이 특허를 인용한 특허 (153)

1. Ahmad Syed Sajid, Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid.

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2. Syed Sajid Ahmad, Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid.

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3. Moden, Walter L.; Ahmad, Syed S.; Chapman, Gregory M.; Jiang, Tongbi, Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid.

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4. Walter L. Moden ; Syed S. Ahmad ; Gregory M. Chapman ; Tongbi Jiang, Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid.

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5. Prindiville, Casey, Apparatus and methods for coverlay removal and adhesive application.

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6. Ahmad Syed Sajid, Apparatus for applying viscous materials to a lead frame.

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7. Syed Sajid Ahmad, Apparatus for applying viscous materials to a lead frame.

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8. Moden,Walter L.; Ahmad,Syed S.; Chapman,Gregory M.; Jiang,Tongbi, Apparatus for modifying the configuration of an exposed surface of a viscous fluid.

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9. Rumsey, Brad D.; Bolken, Todd O.; Baerlocher, Cary J., Apparatus for reduced flash encapsulation of microelectronic devices.

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10. Moden, Walter L.; Jacobson, John O., Burn-in carrier for a semiconductor die.

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11. Clyne, Craig T.; Fernandez, John C., Die attached to a support member by a plurality of adhesive members.

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12. Wood Alan G. ; Farnworth Warren M. ; Grigg Ford ; Akram Salman, Direct die contact (DDC) semiconductor package.

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13. Wensel Richard W., Encapsulated integrated circuit packaging.

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14. Moden,Walter L., Flip-chip adaptor package for bare die.

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15. Moden,Walter L., Flip-chip adaptor package for bare die.

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16. Moden, Walter L., Grid array packages.

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17. Moden, Walter L., Grid array packages and assemblies including the same.

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18. Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Brooks Mike ; Cloud Eugene, High density semiconductor package.

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19. Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Brooks Mike ; Cloud Eugene, High density semiconductor package and method of fabrication.

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20. Ahmad, Syed Sajid, Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice.

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21. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.

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22. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.

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23. Bolken, Todd O., Interposers for semiconductor die packages with standard ball grill array footprint.

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24. Seng,Eric Tan Swee; Chye,Lim Thiam, Invertible microfeature device packages.

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25. Seng,Eric Tan Swee; Lim,Thiam Chye, Invertible microfeature device packages.

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26. Mostafazadeh, Shahram; Smith, Joseph O., Lead frame chip scale package.

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27. Mostafazadeh, Shahram; Smith, Joseph O., Lead frame chip scale package.

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28. Mostafazadeh,Shahram; Smith,Joseph O., Lead frame chip scale package.

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29. King Jerrold L., Lead frame coining for semiconductor devices.

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30. Walter L. Moden ; Syed S. Ahmad ; Gregory M. Chapman ; Tongbi Jiang, Method and apparatus for applying adhesives to a lead frame.

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31. Ahmad Syed Sajid, Method and apparatus for applying viscous materials to a lead frame.

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32. Jiang, Tongbi, Method and apparatus for attaching microelectronic substrates and support members.

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33. Jiang,Tongbi, Method and apparatus for attaching microelectronic substrates and support members.

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34. Jiang,Tongbi, Method and apparatus for attaching microelectronic substrates and support members.

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35. Savaria, Albert M., Method and apparatus for dispensing adhesive on microelectronic substrate supports.

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36. Lee, Kian Chai; Tim, Teoh Bee Yong; M, Vijendran; Choong, Lien Wah, Method and apparatus for distributing mold material in a mold for packaging microelectronic devices.

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37. Schrock,Ed A., Method and apparatus for epoxy LOC die attachment.

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38. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.

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39. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.

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40. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.

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41. Rumsey, Brad D.; Bolken, Todd O.; Baerlocher, Cary J., Method and apparatus for reduced flash encapsulation of microelectronic devices.

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42. Brand,Joseph M., Method and apparatus for removing encapsulating material from a packaged microelectronic device.

