[특허]High performance spiral heat sink

High performance spiral heat sink 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0552801 (1995-11-03)
발명자 / 주소	Mira Ali (San Jose CA)
출원인 / 주소	Silicon Graphics, Inc. (Mountain View CA 02)
인용정보	피인용 횟수 : 71 인용 특허 : 0

초록 ▼

A thermally conductive heat sink unit. In the present invention, a thermally conductive heat sink has a first surface. A plurality of arc-shaped cooling fins are formed in the first surface. The arc-shaped cooling fins extend radially outward from a central region of the first surface. A second surface of the thermally conductive heat sink is adapted to thermally contact a heat generating device. By contacting the heat generating device, heat generated by the device is dissipated through the arc-shaped cooling fins of the first surface. In one embodiment of the present invention, a recessed region is formed into the first surface of the thermally conductive heat sink. The recessed region is formed above the central region and the region peripherally surrounding the central region such that the recessed region extends into a portion of the arc-shaped cooling fins. In such an embodiment, a fan is embedded within the recessed region of the thermally conductive heat sink. The fan impinges the arc-shaped cooling fins and the central region with a stream of coolant to aid in the dissipation of heat from the thermally conductive heat sink. In one embodiment, the arc-shaped cooling fins are arranged to insure optimal heat transfer via the stream of coolant impinging and flowing by the arc-shaped cooling fins.

대표청구항 ▼

A thermally conductive unit comprising: a thermally conductive heat sink, said thermally conductive heat sink including: a first surface having a plurality of non-sinusoidal are-shaped cooling fins formed therein, said non-sinusoidal arc-shaped cooling fins extending radially outward from a central region of said first surface to the periphery of said thermally conductive heat sink, said central region of said first surface comprised of a solid columnar core extending vertically from said first surface, said non-sinusoidal are shaped cooling fins oriented so as to optimize heat transfer caused by a stream of coolant impinging and flowing by said non-sinusoidal arc-shaped cooling fins; and a second surface adapted to thermally contact a heat generating integrated circuit device such that heat generated by said heat generating integrated circuit device is dissipated by said non-sinusoidal arc-shaped cooling fins disposed on said first surface of said thermally conductive heat sink.

이 특허를 인용한 특허 (71)

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Wei, Wen-Chen, Heat dissipater structure.
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Xu,Li Fu; Yang,Chih Hao; Hwang,Ching Bai, Heat dissipating device.
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Harman, Jayden David, Heat exchanger.
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Harman,Jayden David, Heat exchanger.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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연합인증

High performance spiral heat sink 원문보기

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이 특허를 인용한 특허 (71)

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