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Polymerized microemulsion pressure sensitive adhesive compositions and methods of preparing and using same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-002/46
  • C08F-002/22
  • C08L-033/00
출원번호 US-0507006 (1995-07-25)
발명자 / 주소
  • Dietz Timothy M. (St. Paul MN) Lu Ying-Yuh (Woodbury MN) Uy Rosa (St. Paul MN) Young Chung I. (Roseville MN)
출원인 / 주소
  • Minnesota Mining and Manufacturing Company (St. Paul MN 02)
인용정보 피인용 횟수 : 95  인용 특허 : 0

초록

A polymerized microemulsion pressure sensitive adhesive composition is described. The composition has peel adhesion of at least 3 Newtons/ 100 mm as measured according to a PSTC-1 Test. The composition preferably has a bicontinuous structure of a continuous phase of a hydrophobic pressure sensitive

대표청구항

A polymerized microemulsion pressure sensitive adhesive composition having peel adhesion of at least 3 Newtons/ 100 mm as measured according to a PSTC-1 Test on a clean glass test plate, wherein the composition has a continuous phase of a hydrophobic pressure sensitive adhesive polymer and a continu

이 특허를 인용한 특허 (95)

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