초록 ▼

It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a t

It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.

대표청구항 ▼

A semiconductor device, comprising: (a) an outer surrounding case; the outer surrounding case comprising, (a-1) a frame having a through hole passing through a first surface and a second surface facing each other and having a step portion recessed from the first surface around an opening of the thro

A semiconductor device, comprising: (a) an outer surrounding case; the outer surrounding case comprising, (a-1) a frame having a through hole passing through a first surface and a second surface facing each other and having a step portion recessed from the first surface around an opening of the through hole in said first surface, and (a-2) a connection electrode having its part sealed in said frame and having its one end protruding from the second surface of the frame and the other end defining an exposed surface in parallel with the first surface in the through hole, said first surface defining an attaching surface of the semiconductor device, said semiconductor device further comprising, (b) an insulating board; said insulating board comprising, (b-1) an insulating plate having two main surfaces, (b-2) a first conductor foil provided on one of the main surfaces of said insulating plate and forming wiring pattern, and (b-3) a second conductor foil provided on the other one of the main surfaces of said insulating plate, said insulating board being fixed to said step portion of said frame so that the surface of said first conductor foil faces the inside of the through hole of said frame and the surface of said second conductor foil protrudes from the first surface of said frame, said semiconductor device further comprising, (c) a semiconductor element provided on said wiring pattern and having a bonding pad on the surface; and (d) a connecting wire connecting said exposed surface of said connection electrode and said bonding pad of said semiconductor element by bonding; and said first conductor foil comprising, (b-2-1) an island-like region on which a terminal end of said connecting wire is bonded and having no electric connection to others.