|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||257/712 ; 257/930 ; 361/704 ; 361/717|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 54 인용 특허 : 32|
An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric devi...
A package for enclosing an integrated circuit chip, comprising: a multiple stage thermoelectric device including a first plate, a second plate and a third plate thermally connected to one another by a first plurality and a second plurality of conducting elements; and a package substrate having a cavity defined therein, the package substrate for attaching to the first plate such that a hermetically sealed chamber is formed, wherein the first plate forms a top wall of the chamber and the second plate is disposed within the chamber apart from the package su...