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Process for making improved copper/tungsten composites 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C22C-027/04
  • B22F-003/12
출원번호 US-0646449 (1996-05-07)
발명자 / 주소
  • Jech David E. (Tucson AZ) Sepulveda Juan L. (Tucson AZ) Traversone Anthony B. (Tucson AZ)
출원인 / 주소
  • Brush Wellman Inc. (Cleveland OH 02)
인용정보 피인용 횟수 : 17  인용 특허 : 29

초록

The sinterability of a copper/tungsten green compact is improved by using copper oxide, tungsten oxide or both as the copper and/or tungsten source. Sinterability is further enhanced by including steam in the sintering atmosphere.

대표청구항 ▼

A sintered composite comprising copper and at least one transition metal selected from the group consisting of tungsten and molybdenum, said composite having a density of at least 95% of theoretical, said composite being produced by sintering a compacted mass of copper-containing particles and parti

이 특허에 인용된 특허 (29)

  1. Carey David H. (Austin TX) Whalen Barry H. (Austin TX), Compact adapter package providing peripheral to area translation for an integrated circuit chip.
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  2. Gondusky Joseph M. (Warwick RI) Breit Henry F. (Attleboro MA) Auguston Karen A. (Boston MA), Composite material for a circuit system and method of making.
    상세보기
  3. Oenning James B. (Camarillo CA) Clark Ian S. R. (San Diego CA), Copper-tungsten metal mixture and process.
    상세보기
  4. Duvdevani, Ilan; Lundberg, Robert D., Dilatant behavior of a solution of a sulfonated polymer.
    상세보기
  5. Nadkarni Anil V. (Mentor OH) Samal Prasanna K. (Lyndhurst OH) Synk James E. (Philadelphia PA), Dispersion strengthened metal composites.
    상세보기
  6. Finney Patrick D. (P.O. Box 658 Horsham PA 19044), Disposable container for storing and dispensing pet food.
    상세보기
  7. Renshaw Edward J. (Castle Douglas GB6), Gas control unit for a burner.
    상세보기
  8. Ehlert Michael R. (Beaverton OR) Helderman Earl R. (Hillsboro OR), Heat sink device using composite metal alloy.
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  9. Fitch John S. (Newark CA), High performance substrate, electronic package and integrated circuit cooling process.
    상세보기
  10. Rothkegel Bernhard (Nuremberg DEX) Schreiner Horst (Nuremberg DEX), Impregnated sintered material for electrical contacts and method for its production.
    상세보기
  11. Liao Simon H. (Santa Barbara CA), Laminated leg for thin film magnetic transducer.
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  12. Frantz Earl L. (Reading PA), Low expansion low resistivity composite powder metallurgy member and method of making the same.
    상세보기
  13. Morgan Ricky D. (Ulster PA) Sylvester Vito P. (Athens PA), Method for diffusion bonding of liquid phase sintered materials.
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  14. Polese Frank J. (4421 Granger St. San Diego CA 92126) Giniel Walter V. (San Marcos CA) Hermes Terrence V. (San Diego CA) Ocheretyansky Vladimir (Santee CA), Method for making heat-dissipating elements for micro-electronic devices.
    상세보기
  15. Harner Leslie L. (Ruscombmanor Township ; Berks County PA) Del Corso Gregory J. (Brecknock Township ; Berks County PA), Method of making a low thermal expansion, high thermal conductivity, composite powder metallurgy member and a member mad.
    상세보기
  16. Houck David L. (Towanda PA) Kopatz Nelson (Sayre PA) Paliwal Muktesh (Owego NY) Sampath Sanjay (Coram NY), Method of making flowable tungsten/copper composite powder.
    상세보기
  17. Polinski ; Sr. Paul W. (Dana Point CA), Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure an.
    상세보기
  18. Loo Mike C. (San Jose CA) Vogel Marlin R. (Fremont CA), Multi-chip cooling module and method.
    상세보기
  19. Kuroda Toshio (Nagoya JPX) Kumazawa Koichi (Nagoya JPX), Package comprising a composite metal body brought into contact with a ceramic member.
    상세보기
  20. Sugiyama Susumu (Aichi JPX) Nakamura Yoshio (Aichi JPX) Ohno Harunobu (Aichi JPX) Kamiya Tokimasa (Aichi JPX), Semiconductor apparatus.
    상세보기
  21. Nishiguchi Masanori (Yokohama JPX), Semiconductor chip module.
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  22. Kuniya Keiichi (Hitachi JPX) Arakawa Hideo (Hitachi JPX) Maeda Kunihiro (Hitachi JPX) Morita Keiichi (Hitachi JPX), Semiconductor device.
    상세보기
  23. Onuki Jin (Hitachi JPX) Soeno Ko (Hitachi JPX) Morita Keiichi (Hitachi JPX) Onodera Hisakithi (Hitachi JPX), Semiconductor device.
    상세보기
  24. Kuniya Keiichi (Hitachi JA) Iizuka Tomio (Ibaraki JA) Suwa Masateru (Hitachi JA) Yasuda Tomio (Hitachi JA) Sasaki Takeshi (Hitachi JA) Kikuchi Sakae (Takasaki JA) Suzuki Hideo (Katsuta JA), Semiconductor device having supporting electrode composite structure of metal containing fibers.
    상세보기
  25. Osada Mituo (Itami JPX) Amano Yoshinari (Itami JPX) Ogasa Nobuo (Itami JPX) Ohtsuka Akira (Itami JPX), Substrate for semiconductor apparatus.
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  26. Osada Mituo (Itami JPX) Amano Yoshinari (Itami JPX) Ogasa Nobuo (Itami JPX) Ohtusuka Akira (Itami JPX), Substrate for semiconductor apparatus.
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  27. Osada Mituo (Itami JPX) Amano Yoshinari (Itami JPX) Ogasa Nobuo (Itami JPX) Ohtsuka Akira (Itami JPX), Substrate for semiconductor apparatus having a composite material.
    상세보기
  28. Baird, Phillips C.; Duff, Raymond J., System for packaging of electronic circuits.
    상세보기
  29. Kato Masaru (Amagasaki JPX), Vacuum type breaker contact material of copper infiltrated tungsten.
    상세보기

