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Direct bonded heat spreader 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/12
출원번호 US-0293510 (1994-08-19)
우선권정보 DE-4327641 (1993-08-17); DE-4328353 (1993-08-24); DE-4336944 (1993-10-29); DE-4338706 (1993-11-12)
발명자 / 주소
  • Edwards Steven F. (702 N. Oak Cliff Blvd. Dallas TX 75208) Maier Peter (Hugo Dietz Str. 19 8650 Lauf DEX) Shultz-Harder Jurgen (Hugo Dietz Str. 32 8650 Lauf DEX)
인용정보 피인용 횟수 : 83  인용 특허 : 2

초록

A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.

대표청구항 ▼

An electronic device package comprising: (a) a metal heat spreader (b) a multilayer substrate having an exposed ceramic surface and a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader; and (c) a eutectic metal-to-cer

이 특허에 인용된 특허 (2)

  1. Kaufman Lance R. (131 North White Oak Way Mequon WI 53092), Hermetic direct bond circuit assembly.
    상세보기
  2. McShane Michael B. (Austin TX) Lin Paul (Austin TX), High performance overmolded electronic package.
    상세보기

이 특허를 인용한 특허 (83)

  1. Wu Bing ; Costello Timothy G. ; Jun Kathy M., Adhesive composition with small particle size for microelectronic devices.
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  2. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages.
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  3. Kalidas Navinchandra ; Hassanzadeh Nozar ; Lamson Michael A., Ball grid array package.
    상세보기
  4. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  5. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  6. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  7. Zhao,Sam Ziqun; Khan,Rezaur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
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  8. Zhao, Sam Ziqun; Khan, Rezaur Rahman; Law, Edward; Papageorge, Marc, Ball grid array package having one or more stiffeners.
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  9. Khan, Reza-ur Rahman; Zhong, Chong Hua, Ball grid array package substrates and method of making the same.
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  10. Khan,Reza ur Rahman; Zhong,Chong Hua, Ball grid array package substrates with a modified central opening and method for making the same.
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  11. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package with patterned stiffener layer.
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  12. Zhao, Sam Ziqun; Khan, Reza ur Rahman; Law, Edward; Papageorge, Marc, Ball grid array package with patterned stiffener surface and method of assembling the same.
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  13. Zhao, Sam Ziqun; Rahman Khan, Reza ur, Ball grid array package with separated stiffener layer.
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  14. Hirakawa Tadashi,JPX, Ball grid array semiconductor package with solder ball openings in an insulative base.
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  15. Lin, Mou-Shiung; Lee, Jin-Yuan; Huang, Ching-Cheng, Chip package with die and substrate.
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  16. McIlnay, Ronald G.; Abbbenhouse, Martin S., Circuit package and method for making the same.
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  17. Lin,Mou Shiung; Lee,Jin Yuan; Huang,Ching Cheng, Circuitry component with metal layer over die and extending to place not over die.
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  18. Greiner, Ralf; Maier, Josef; Paintner, Kai; Sinning, Richard, Compact circuit carrier package.
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  19. Downing Robert Scott, Cooling apparatus and method of assembling same.
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  20. Jenkins, Kurt A.; Burress, Edward; Narain, Jaya; Bergeson, Robert J.; Hill, Andrew W.; Stellman, Taylor, Device sandwich structured composite housing.
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  21. Jenkins, Kurt A.; Burress, Edward; Narain, Jaya; Bergeson, Robert J.; Hill, Andrew W.; Stellman, Taylor, Device sandwich structured composite housing.
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  22. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Die down ball grid array package.
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  23. Khan, Reza-Ur Rahman; Zhao, Sam Ziqun, Die down ball grid array packages and method for making same.
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  24. Zhang,Tonglong; Khan,Reza ur Rahman, Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same.
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  25. Zhang,Tonglong; Khan,Reza ur Rahman, Die-up ball grid array package with a heat spreader and method for making the same.
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  26. Khan,Reza ur R; Zhao,Sam Z; Bacher,Brent, Die-up ball grid array package with attached stiffener ring.
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  27. Zhao, Sam Z; Khan, Reza-ur R, Die-up ball grid array package with die-attached heat spreader.
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  28. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Die-up ball grid array package with enhanced stiffener.
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  29. Khan,Reza ur Rahman; Zhao,Sam Ziqun; Bacher,Brent, Die-up ball grid array package with patterned stiffener opening.
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  30. Khan,Reza ur R; Zhao,Sam Z; Bacher,Brent, Die-up ball grid array package with printed circuit board attachable heat spreader.
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  31. Zhao,Sam Z; Khan,Reza ur R, Die-up ball grid array package with printed circuit board attachable heat spreader.
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  32. Choi, Kang Rim, Electrically isolated power semiconductor package.
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  33. Kang Rim Choi, Electrically isolated power semiconductor package.
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  34. Matz, Richard; Männer, Ruth; Walter, Steffen, Electronic component module and method for production thereof.
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  35. Alcoe David James ; Anderson Steven Wayne ; Guo Yifan ; Johnson Eric Arthur, Electronic package with strain relief means.
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  36. Reddy Prathap Amerwai ; Jairazbhoy Vivek Amir ; Belke ; Jr. Robert Edward, Embedded metal planes for thermal management.
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  37. Stolz Howard W. ; Osborn Jay K. ; Hruska Daniel B., Enclosure mounted heat sink.
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  38. Rahman Khan,Reza ur; Zhao,Sam Ziqun, Enhanced die-down ball grid array and method for making the same.
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  39. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Enhanced die-up ball grid array packages and method for making the same.
