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Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01H-085/04
출원번호 US-0660498 (1996-06-07)
발명자 / 주소
  • Ulm
  • Jr. Steven Francis (Arlington Heights IL) Harris
  • IV Edwin James (Des Plaines IL) Rybka Matthew Michael (Chicago IL)
출원인 / 주소
  • Littelfuse, Inc. (Des Plaines IL 02)
인용정보 피인용 횟수 : 16  인용 특허 : 42

초록

A surface-mount fuse for protecting a circuit, includes a substrate having first and second surfaces, each surface having first, second, third, and forth ends, the substrate also having first, second, third, and fourth sides. The fuse also includes a metal strip evenly attached to the first surface

대표청구항

A surface-mount fuse for protecting a circuit including the fuse comprising: a substrate having first and second surfaces, each surface having first, second, third, and forth ends, the substrate also having first, second, third, and fourth sides; a metal strip evenly attached to the first surface of

이 특허에 인용된 특허 (42)

  1. Syvertson Suzanne M. (Northbrook IL), Arc-extinguishing composition and articles manufactured therefrom.
  2. Viola Frank J. (Uniondale NY) Schaub Erwin L. (Manhasset NY) Burke Lawrence H. (Oregon IL), Blade fuse manufacturing method.
  3. Onishi Yasuhiko (Yokkaichi JPX), Card type fuse and method of producing the same.
  4. Lester Theodore V. (Schiller Park IL) Meyerhoff Jerry D. (Buffalo Grove IL) Saar Loren E. (Elmwood Park IL), Controllable fuse.
  5. Hilgers John L. (Milwaukee WI), Device for programmable thick film networks.
  6. Yamauchi, Yoshio, Device for protection of a semiconductor device.
  7. Oakes Richard T. (Newburyport MA), Electric fuse for small current intensities.
  8. Hyatt Hugh M. (Pacific Grove CA) Shrier Karen P. (Half Moon Bay CA), Electrical overstress protection material and process.
  9. Rooney William J. (Clifton NJ) Rooney Francis J. (Ramsey NJ), Encapsulated hot spot fuse link.
  10. Batdorf Kerry L. (Poughkeepsie NY) Gilmour Richard A. (Colchester VT) Tsang Paul (Poughkeepsie NY), Fabrication and laser deletion of microfuses.
  11. Gurevich Leon (Grover MO), Flip chip microfuse.
  12. Vermot-gaud Jacques (Perly CHX) Melet Georges (Meyrin CHX) Zega Bogdan (Geneva CHX), Fuse.
  13. Rohrer Heinrich (Sachseln CHX) Staubli Werner (Kriens CHX), Fuse device and method of manufacturing such fuse device.
  14. Belopolsky Yakov (Nepean CAX), Fuse for thick film device.
  15. Golke Keith W. (Minneapolis MN) Rabe Robert L. (Maple Grove MN), Fuse status detection circuit.
  16. Krueger David J. (Arlington Heights IL), Fuse with corrugated filament.
  17. Suuronen David E. (Newburyport MA), Fuse with thin film fusible element supported on a substrate.
  18. Suuronen David E. (Newburyport MA) Terry Jean C. (Amesbury MA), Fuse with thin film fusible element supported on a substrate.
  19. Hundrieser Dieter H. (Kemptville CAX), Fusible link.
  20. Doerrwaechter Bernhard E. (Oconomowoc WI), Heat actuated fuse apparatus with solder link.
  21. Montgomery Jeffrey D. (Vista CA), High reliability thick film surface mount fuse assembly.
  22. Breen Barry N. (Givat Zeev ILX) Dakhiya Michael (Kiryat Ono ILX) Daynov Irina (Givat Zeev ILX), High voltage, laminated thin film surface mount fuse and manufacturing method therefor.
  23. Cook James W. (Ellisville MO) Evans Terence J. (Ballwin MO), Low amperage microfuse.
  24. Gurevich Leon (St. Louis MO), Metallo-organic film fractional ampere fuses and method of making.
  25. Hoffman Norman E. (Harrisburg PA), Method of making circuit path conductors in plural planes.
  26. Badihi Avner (Doar-Na ILX) Franklin Robert W. (Paignton GB2) Breen Barry N. (Givat Ze\ev ILX), Method of making thin film surface mount fuses.
  27. Collins Christopher J. (Alameda CA), Overvoltage protection element.
  28. Neidig Arno (Plankstadt DEX) Bayerer Reinhold (Reichelsheim DEX) Hahn Bertold (Hofheim DEX), Power semiconductor module.
  29. Nicolay Hugh C. (Melbourne Village FL), Process for fabrication of fuse and interconnects.
  30. Seidler ; Jack, Solder bearing terminal.
  31. Seidler Jack (Flushing NY), Solder bearing terminal.
  32. Seidler Jack (Flushing NY), Solder-bearing leads.
  33. Carruthers Roy A. (Stormville NY) Dorleans Fernand J. (Wappinger Falls NY) Fitzsimmons John A. (Poughkeepsie NY) Flitsch Richard (Poughkeepsie NY) Jubinsky James A. (Clinton Corners NY) Larsen Gerald, Structure and fabrication of SiCr microfuses.
  34. Morrill ; Jr. Vaughan (St. Louis County MO), Sub-miniature electrical component, particularly a fuse.
  35. Gurevich Leon (St. Louis MO) Spaunhorst Vernon (Washington MO), Subminiature fuse.
  36. Sugar, Joseph, Surface-metalized, bonded fuse with mechanically-stabilized end caps.
  37. Birx Linda B. (Beavercreek OH), Thermal cutoff construction, member therefor and methods of making the same.
  38. Perreault Richard J. (Amesbury MA) Terry Jean C. (Amesbury MA) Fitzgerald Leeman G. (Haverhill MA), Thin film fuse construction.
  39. Badihi Avner (Doar-Na ILX) Franklin Robert W. (Devon GB2) Breen Barry N. (Givat Ze\ev ILX), Thin film surface mount fuses.
  40. Wiebe Gerald L. (18 W. 077 Williamsburg La. Villa Park IL 60181), Three-piece solderless plug-in electrically conducting component.
  41. Gurevich Leon (St. Louis MO), Wire bonded microfuse and method of making.
  42. Tanielian Minas H. (Bellevue WA) Chien Chung-Ping (Redmond WA), Zinc-based microfuse.

