최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0351813 (1994-12-08) |
발명자 / 주소 |
|
출원인 / 주소 |
|
인용정보 | 피인용 횟수 : 380 인용 특허 : 0 |
A low cost LED array is formed from a plurality of modular units that are snapped together. Each modular unit consists of one or more U-shaped lead frame substrates which are overmolded with a thermoplastic insulator material. The lead frame substrates act as heat dissipators. The LEDs are then bond
A low cost LED array is formed from a plurality of modular units that are snapped together. Each modular unit consists of one or more U-shaped lead frame substrates which are overmolded with a thermoplastic insulator material. The lead frame substrates act as heat dissipators. The LEDs are then bonded onto the upper surfaces of the lead frame substrates. A reflector unit is separately molded and has one cone-shaped reflector for each light emitting diode. The reflector unit is aligned and affixed to the top of the lead frame unit such that the LED is disposed in the center of each cone. Each of the reflector units has several dovetail-shaped connectors which enable the completed module to be connected to adjacent modules to form the array. The modules are then electrically connected together in series or in parallel according to the particular application. The arrays may be used for plant growth or in photodynamic therapy.
A module having at least one optoelectronic device, comprising: at least one electrically and thermally conductive lead frame substrate having an upper surface and being adapted to act as a heat sink; at least one optoelectronic device electrically connected to said upper surface of said lead frame
A module having at least one optoelectronic device, comprising: at least one electrically and thermally conductive lead frame substrate having an upper surface and being adapted to act as a heat sink; at least one optoelectronic device electrically connected to said upper surface of said lead frame substrate; and at least one connector interconnected with said lead frame substrate that is adapted to interconnect said lead frame substrate with at least one other lead frame substrate of another module.
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