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Method for fabrication of high vertical aspect ratio thin film structures 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0207459 (1994-03-07)
발명자 / 주소
  • Keller Christopher G. (Albany CA)
출원인 / 주소
  • The Regents of the University of California (Oakland CA 02)
인용정보 피인용 횟수 : 119  인용 특허 : 0

초록 ▼

This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition proc

대표청구항 ▼

A method of fabrication of a micromechanical element, comprising: providing a mold having a depth; coating said mold with a sacrificial thin film layer; growing a structural thin film on said sacrificial thin film layer, without having first patterned said sacrificial thin film layer, so the thickne

이 특허를 인용한 특허 (119)

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