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[미국특허] Substrate processing method and substrate processing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/68
출원번호 US-0667712 (1996-06-21)
우선권정보 JP-0183539 (1995-06-27); JP-0183540 (1995-06-27)
발명자 / 주소
  • Harada Junji (Kumamoto JPX) Harada Ichiro (Kumamoto JPX) Nakamura Koji (Kumamoto JPX)
출원인 / 주소
  • Tokyo Electron Limited (Tokyo JPX 03)
인용정보 피인용 횟수 : 132  인용 특허 : 0

초록

According to the present invention, a substrate processing method has (a) the step of predetermining initial conditions for cassettes and substrates before processing is started, (b) the step of setting the cassettes in which the substrates are stored, in the loading/unloading section on the basis o

대표청구항

A substrate processing apparatus in which substrates are extracted from a supply cassette of a loading/unloading section, the extracted substrates are loaded in a processing section and sequentially processed, the processed substrates are stored in a recovery cassette of said loading/unloading secti

이 특허를 인용한 특허 (132) 인용/피인용 타임라인 분석

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