초록 ▼

A system for vacuum-processing objects such as electronic integrated circuit wafers comprises (a) a carrier for transporting the wafers under vacuum in a cassette, the cassette being supported on a movable wall that serves as a bottom cover member of the carrier; and (b) a processing machine having

A system for vacuum-processing objects such as electronic integrated circuit wafers comprises (a) a carrier for transporting the wafers under vacuum in a cassette, the cassette being supported on a movable wall that serves as a bottom cover member of the carrier; and (b) a processing machine having a transfer chamber that is also maintained under vacuum, the transfer chamber having a movable wall in the form of an elevatable stage that sealingly closes the transfer chamber in its outermost position. There is a small sealingly closed interface chamber extending between the movable walls when the cassette is mounted onto the machine. A vacuum pump evacuates the interface chamber in preparation for lowering of the cassette into the transfer chamber by an elevator mechanism.

대표청구항 ▼

A method of moving the contents of a second enclosure volume defined by a second enclosure into a first enclosure volume defined by a first enclosure while minimizing the contamination of either enclosure volume, comprising: providing a wall portion of said first enclosure with a containment apertur

A method of moving the contents of a second enclosure volume defined by a second enclosure into a first enclosure volume defined by a first enclosure while minimizing the contamination of either enclosure volume, comprising: providing a wall portion of said first enclosure with a containment aperture therethrough; providing a wall portion of the second enclosure with a service aperture therethrough; selectively sealing the containment aperture with a first moveable wall; selectively sealing the service aperture with a second moveable wall; providing an extension portion about the periphery of said containment aperture; forming an interface volume by placing the second enclosure on said extension portion and aligning the service aperture within the extension portion wherein the interface volume is exposed to ambient conditions when the second enclosure is removed from the first enclosure; conditioning the interface volume to approximately match the conditions existing in one of the first enclosure volume and the second enclosure volume while the interface volume is isolated from the first and second enclosure volumes; and then moving at least the first moveable wall into the first enclosure volume.