[특허]Probe apparatus

[미국특허] Probe apparatus 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-031/02
출원번호	US-0514384 (1995-08-11)
우선권정보	JP-0215869 (1994-09-09)
발명자 / 주소	Yamada Masayuki (Nirasaki JPX)
출원인 / 주소	Tokyo Electron Limited (Tokyo JPX 03) Tokyo Electron Yamanashi Limited (Nirasaki JPX 03)
인용정보	피인용 횟수 : 32 인용 특허 : 0

초록 ▼

The probe apparatus for a semiconductor wafer has a work table on which a wafer is placed. A printed wiring board having a high rigidity is situated above the work table. A support block is mounted on the printed wiring board so as to pierce through its opening. The support block has a recess which opposes to the work table, and a flexible membrane-like probe card is detachably mounted on the support block so as to cover the recess. The probe card has a main region in which contact elements to be brought into contact with electrode pads of the semiconductor wafer are arranged. A rigid rectangular frame is attached to the rear surface of the probe card so as to surround the main region, thus imparting a flatness to the probe card. A pusher is provided in the recess of the support block so as to be brought into contact with the rear side of the main region of the probe card. The pusher is swingably arranged on the lower end of the shaft vertically supported. The shaft is supported by the support block via two belleville springs.

대표청구항 ▼

A probe apparatus for examining an electrical characteristic of an object having a number of electrode pads, comprising: a work table having a table surface on which said object is placed; a wiring board provided above said work table, said wiring board comprising a substrate supported by a framework of said probe apparatus and having a high rigidity, and board wiring provided on said substrate and electrically connected to a tester; a probe card supported by said wiring board, said probe card comprising a flexible and insulating membrane, and flexible card wiring formed on said membrane and electrically connected to said board wiring of said wiring board, said probe card having a main region, in which a plurality of contact elements to be respectively brought into contact with said electrode pads of said object are arranged on a front side opposing to said table surface, and said contact elements being electrically connected to said card wiring; mounting means for mounting said probe card on said wiring board; a pusher brought into contact with a rear side of said main region of said probe card, said pusher having a contact surface set such that all of said contact elements are located within a contour thereof, a shaft engaging with said pusher so as to arrange said pusher swingably on a rear side of said main region of said probe card, said shaft having a center axis which is substantially normal to said table surface; first and second belleville springs connected to said shaft so as to apply an urging force to the main region of said probe card, and to said contact surface of said pusher, said first and second belleville springs being arranged substantially in parellel with said table surface and separated from each other along the center axis of said shaft; and securing means, mounted on said wiring board, for securing said first and second belleville springs.

이 특허를 인용한 특허 (32) 인용/피인용 타임라인 분석

Kim, Yanggi; Cho, Chang-Hyun; Kim, HoonJung, Apparatus and method for testing a semiconductor device.
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Colby, Paul C., Apparatus for electrical testing of a substrate having a plurality of terminals.
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Paul C. Colby, Apparatus for electrical testing of a substrate having a plurality of terminals.
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Ashby, Wayne C., Back pressure test fixture to allow probing of integrated circuit package signals.
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Ashby, Wayne C., Back pressure test fixture to allow probing of integrated circuit package signals.
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Kasukabe, Susumu; Mori, Terutaka; Ariga, Akihiko; Shigi, Hidetaka; Watanabe, Takayoshi; Kono, Ryuji, Connection device and test system.
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Kasukabe, Susumu; Mori, Terutaka; Ariga, Akihiko; Shigi, Hidetaka; Watanabe, Takayoshi; Kono, Ryuji, Connection device and test system.
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Kasukabe,Susumu; Mori,Terutaka; Ariga,Akihiko; Shigi,Hidetaka; Watanabe,Takayoshi; Kono,Ryuji, Connection device and test system.
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Doherty Robert C. ; Stewart Thomas K., Customized electrical test probe head using uniform probe assemblies.
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Chraft, Matthew; Henson, Roy J.; Miller, Charles A.; Tseng, Chih-Chiang, High performance probe system.
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Miller, Charles A., High performance probe system.
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Miller, Charles A., High performance probe system.
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Miller, Charles A., High performance probe system.
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Miller,Charles A., High performance probe system.
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Miller,Charles A., High performance probe system.
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Barringer Dennis R. ; LaForce Mark R. ; Marnell Mark A. ; Porter Donald W. ; Schmidt Roger R. ; White Wade H., Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom.
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Ohtaki, Mikio, Method for manufacturing and batch testing semiconductor devices.
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Ohtaki,Mikio, Method for manufacturing and testing semiconductor devices on a resin-coated wafer.
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Nakatani, Goro; Sakuragi, Masahiro; Niino, Koichi, Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe.
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Ohtaki, Mikio, Method of testing circuit elements on a semiconductor wafer.
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Koch, Alexander; Ivannikov, Arkady; Toth, Ted, Probe assembly with multi-directional freedom of motion and mounting assembly therefor.
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Koch,Alexander; Ivannikov,Arkady; Toth,Ted, Probe assembly with multi-directional freedom of motion and mounting assembly therefor.
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Koch,Alexander; Ivannikov,Arkady; Toth,Ted, Probe assembly with multi-directional freedom of motion and mounting assembly therefor.
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Nakatani, Goro; Sakuragi, Masahiro; Niino, Koichi, Probe card.
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Eldridge, Benjamin N.; Khandros, Igor Y.; Sporck, A. Nicholas, Probe card assembly and kit.
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Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
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Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Probe card assembly having an actuator for bending the probe substrate.
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Hagihara Junichi,JPX, Probe card device used in probing apparatus.
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Kasukabe, Susumu; Okamoto, Naoki, Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device.
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Foo See-Hack ; Posedel Rhea ; Lape Larry ; Wrenn James ; Wang Ernie ; Burke Paul ; Buck Carl, Reusable die carrier for burn-in and burn-in process.
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Cadwallader Robert H. ; Morrison Thomas ; Probst Klaus,DEX ; Wojszynski Brian J. ; Yager William A., Substrate tester having shorting pad actuator method and apparatus.
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Lou, Choon Leong; Chen, Ho Yeh; Tseng, Hsiao Ting, Testing device.
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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
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[미국특허] Probe apparatus 원문보기

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