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43. Brand,Joseph M., Method and apparatus for removing encapsulating material from a packaged microelectronic device.

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44. VanNortwick John, Method and system for fabricating semiconductor components.

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45. Moden, Walter L.; Ahmad, Syed S.; Chapman, Gregory M.; Jiang, Tongbi, Method for applying adhesives to a lead frame.

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46. Bolken, Todd O., Method for assembling semiconductor die packages with standard ball grid array footprint.

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47. Bolken,Todd O., Method for assembling semiconductor die packages with standard ball grid array footprint.

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48. Schrock, Edward A.; Jiang, Tongbi, Method for attaching a semiconductor die to a substrate.

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49. Ahmad, Syed Sajid, Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid.

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50. Akram Salman ; Wood Alan G. ; Farnworth Warren M., Method for fabricating stackable chip scale semiconductor package.

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51. Otremba, Ralf; Schloegel, Xaver; Fischer, Rupert; Tan, Tien Lai, Method for making a device including placing a semiconductor chip on a substrate.

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52. Kim Shin,KRX ; Kim Byung Man,KRX ; Choi Il Heung,KRX ; Bang Jeong Ho,KRX, Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads.

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53. Williams, Vernon M.; Cobbley, Chad A., Method for packaging microelectronic substrates.

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54. Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.

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55. Walter L. Moden ; Syed S. Ahmad ; Gregory M. Chapman ; Tongbi Jiang, Method of applying an adhesive material to lead fingers of a lead frame.

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56. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.

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57. Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.

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58. Joseph M. Brand ; Scott Gooch, Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices.

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59. Neo, Chee Peng; Tan, Hock Chuan; Chew, Beng Chye; Chai, Yih Ming; Tan, Kian Shing, Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths.

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60. Sasov Yuriy Dmitrievich,RUX, Method of manufacturing and checking electronic components.

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61. Moden,Walter L.; Jacobson,John O., Method of temporarily securing a die to a burn-in carrier.

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62. Yee, Jae Hak, Method of trimming and singulating leaded semiconductor packages.

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63. Schrock,Ed A., Methods for epoxy loc die attachment.

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64. Farnworth, Warren M., Methods for formation of recessed encapsulated microelectronic devices.

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65. Grigg, Ford B., Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards.

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66. Lee, Choon Kuan; Chong, Chin Hui; Corisis, David J., Methods for packaging microelectronic devices and microelectronic devices formed using such methods.

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67. Lee, Choon Kuan; Chong, Chin Hui; Corisis, David J., Methods for packaging microelectronic devices and microelectronic devices formed using such methods.

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68. Lee, Choon Kuan; Chong, Chin Hui; Corisis, David J., Methods for packaging microelectronic devices and microelectronic devices formed using such methods.

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69. Benson,Peter A.; Watkins,Charles M., Methods for packaging microfeature devices and microfeature devices formed by such methods.

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70. Benson, Peter A.; Watkins, Charles M., Methods for packing microfeature devices and microfeature devices formed by such methods.

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71. Moden, Walter L., Methods for providing and using grid array packages.

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72. Ahmad Syed Sajid, Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements.

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73. Farnworth, Warren M.; Wood, Alan G., Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods.

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74. Farnworth, Warren M.; Wood, Alan G., Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods.

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75. Clyne, Craig T.; Fernandez, John C., Methods of adhering microfeature workpieces, including a chip, to a support member.

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76. Peng,Neo Chee; Chuan,Tan Hock; Chye,Chew Beng; Ming,David Chai Yih; Shing,Michael Tan Kian, Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths.

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77. Peng,Neo Chee; Chuan,Tan Hock; Chye,Chew Beng; Ming,David Chai Yih; Shing,Michael Tan Kian, Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths.

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78. Peterson, Darin L.; Wensel, Richard W.; Lee, Choon Kuan; Faull, James A., Microelectronic component assemblies having exposed contacts.