이 특허를 인용한 특허 (16)

  1. Yamagishi, Katsuya; Seino, Hideki, Chip fuse and manufacturing method therefor.
  2. Graf,Alfons; Maerz,Martin; Saliternig,Martin, Electric component with a protected current feeding terminal.
  3. Cieplik Ingeborg,DEX ; Frochte Bernd,DEX ; Rupalla Manfred,DEX, Electrical fuse.
  4. Blum, Werner; Friedrich, Reiner; Hinrichs, Reimer; Werner, Wolfgang, Fuse in chip design.
  5. Kaltenborn, Uwe; Hoffmann, Guido; Wilniewczyc, Mariusz; Huser, Patrik, Fusible link.
  6. Whitney, Stephen J., Integrated overcurrent and overvoltage apparatus for use in the protection of telecommunication circuits.
  7. Whitney, Stephen J.; Zhang, David; Davidson, Scott, Integrated overcurrent and overvoltage apparatus for use in the protection of telecommunication circuits.
  8. Whitney,Stephen J., Integrated overcurrent and overvoltage apparatus for use in the protection of telecommunication circuits.
  9. Goldstein, Alona; Daynov, Irina; Ovadia, Herzl; O'Neill, Elinor; Dakhyia, Michael; Glickman, Evgeny, Low current fuse.
  10. Bender,Joan Leslie Winnett; Manoukian,Daniel Minas, Low resistance polymer matrix fuse apparatus and method.
  11. Parker, Robert; Winnett Bender, Joan L.; Manoukian, Daniel M., Low resistance polymer matrix fuse apparatus and method.
  12. Hertz Eric L., Method and apparatus using colored foils for placing conductive preforms.
  13. Jean-Rene Duguet FR, Photoetched-filament pyrotechnic initiator protected against electrostatic discharges.
  14. Graf,Alfons; Maerz,Martin; Saliternig,Martin, Protection circuit.
  15. Ulm ; Jr. Steven Francis ; Harris ; IV Edwin James ; Rybka Matthew Michael, Surface-mount fuse and the manufacture thereof.
  16. Zayatz, Robert; Ronald, Timothy R.; Bronnenberg, Douglas L., Trace fuse.
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