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A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis: about 40-65% Ag2O about 15-35% V2O5 about 0-30% PbO

A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis: about 40-65% Ag2O about 15-35% V2O5 about 0-30% PbO2 about 0-20% TeO2 The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.

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An essentially resin free paste consisting essentially of by weight: from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt; from about 2% to about 24% of a glass composition which consists essentially of, by weight on

An essentially resin free paste consisting essentially of by weight: from about 60% to about 90% of conductive metallic particles selected from the group consisting of Ag, Au, Al, Cu, Ni, Pd, Zn, Sn and Pt; from about 2% to about 24% of a glass composition which consists essentially of, by weight on an oxide basis about 40-65% Ag2O about 15-35% V2O5 about 0-20% TeO2 and about 0-30% of at least one of a group consisting of PbO2 and Pb3O4, wherein said conductive metallic particles and said glass composition have a ratio by weight of no more than about 32:1; about 8-15% of an organic solvent; and a resin percentage of less than 0.1% of said paste.