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79. Seng,Eric Tan Swee; Chung,Edmund Low Kwok, Microelectronic component assemblies with recessed wire bonds and methods of making same.

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80. Seng,Erin Tan Swee; Chung,Edmund Low Kwok, Microelectronic component assemblies with recessed wire bonds and methods of making same.

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81. Tan, Eric Swee Seng; Low, Edmund Kwok Chung, Microelectronic component assemblies with recessed wire bonds and methods of making same.

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82. Kweon, Young Do; Brooks, J. Michael; Jiang, Tongbi, Microelectronic devices.

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83. Brand,Joseph M., Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies.

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84. Grigg,Ford B., Microelectronic devices and methods for mounting microelectronic packages to circuit boards.

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85. Bolken, Todd O., Microelectronic devices and microelectronic die packages.

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86. Fee, Setho Sing, Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts.

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87. Fee, Setho Sing, Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts.

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88. Fee, Setho Sing, Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts.

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89. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices.

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90. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices.

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91. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices.

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92. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices.

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93. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices.

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94. Clyne, Craig T.; Fernandez, John C., Microfeature systems including adhered microfeature workpieces and support members.

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95. Schrock, Edward A.; Jiang, Tongbi, Multi-layered adhesive for attaching a semiconductor die to a substrate.

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96. Kinsman Larry D., Multilayered lead frame for semiconductor package.

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97. Kinsman Larry D., Multilayered lead frame for semiconductor packages.

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98. Chye, Lim Thiam; Fee, Setho Sing; Seng, Eric Tan Swee, Packaged microelectronic component assemblies.

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99. Heng, Puah Kia, Packaged microelectronic component assemblies.

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100. Heng, Puah Kia, Packaged microelectronic component assemblies.

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101. Eng, Meow Koon; Low, Sui Waf; Chan, Min Yu; Chia, Yong Poo; Ser, Bok Leng; Zhou, Wei, Packaged microelectronic components.

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102. Koon, Eng Meow; Waf, Low Siu; Yu, Chan Min; Poo, Chia Yong; Leng, Ser Bok; Wei, Zhou, Packaged microelectronic components.

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103. Koon,Eng Meow; Waf,Low Siu; Yu,Chan Min; Poo,Chia Yong; Leng,Ser Bok; Wei,Zhou, Packaged microelectronic components.

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104. Koon, Eng Meow; Waf, Low Siu; Yu, Chan Min; Poo, Chia Yong; Leng, Ser Bok; Wei, Zhou, Packaged microelectronic components with terminals exposed through encapsulant.

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105. Corisis, David J.; Brooks, Mike, Packaged microelectronic devices and methods for assembling microelectronic devices.

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106. Corisis, David J.; Brooks, Mike, Packaged microelectronic devices and methods for assembling microelectronic devices.

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107. Schwab, Matt E.; Brooks, J. Michael; Corisis, David J., Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices.

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108. Schwab, Matt E.; Corisis, David J.; Brooks, J. Michael, Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices.

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109. Schwab, Matt E.; Corisis, David J.; Brooks, J. Michael, Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices.

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110. Thurgood, Blaine; Corisis, David, Packaged microelectronic devices and methods for packaging microelectronic devices.

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111. Fee, Setho Sing; Chye, Lim Thiam; Seng, Eric Tan Swee, Packaged microelectronic devices and methods of forming same.

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112. Fee, Setho Sing; Chye, Lim Thiam; Seng, Eric Tan Swee, Packaged microelectronic devices and methods of forming same.

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113. Brand,Joseph M., Packaged microelectronic devices including first and second casings.

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114. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Packaged microelectronic devices recessed in support member cavities, and associated methods.

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115. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Packaged microelectronic devices recessed in support member cavities, and associated methods.

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116. Corisis, David J.; Chong, Chin Hui; Lee, Choon Kuan, Packaged microelectronic devices recessed in support member cavities, and associated methods.

