[특허]Electromagnetic interference suppressing connector array

[미국특허] Electromagnetic interference suppressing connector array 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01R-013/66
출원번호	US-0746183 (1996-11-06)
발명자 / 주소	Law Henry Hon (Berkeley Heights NJ)
출원인 / 주소	Lucent Technologies Inc. (Murray Hill NJ 02)
인용정보	피인용 횟수 : 40 인용 특허 : 0

초록 ▼

In accordance with the invention, an EMI suppressing connector comprises a body of ferrite having a plurality of conductive channels and at least one planar surface. The channel walls are wholly or partially coated with conductive material which provides a conductive path extending through the body and the planar surface includes a pattern of coated conductive leads connected to the conductive channels. Preferably the connector is in the form of a rectangular parallelopiped, and the channels extend perpendicularly between two major surfaces. In one embodiment, the conductive material extends horizontally through the body and onto planar bottom. The conductive material on the planar bottom surface provides ready connection with contacts on a circuit board or IC package. In another embodiment, the conductive material extends vertically through the body and onto a planar bottom or top. The conductive material on the planar surface can be configured in any desired pattern to define fanouts or mappings from one set of contacts to another.

대표청구항 ▼

An electromagnetic interference suppressing connector device for connecting to an integrated circuit having an array of bonding pads comprising: an integrated circuit; a body of ferrite material, said body having a plurality of channels therethrough and having at least one planar surface which does not intersect said channels; said channels each including a conductive coating providing a continuous electrical path through said body; said planar surface including a coated pattern of conductive leads and a plurality of bonding pads, said bonding pads on said surface configured in an array for electrically connecting to said integrated circuit, and said leads connecting said conductive channel coatings to respective bonding pads on said surface providing a plurality of separate interference suppressing conductive paths to said integrated circuit.

이 특허를 인용한 특허 (40) 인용/피인용 타임라인 분석

Hardin, Keith Bryan, Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component.
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Provencher, Daniel B.; Gailus, Mark W.; Manter, David; Sivarajan, Vysakh, Compliant shield for very high speed, high density electrical interconnection.
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Kirk, Brian; Si, Jason; Pham, Ba; Kocsis, Sam; Chan, David; Wang, Wonder; Tang, Bob; Li, Martin; Wu, Smith, Connector configurable for high performance.
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Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board.
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Hardin, Keith Bryan, Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board.
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Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Die press process for manufacturing a Z-directed component for a printed circuit board.
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Cartier, Jr., Marc B.; Gailus, Mark W.; Sivarajan, Vysakh, Differential electrical connector with improved skew control.
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Paniagua, Jose Ricardo, Electrical connector with hybrid shield.
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Paniagua, Jose Ricardo, Electrical connector with hybrid shield.
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Smith,Douglas W., Electrically shielded connector.
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Yee Dawson, Electro-magnetic interference shielding.
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Hardin, Keith Bryan, Extrusion process for manufacturing a Z-directed component for a printed circuit board.
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Hollander Milton Bernard ; McKinley William Earl ; Stewart Russell, Ferrite method and device particularly for thermocouples and other dissimilar metal conductor combinations.
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Dawson Yee, Flexible connection system.
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Atkinson, Prescott B.; Gailus, Mark W.; Hanrahan, Mark G., High bandwidth connector.
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Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
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Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
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Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
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Milbrand, Jr., Donald W.; Atkinson, Prescott B.; Kirk, Brian, High performance cable connector.
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Cartier, Jr., Marc B.; Manter, David; Atkinson, Prescott B.; Stokoe, Philip T.; Cohen, Thomas S.; Gailus, Mark W., High performance connector contact structure.
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Kirk, Brian; Kasturi, Vijay, High performance, small form factor connector.
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Kirk, Brian; Kasturi, Vijay, High performance, small form factor connector with common mode impedance control.
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Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
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Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
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Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
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Cohen, Thomas S., High-frequency electrical connector.
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Cartier, Jr., Marc B.; Gailus, Mark W.; Cohen, Thomas S.; Dunham, John Robert; Sivarajan, Vysakh, Housing for a high speed electrical connector.
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Cartier, Jr., Marc B.; Manter, David; Atkinson, Prescott B.; Stokoe, Philip T.; Cohen, Thomas S.; Gailus, Mark W., Low cost, high performance RF connector.
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McNamara, David M.; Kirk, Brian, Mezzanine connector.
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Boutros Kamal Shawiky,CAX ; Pike Robert,CAX ; Dima Martian Daniel,CAX, Modular plug connector and improved receptacle therefore.
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Hardin, Keith Bryan; Hall, Paul Kevin; Kratzer, Zachary Charles Nathan; Zhang, Qing, Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material.
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Gerhard Damaschke DE; Frank Schlag DE; Karlheinz Wienand DE, Process for manufacturing printed circuit boards and process for connecting wires thereto.
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Sarkissian Vicken Roben, Right angle connector.
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Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Screening process for manufacturing a Z-directed component for a printed circuit board.
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Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Spin coat process for manufacturing a Z-directed component for a printed circuit board.
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Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed delay line components for printed circuit boards.
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Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed pass-through components for printed circuit boards.
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Hardin, Keith Bryan, Z-directed printed circuit board components having conductive channels for controlling transmission line impedance.
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Hardin, Keith Bryan, Z-directed printed circuit board components having conductive channels for reducing radiated emissions.
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Hardin, Keith Bryan, Z-directed printed circuit board components having different dielectric regions.
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A	생활필수품
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[미국특허] Electromagnetic interference suppressing connector array 원문보기