초록 ▼

A method is disclosed including: (a) dip coating a batch of substrates, each substrate defining an end region, a center region, and a top region, with a first coating solution including a solvent to deposit a first layer on the end region, the center region, and optionally on a part of the top regio

A method is disclosed including: (a) dip coating a batch of substrates, each substrate defining an end region, a center region, and a top region, with a first coating solution including a solvent to deposit a first layer on the end region, the center region, and optionally on a part of the top region of each substrate, wherein the first layer includes a wet coating solution bead formed at the end region of each substrate, thereby resulting in a plurality of wet coating solution beads; (b) directing a gas simultaneously at the entire plurality of the wet coating solution beads to remove a portion of the solvent in each bead, wherein the gas fails to disrupt the coating uniformity of the part of the first layer over the center region of each substrate; and (c) dip coating the batch of the substrates subsequent to (b) with a second coating solution to deposit a second layer over the first layer, wherein the portion of the solvent removed from each bead in (b) is sufficient to prevent contamination of the second coating solution by the first layer.

대표청구항 ▼

A coating method comprising: (a) dip coating a batch of endless, hollow substrates, each substrate defining an open end region, a center region, and a top region, with a first coating solution including a solvent to deposit a first layer on the end region, the center region, and optionally on a part

A coating method comprising: (a) dip coating a batch of endless, hollow substrates, each substrate defining an open end region, a center region, and a top region, with a first coating solution including a solvent to deposit a first layer on the end region, the center region, and optionally on a part of the top region of each substrate, wherein the first layer includes a wet coating solution bead formed at the end region of each substrate, thereby resulting in a plurality of wet coating solution beads; (b) directing a gas simultaneously at the entire plurality of the wet coating solution beads to remove a portion of the solvent in each bead, wherein the gas fails to disrupt the coating uniformity of the part of the first layer over the center region of each substrate, wherein (b) comprises positioning the batch of the substrates over a gas channelling structure and directing the gas through the structure simultaneously at the entire plurality of the wet coating solution beads, wherein the gas also enters into the substrate interior; and (c) dip coating the batch of the substrates subsequent to (b) with a second coating solution to deposit a second layer over the first layer, wherein the portion of the solvent removed from each bead in (b) is sufficient to prevent contamination of the second coating solution by the first layer. The coating method of claim 1, wherein the first coating solution or the second coating solution includes a charge generating material.