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117. Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.

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118. James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.

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119. James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.

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120. Scranton Alec B. ; Rangarajan Bharath ; Baikerikar Kiran K., Photopolymerizable compositions for encapsulating microelectronic devices.

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121. Philip Young ; Douglas Young ; Scott McDaniel ; Gary Bivins ; William S. Ditto ; Huong Kim Lam, Process to remove semiconductor chips from a plastic package.

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122. Farnworth, Warren M., Recessed encapsulated microelectronic devices and methods for formation.

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123. Farnworth, Warren M., Recessed encapsulated microelectronic devices and methods for formation.

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124. Seng, Eric Tan Swee, Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components.

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125. Seng,Eric Tan Swee, Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components.

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126. Kitaura Takanori,JPX, Semiconductor device and a method of manufacturing the same.

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127. Ichitani Masahiro,JPX ; Haruta Ryo,JPX ; Matsumoto Katsuyuki,JPX ; Kinjyo Arata,JPX ; Kakimoto Tsutomu,JPX, Semiconductor device and method of manufacturing the same.

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128. Joseph M. Brand ; Scott Gooch, Semiconductor device encapsulators.

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129. Brand, Joseph M.; Gooch, Scott, Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages.

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130. Wood, Alan G.; Kinsman, Larry D., Semiconductor device package and method.

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131. Wood,Alan G.; Kinsman,Larry D., Semiconductor device package and method.

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132. Kinsman Larry D. ; Akram Salman, Semiconductor device, ball grid array connection system, and method of making.

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133. Kinsman, Larry D.; Akram, Salman, Semiconductor device, ball grid array connection system, and method of making.

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134. Kinsman,Larry D.; Akram,Salman, Semiconductor device, ball grid array connection system, and method of making.

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135. Larry D. Kinsman ; Salman Akram, Semiconductor device, ball grid array connection system, and method of making.

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136. Bolken, Todd O., Semiconductor die packages with standard ball grid array footprint and method for assembling the same.

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137. Takata, Yasuki; Horibe, Hiroshi; Michii, Kazunari, Semiconductor package.

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138. Prindiville, Casey; Jiang, Tongbi; Street, Bret, Semiconductor packages and methods for making the same.

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139. Prindiville, Casey; Jiang, Tongbi; Street, Bret, Semiconductor packages and methods for making the same.

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140. Corisis, David J.; Brooks, Jerry M.; Moden, Walter L., Stackable ball grid array package.

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141. Akram Salman ; Wood Alan G. ; Farnworth Warren M., Stackable chip scale semiconductor package with mating contacts on opposed surfaces.

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142. Moden, Walter L., Stackable semiconductor device assemblies.

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143. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Siu; Yu, Chan Min; Loo, Neo Yong; Kwang, Chua Swee, Stackable semiconductor package and wafer level fabrication method.

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144. Farnworth, Warren M.; Wood, Alan G.; Brooks, Mike, Stackable semiconductor package having conductive layer and insulating layers.

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145. Warren M. Farnworth ; Alan G. Wood ; Mike Brooks, Stackable semiconductor package having conductive layer and insulating layers and method of fabrication.

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146. Warren M. Farnworth ; Alan G. Wood ; Mike Brooks, Stackable semiconductor package having conductive layer and insulating layers and method of fabrication.

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147. Farnworth Warren M. ; Wood Alan G. ; Brooks Mike, Stacked semiconductor package and method of fabrication.

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148. Farnworth Warren M. ; Wood Alan G. ; Brooks Mike, Stacked semiconductor package and method of fabrication.

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149. VanNortwick, John, System for fabricating semiconductor components.

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150. Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.

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151. Patrick W. Tandy, Test contact.

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152. Hsu Kai Yang, Testing electronic devices.

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153. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Siu; Yu, Chan Min; Loo, Neo Yong; Kwang, Chua Swee, Wafer level stackable semiconductor package.

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