초록 ▼

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafe

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

대표청구항 ▼

A semiconductor processing apparatus for applying a coating layer to a semiconductor article being coated using a coating, comprising: a spray processing vessel; a wafer support mounted with at least portions thereof within the spray processing vessel for holding the semiconductor article within the

A semiconductor processing apparatus for applying a coating layer to a semiconductor article being coated using a coating, comprising: a spray processing vessel; a wafer support mounted with at least portions thereof within the spray processing vessel for holding the semiconductor article within the spray processing vessel while the semiconductor article is being coated; at least one spray-head mounted for movement within the spray processing vessel, said at least one spray-head being mounted for movement about a pivotal axis for directing at least one spray of coating upon a coated surface of the semiconductor article while the semiconductor article is being held in the wafer support; at least one coating motoring pump connected to supply coating to the at least one spray-head and for metering controlled amounts of coating being applied through said at least one spray-head; at least one spray head actuator mechanically connected to the at least one spray-head about said pivotal axis and for moving the at least one spray-head about said pivotal axis and relative to the wafer support to achieve a variety of nozzle positions wherein the at least one spray-head applies metered amounts of coating onto the coated surface of the semiconductor article being coated; at least one spray head proximity adjustment mechanism for allowing the proximity of the at least one spray-head to be adjusted with regard to the proximity distance between the at least one spray-head relative to the coated surface of the semiconductor article being coated; and at least one controller for controlling said at least one coating metering pump and said at least one spray head actuator to provide coordinated spraying of metered amounts of coating onto the coated surface of the semiconductor article as the at least one spray head actuator provides relative motion so as to allow desired amounts of coating to be deposited upon the coated surface.