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  40. Shim, Il Kwon; Chow, Seng Guan; Ararao, Virgil Cotoco; Alvarez, Sheila Marie L.; Emigh, Roger, Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices.
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  41. Lai Jeng Yuan,TWX ; Huang Chien Ping,TWX, Heat-dissipating structure for integrated circuit package.
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  42. Lai Jeng Yuan,TWX ; Huang Chien Ping,TWX, Heat-dissipating structure for integrated circuit package.
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  43. Choi, Kang Rim, High frequency power device with a plastic molded package and direct bonded substrate.
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  44. Khan,Reza ur Rahman; Zhao,Sam Ziqun, IC die support structures for ball grid array package fabrication.
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  45. Fjelstad, Joseph C.; Grundy, Kevin P.; Yasumura, Gary, IC package structures having separate circuit interconnection structures and assemblies constructed thereof.
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  46. Lee, Jin-Yaun; Lin, Mou-Shiung; Huang, Ching-Cheng, Integrated chip package structure using ceramic substrate and method of manufacturing the same.
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  47. Lin, Mou-Shiung; Lee, Jin-Yuan; Huang, Ching-Cheng, Integrated chip package structure using metal substrate and method of manufacturing the same.
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  48. Lin, Mou-Shiung; Lee, Jin-Yuan; Huang, Ching-Cheng, Integrated chip package structure using organic substrate and method of manufacturing the same.
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  49. Lin, Mou-Shiung; Lee, Jin-Yuan; Huang, Ching-Cheng, Integrated chip package structure using silicon substrate and method of manufacturing the same.
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  50. Zhang, Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
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  51. Zhang,Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
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  52. Zhong, Chong Hua; Khan, Rezaur Rahman, Low voltage drop and high thermal performance ball grid array package.
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  53. Zhong, Chonghua; Khan, Reza-ur Rahman, Low voltage drop and high thermal performance ball grid array package.
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  54. Zhong,Chong Hua; Rahman Khan,Reza ur, Low voltage drop and high thermal performance ball grid array package.
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  55. Osanai,Hideyo; Furo,Masahiro, Metal-ceramic circuit board.
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  56. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Method for assembling a ball grid array package with multiple interposers.
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  57. Zhao,Sam Zinqun; Khan,Reza ur Rahman; Chaudhry,Imtiaz, Method for assembling a ball grid array package with two substrates.
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  58. Lee, Jin-Yuan; Lin, Mou-Shiung; Huang, Ching-Cheng, Method for fabricating chip package with die and substrate.
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  59. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Chaudhry, Imtiaz, Method for making an enhanced die-up ball grid array package with two substrates.
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  60. Banerjee Koushik ; Chroneos ; Jr. Robert J. ; Mozdzen Tom, Method for plating a bond finger of an intergrated circuit package.
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  61. Zhao,Sam Ziqun; Khan,Rezaur Rahman, Method of assembling a ball grid array package with patterned stiffener layer.
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  62. Choi, Kang Rim, Method of making electrically isolated power semiconductor package.
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  63. Osanai,Hideyo; Furo,Masahiro, Method of manufacturing a metal-ceramic circuit board.
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  64. Mouli, Chandra; Sandhu, Gurtej S., Methods of cooling semiconductor dies.
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  65. Zhao, Sam Ziqun; Khan, Rezaur Rahman, Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader.
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  66. Ujiie Masato,JPX ; Kurokawa Yasuhiro,JPX, Mount for semiconductor device.
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  67. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same.
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  68. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same.
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  69. Zhao, Sam Ziqun; Khan, Rezaur Rahman, No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement.
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  70. Heerman Marcel,BEX ; Wille Joost,BEX ; Van Puymbroeck Jozef,BEX ; Roggen Jean,BEX ; Beyne Eric,BEX ; Van Hoof Rita,BEX, Polymer stud grid array.
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  71. Choi, Kang Rim, Power device with a plastic molded package and direct bonded substrate.
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  72. Lin, Mou-Shiung; Lee, Jin-Yuan; Huang, Ching-Cheng, Semiconductor package with interconnect layers.
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  73. Wyland Christopher Paul, Semiconductor package with internal heatsink and assembly method.
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  74. Mouli, Chandra; Sandhu, Gurtej S., Semiconductor packages.
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  75. Masuda, Satoshi, Stacked module.
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  76. Ma Qing ; Mu Chun ; Fujimoto Harry ; Carruthers John ; Li Jian ; Pan Chuanbin, Structures and processes for fabricating moisture resistant chip-on-flex packages.
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  77. Karnezos, Marcos; Kim, Yong-Bae, Tape ball grid array semiconductor package structure and assembly process.
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  78. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Thermal spreader and interface assembly for heat generating component of an electronic device.
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  79. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array package.
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  80. Mertol Atila ; Celik Zeki Z. ; Ghahghahi Farshad ; Kutlu Zafer S., Thermally-enhanced flip chip IC package with extruded heatspreader.
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  81. Costello, Kenneth A., Unitary vacuum tube incorporating high voltage isolation.
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  82. Costello, Kenneth A., Unitary vacuum tube incorporating high voltage isolation.
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  83. Costello,Kenneth A., Unitary vacuum tube incorporating high voltage isolation.
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