초록 ▼

An electronic assembly that contains a pair of C-shaped springs that couple an integrated circuit and a lid to a printed circuit board. The assembly includes a first spring that is mounted to the printed circuit board. The first spring has a C-shaped finger. The integrated circuit is typically mount

An electronic assembly that contains a pair of C-shaped springs that couple an integrated circuit and a lid to a printed circuit board. The assembly includes a first spring that is mounted to the printed circuit board. The first spring has a C-shaped finger. The integrated circuit is typically mounted to a substrate that is plugged into a socket which is mounted to the printed circuit board. A lid is stacked on top of the integrated circuit. The lid has a ball shaped outer rim. The assembly has a second spring which has a C-shaped finger that captures the outer rim of the lid, and a ball that is captured by the C-shaped finger of the first spring. The first and second springs are interlocked to secure the lid and integrated circuit to the printed circuit board. The lid and integrated circuit can be detached from the assembly by merely deflecting the second spring 36 and removing the components. The springs allow the lid and printed circuit board to thermally expand without creating excessive stresses in the assembly.

대표청구항 ▼

An electronic assembly, comprising: a first substrate; a first spring that is mounted to said first substrate, said first spring has a C-shaped finger; an electronic device that is coupled to said first substrate; a lid that is stacked onto said electronic device, said lid having an outer rim; and,

An electronic assembly, comprising: a first substrate; a first spring that is mounted to said first substrate, said first spring has a C-shaped finger; an electronic device that is coupled to said first substrate; a lid that is stacked onto said electronic device, said lid having an outer rim; and, a second spring which has a C-shaped finger that captures said outer rim of said lid and a knob that is captured by said C-shaped finger of said first spring such that said lid and said electronic device are secured to said first substrate.