[특허]Method of forming bond pad structure for the via plug process

Method of forming bond pad structure for the via plug process 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/60
출원번호	US-0703918 (1996-08-22)
발명자 / 주소	Shiue Ruey-Yun (Hsin-Chu TWX) Wu Wen-Teng (Hsin-Chu TWX) Shieh Pi-Chen (Hsinchu TWX) Liu Chin-Kai (Hsin-Chu TWX)
출원인 / 주소	Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu TWX 03)
인용정보	피인용 횟수 : 84 인용 특허 : 0

초록 ▼

A bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration. The bond pad structure uses three metal pads separated by layers of dielectric. Via plugs are formed between the first and second metal pads and between the second and third metal pads. The via plugs are formed in a diamond shape with respect to the metal pads. The metal pads are squares with the same orientation. The periphery of the via plugs forms a square rotated 45°with respect to the square metal pads.

대표청구항 ▼

A method of forming a bond pad, comprising the steps of: forming a first dielectric layer; forming a square first metal pad on said first dielectric layer; forming a second dielectric layer over said first metal pad; forming a first number of holes in said second dielectric layer; filling said first number of holes with a fourth metal thereby forming a first number of first via plugs wherein said first via plugs contact said first metal pad and said first number of holes are located such that said first number of first via plugs lie within a first square rotated 45°with respect to said first metal pad; forming a square second metal pad over said second dielectric layer and said first via plugs wherein said second metal pad is directly above said first metal pad and has the same orientation as said first metal pad, and said second metal pad contacts said first via plugs; forming a third dielectric layer over said second metal pad; forming a second number of holes in said third dielectric layer; filling said second number of holes with a fifth metal thereby forming a second number of second via plugs wherein said second via plugs contact said second metal pad; forming a square third metal pad over said third dielectric layer and said second via plugs wherein said third metal pad is directly above said second metal pad, said third metal pad has the same orientation as said second metal pad, said third metal pad contacts said second via plugs, and said second number of holes are located such that said second number of second via plugs lie within a second square rotated 45°with respect to said third metal pad; forming a fourth dielectric layer over said third metal pad; and forming an opening in said fourth dielectric layer directly above said third metal pad thereby exposing said third metal pad.

이 특허를 인용한 특허 (84)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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Method of forming bond pad structure for the via plug process 원문보기

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Method of forming bond pad structure for the via plug process 원문보기

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