IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0510668
(1995-08-03)
|
| 우선권정보 |
JP-0218223 (1994-08-19) |
|
발명자
/ 주소 |
- Imahashi Issei (Yamanashi-ken JPX)
|
| 출원인 / 주소 |
- Tokyo Electron Limited (Tokyo JPX 03)
|
| 인용정보 |
피인용 횟수 :
257 인용 특허 :
0 |
초록
▼
A multi-chamber type process system for processing semiconductor wafers is constituted such that a plurality of units selected from process units, transfer units, interconnection units and in/out units are connected via gate valves. Each of the units has a casing with one or more openings through wh
A multi-chamber type process system for processing semiconductor wafers is constituted such that a plurality of units selected from process units, transfer units, interconnection units and in/out units are connected via gate valves. Each of the units has a casing with one or more openings through which each of the wafers passes. The gate valve is attached to a flange provided at the opening, thereby connecting the openings openably and air-tightly. The openings are situated such that the units are connected in a direction defined in units of substantially 90°, and the direction of transfer of the wafers is defined in units of substantially 90°. Those of the openings of the casings of the units, which are not connected to the other openings of the casings, are air-tightly closed by blind plates such that the casings of the units form a vacuum chamber. The internal pressure of each of the casings of the units can be independently controlled.
대표청구항
▼
A semiconductor process system for processing a plurality of substrates, comprising: first and second process units each having a process casing with at least one opening through which each of the substrates can pass, support means for supporting each of the substrates within the process casing, and
A semiconductor process system for processing a plurality of substrates, comprising: first and second process units each having a process casing with at least one opening through which each of the substrates can pass, support means for supporting each of the substrates within the process casing, and means for subjecting each of the substrates to a semiconductor process within the process casing; first and second transfer units each having a transfer casing with at least four openings through which each of the substrates can pass, and a transfer arm, provided within the transfer casing, for transferring each of the substrates, said first and second transfer units being connected to said first and second process units via joints, respectively, said joints connecting the adjoining openings of the two associated units openably and air-tightly; an interconnection unit having an interconnection casing with at least two openings through which each of the substrates can pass, and a table, provided within the interconnection casing, for supporting each of the substrates, said interconnection unit being connected to said first and second transfer units via joints, said joints connecting the adjoining openings of the two associated units openably and air-tightly; and an in/out unit having an in/out casing with at least one opening through which each of the substrates can pass, and vertical movement means for vertically moving at least one cassette storing said substrates at intervals within the in/out casing, said in/out unit being connected to said first transfer unit via a joint, said joint connecting the adjoining openings of the two associated units openably and air-tightly, wherein the opening of each of said units is situated such that said units are connected in directions defined in units of substantially 90°, and the direction of transfer of the substrates is defined in units of substantially 90°, openings of the casings of said process units, said transfer units and said interconnection unit, which are not connected to any of the other openings of the casings, are air-tightly closed by blind plates such that each of the casings of said process units, said transfer units and said inter-connection unit form a vacuum chamber, said joints comprise gate valves having common mounting dimensions, said first and second process units have an installation floor space of substantially a same square, said first and second transfer units have a substantially same size and structure, and have an installation floor space smaller than that of said first and second process units, each of said process units and each of said transfer units connected thereto face each other to have a width of an installation floor space substantially a same as each other and have aligned centers, said interconnection unit has an installation floor space smaller than that of said first and second transfer units, said interconnection unit and each of said transfer units face each other to have a width of an installation floor space substantially a same as each other and to have aligned centers, and said first process unit and said first transfer unit constitute a first process section having only one process unit and only one transfer unit, while said second process unit and said second transfer unit constitute a second process section having only one process unit and only one transfer unit.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.