System and method for mounting a stack-up structure. USP2003026519157.
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  54. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio. Vehicle headliner assembly for zonal comfort. USP2017059662962.