이 특허를 인용한 특허 (17)

  1. Jech David E. ; Frazier Jordan P. ; Sworden Richard H. ; Sepulveda Juan L., Functionally graded metal substrates and process for making same.
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  2. Opoku-Adusei, Mark; Jech, David E.; Sepulveda, Juan L., High conductivity copper/refractory metal composites and method for making same.
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  3. Sterzel Hans-Josef,DEX, Injection-molding compositions containing metal oxides for the production of metal moldings.
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  4. Polese Frank J. ; Engle Glen B. ; Ocheretyansky Vladimir, Isotropic carbon/copper composites.
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  5. Woodfield, Andrew Philip; Ott, Eric Allen; Shamblen, Clifford Earl; Gigliotti, Michael Francis Xavier, Method for preparing a metallic article having an other additive constituent, without any melting.
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  6. Kim, Byoung Kee; Hong, Seong Hyeon; Woo, Yong Won, Method of producing tungsten-copper based composite powder and sintered alloys for heat-sink using said composite powder.
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  7. Dorfman,Leonid P; Scheithauer,Michael J.; Houck,David L.; Spitsberg,Anna T.; Dann,Jeffrey N., Mo-Cu composite powder.
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  8. Tan Lye King,SGX, Non-magnetic, high density alloy.
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  9. Renner Gerd,DEX ; Siefken Udo,DEX, Powder-metallurgically produced composite material and method for its production.
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  10. Ma, Xianfeng; Yan, Xuewei; Zhao, Wei; Wu, Shixue, Process for preparing a powdered W-Al alloy.
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  11. Meinhardt, Helmut; Meyer, Bernd; Kn?wer, Matthias; Fister, Dietmar; Wiezoreck, Wolfgang, Process for the production of composite components by powder injection molding, and composite powders suitable for this purpose.
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  12. Meinhardt, Helmut; Meyer, Bernd; Knuwer, Matthias; Fister, Dietmar; Wiezoreck, Wolfgang, Process for the production of composite components by powder injection molding, and composite powders suitable for this purpose.
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  13. Li,Qingfa; Zhang,Su Xia; Ho,Meng Kwong, Production of composite materials by powder injection molding and infiltration.
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  14. Ott, Eric Allen; Woodfield, Andrew Philip; Shamblen, Clifford Earl, Production of injection-molded metallic articles using chemically reduced nonmetallic precursor compounds.
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  15. McCoy, John Washington, Semiconductor substrate having copper/diamond composite material and method of making same.
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  16. Hong,Moon Hee; Choi,Ja Ho; Lee,Seoung; Kim,Eun Pyo; Lee,Sung Ho; Noh,Joon Woong, W-Cu alloy having homogeneous micro-structure and the manufacturing method thereof.
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  17. Kawagoe, Hiroshi; Yagi, Kazuhiko, Wiring substrate and electronic device.
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