$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Compliant thermal connectors, methods of making the same and assemblies incorporating the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0695611 (1996-08-12)
발명자 / 주소
  • DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA)
출원인 / 주소
  • Tessera, Inc. (San Jose CA 02)
인용정보 피인용 횟수 : 39  인용 특허 : 7

초록

A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors desirably formed as elongated “S”-shaped strips or ribbons. The conductors can flex to accommodate tolerances in th

대표청구항

A microelectronic assembly comprising: (a) a microelectronic device; (b) a heat sink; (c) a plurality of elongated metallic heat conductors each having an axis of elongation, said conductors defining a plurality of continuous paths between said microelectronic element and the heat sink, each such pa

이 특허에 인용된 특허 (7)

  1. Reynolds Scott D. (Endwell NY), Attachment for contacting a heat sink with an integrated circuit chip and use thereof.
  2. Dolbear Thomas P. (Austin TX) Nelson Richard D. (Austin TX) Gibson David A. (Austin TX) Gupta Omkarnath R. (Fremont CA), Coiled spring heat transfer element.
  3. Bellar Robert J. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip.
  4. Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Harvilchuck Joseph M. (Billings NY), High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology.
  5. Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Yakubowski Carl (Hyde Park NY), High conduction flexible fin cooling module.
  6. Horvath Joseph L. (Poughkeepsie NY) McLeod Mark H. (Poughkeepsie NY) Yakubowski Carl (Hyde Park NY), Multiple radial finger contact cooling device.
  7. Horvath Joseph L. (Poughkeepsie NY), Thermal conduction element for semiconductor devices.

이 특허를 인용한 특허 (39)

  1. Manning, Troy A.; Ball, Michael B., Apparatus and methods for coupling conductive leads of semiconductor assemblies.
  2. Troy A. Manning ; Michael B. Ball, Apparatus and methods for coupling conductive leads of semiconductor assemblies.
  3. Manning Troy A. ; Ball Michael B., Apparatus for electrically coupling bond pads of a microelectronic device.
  4. Jacques Normand Bedard CA, Compliant thermal interface devices and method of making the devices.
  5. Karidis,John P.; Schultz,Mark; Webb,Bucknell C., Compliant thermal interface structure with vapor chamber.
  6. Bucher, Alan Weir, Conformable thermal bridge.
  7. Woodard, Nathan G.; Kabir, Omar M.; Rathbun, Jeremiah I., Device for cooling a bearing; flywheel energy storage system using such a bearing cooling device and methods related thereto.
  8. Jens Pohl DE; Gerolf Thamm DE; Andreas Hippe DE, Electronic circuit having a flexible intermediate layer between electronic components and a heat sink.
  9. Miller, Charles A., Electronic package with direct cooling of active electronic components.
  10. Miller,Charles A, Electronic package with direct cooling of active electronic components.
  11. Miller,Charles A., Electronic package with direct cooling of active electronic components.
  12. Morelock, Robert C., Electronics assembly with improved heatsink configuration.
  13. Smith John W. ; Haba Belgacem, Flexible lead structures and methods of making same.
  14. Smith, John W.; Haba, Belgacem, Flexible lead structures and methods of making same.
  15. Monster, Peter; Petersen, Niels Hogholt, Frequency converter on a motor.
  16. Okada, Akira; Imabayashi, Hirofumi; Yajima, Hideaki; Kanasaki, Katsumi; Miyazaki, Takehide; Nishida, Kazuya, Heat radiator.
  17. Paquette, Jeffrey; Cheyne, Scott R.; Ellsworth, Joseph R.; Martinez, Michael P.; Trahan, Michael R., Heat sink interface having three-dimensional tolerance compensation.
  18. Hong-Chi, Yu, High-density integrated circuit module structure.
  19. Ong,You Yang; Chung,Kwang Yong; Ahmad,Mohd Helmy Bin; Wong,Garrett L.; Luechinger,Christoph B., Integrated circuit package system including ribbon bond interconnect.
  20. Haba, Belgacem; Wolter, Klaus-Jurgen, Joining semiconductor units with bonding material.
  21. Masud Beroz ; Belgacem Haba ; Christopher M. Pickett, Lead formation using grids.
  22. Beroz Masud ; Haba Belgacem ; Pickett Christopher M., Lead formation usings grids.
  23. Manning Troy A. ; Ball Michael B., Method for electrically coupling bond pads of a microelectronic device.
  24. Smith John W. ; Fjelstad Joseph, Microelectronic assembly fabrication with terminal formation from a conductive layer.
  25. Smith John W. ; Fjelstad Joseph, Microelectronic assembly fabrication with terminal formation from a conductive layer.
  26. Smith, John W.; Koblis, Mitchell, Microelectronic assembly formation with releasable leads.
  27. Beroz, Masud; Haba, Belgacem, Microelectronic joining processes with temporary securement.
  28. Masud Beroz ; Joseph Fjelstad ; Belgacem Haba ; Christopher M. Pickett ; John Smith, Microelectronic unit forming methods and materials.
  29. Giulio DiGiacomo ; Stephen S. Drofitz, Jr. ; David L. Edwards ; Larry D. Gross ; Sushumna Iruvanti ; Raed A. Sherif ; Subhash L. Shinde ; David J. Womac ; David B. Goland ; Lester W. Herron, Multi-chip module and heat-sink cap combination.
  30. Schultz, Mark D., Pin fin compliant heat sink with enhanced flexibility.
  31. Schultz, Mark D., Pin fin compliant heat sink with enhanced flexibility.
  32. Autry Sidney David, Positive pressure heat sink conduit.
  33. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
  34. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
  35. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
  36. Michel, Bruno; Brunschwiler, Thomas J.; Linderman, Ryan J.; Rothuizen, Hugo E.; Kloter, Urs, Semiconductor chip assembly with flexible metal cantilevers.
  37. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
  38. Yuan,Yuan; Joiner,Bennett; Lee,Chuchung (Stephen), Thermally enhanced molded package for semiconductors.
  39. Delano,Andrew D.; Rubenstein,Brandon A.; Miksch,Eugene, Variable-gap thermal-interface device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로