이 특허를 인용한 특허 (69)

1. Miller, David B.; Chan, Hing-Wah; Snyder, Tanya J., Aligning an optical device system with an optical lens system.

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2. Banish,Michele; Clark,Rodney L., Anti-reflective structures.

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3. Li, Felix C., Apparatus and method for forming solder seals for semiconductor flip chip packages.

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4. Li,Felix C., Apparatus and method for forming solder seals for semiconductor flip chip packages.

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5. Rothley, Manfred; Mueller-Fiedler, Roland; Zabler, Erich; Erdmann, Lars; Leneke, Wilhelm; Simon, Marion; Storck, Karlheinz; Schieferdecker, Joerg', Apparatus for sensing electromagnetic radiation.

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6. Lee,David S. K.; Postman,John E., Bearing assembly.

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7. Brady, John F.; Syllaios, Athanasios J.; Schimert, Thomas R.; McCardel, William L.; Gooch, Roland W., Color correction for radiation detectors.

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8. Kierse, Oliver; Hynes, Eamon, Control aperture for an IR sensor.

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9. Wu, Jigang; Pang, Shuo; Yang, Changhuei, Delayed emission detection devices and methods.

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10. Lane, William A.; Hynes, Eamon; Coyne, Edward John, Die temperature sensors.

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11. Wang, Weidong; Bumgarner, John, Differential capacitive readout system and method for infrared imaging.

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12. Gomi, Yoshiyuki, Electro-optical device and method for fabricating the same, and projection display device.

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13. Ha, Ju-hwa; Kim, Jin-soo; Paek, Jung-wook; Joo, Byung-yun; Song, Min-young, Fabrication method of light controlling assembly and liquid crystal display device.

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14. Pope,Timothy; Tremblay,Bruno; Picard,Francis, Fast microbolometer pixels with integrated micro-optical focusing elements.

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15. Barrett E. Cole ; Christopher J. Zins, Flexible high performance microbolometer detector material fabricated via controlled ion beam sputter deposition process.

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16. Cole Barrett E. ; Zins Christopher J., Flexible high performance microbolometer detector material fabricated via controlled ion beam sputter deposition process.

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17. Cole Barrett E. ; Zins Christopher J., Flexible high performance microbolometer detector material fabricated via controlled ion beam sputter deposition process.

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18. Gooch, Roland; Kennedy, Adam M.; Black, Stephen H.; Kocian, Thomas Allan; Diep, Buu, Getter structure and method for forming such structure.

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19. Kennedy, Adam M.; Diep, Buu Q.; Black, Stephen H.; Wong, Tse E.; Kocian, Thomas Allan; Tracy, Gregory D., Hermetically sealed package having stress reducing layer.

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20. Kennedy, Adam M.; Diep, Buu Q.; Black, Stephen H.; Wong, Tse E.; Kocian, Thomas Allan; Tracy, Gregory D., Hermetically sealed package having stress reducing layer.

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21. Yang, Changhuei; Wu, Jigang; Pang, Shuo, Holographically illuminated imaging devices.

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22. Chang, Ki Soo; Kim, Geon Hee; Yang, Sun Cheol; Kim, Hyo Sik, Image sensor comprising a digital-alloy microlens array integrated with sensor array, and manufacturing method thereof.

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23. Sone Takanori,JPX, Infrared detector.

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24. Schimert, Thomas R.; Syllaios, Athanasios J.; McCardel, William L.; Gooch, Roland W., Infrared detector elements and methods of forming same.

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25. Schimert, Thomas R.; Beratan, Howard R.; Hanson, Charles M.; Soch, Kevin L.; Tregilgas, John H., Infrared detector with amorphous silicon detector elements, and a method of making it.

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26. Fendler, Manuel; Druart, Guillaume, Infrared imagery device with integrated shield against parasite infrared radiation and method of manufacturing the device.

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27. Uchida, Yuichi; Yamanaka, Hiroshi; Tsuji, Koji; Kirihara, Masao; Yoshihara, Takaaki; Nishijima, Youichi, Infrared sensor.

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28. Higashi, Robert E.; Newstrom-Peitso, Karen M.; Ridley, Jeffrey A., Integral topside vacuum package.

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29. Higashi, Robert E.; Newstrom-Peitso, Karen M.; Ridley, Jeffrey A., Integral topside vacuum package.

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30. Liang, Chin-Wei; Tsai, Cheng-Yuan; Tsai, Chia-Shiung, MEMS device having a getter structure and method of forming the same.

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31. Garcia-Blanco, Sonia; Williamson, Fraser; Viens, Jean François, MEMS-based getter microdevice.

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32. Jung,Kyu dong; Jun,Chan Bong; Choi,Hyung; Kang,Seok jin; Hong,Seog woo; Chung,Seok whan; Lee,Moon chul; Lee,Eun sung, Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate.

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33. Imre, Michael; Loder, Johann; Pfeifer, Gerhard, Method and sensor device for measuring a carbon dioxide content in a fluid.

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34. Hays, Kenneth Maxwell; Bisignano, Alan Glenn; Fitzgibbons, Eugene Timothy, Method for fabricating a sealed-cavity microstructure.

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35. Reinert, Wolfgang; Quenzer, Jochen; Gruber, Kai; Warnat, Stephan, Method for forming a micro-surface structure and for producing a micro-electromechanical component.

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36. Ramamoorthi,Sriram; Chen,Zhizhang; Liebeskind,John; Enck,Ronald L.; Shih,Jennifer, Method of making a getter structure.

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37. Nader Najafi ; Sonbol Massoud-Ansari ; Srinivas Tadigadapa ; Yafan Zhang, Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices.

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38. Gooch, Roland W.; Schimert, Thomas R.; McCardel, William L.; Ritchey, Bobbi A., Microbolometer and method for forming.

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39. Syllaios, Athanasios J.; Schimert, Thomas R.; Taylor, Michael F., Microbolometer infrared detector elements and methods for forming same.

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40. Rhodes Howard E., Microlens array with improved fill factor.

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41. Conte, Andrea; Moraja, Marco, Multilayer getter structures and methods for making same.

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42. Conte,Andrea; Moraja,Marco, Multilayer getter structures and methods for making same.

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43. Clark,Roy; Hamilton,Douglas C., Optical element for efficient sensing at large angles of incidence.

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44. Fleury,Benoist, Photosensitive sensor and applications in the automotive field.

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45. Moraja, Marco; Amiotti, Marco; Dragoni, Costanza; Palladino, Massimo, Preparation of getter surfaces using caustic chemicals.

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46. Kierse, Oliver; Hynes, Eamon, Radiation sensor device and method.

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47. Lambkin, Paul; Lane, William A.; Bain, Andrew David, Radiation sensor with cap and optical elements.

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48. Janotte, Michael, Radiation thermometer and radiation sensor with several sensor elements, method for determining temperature.

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49. Pang, Shuo; Yang, Changhuei, Reflective focusing and transmissive projection device.

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50. Hays Kenneth Maxwell ; Bisignano Alan Glenn ; Fitzgibbons Eugene Timothy, Sealed-cavity microstructure and microbolometer and associated fabrication methods.

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51. Eldridge, Jerome M.; Farrar, Paul A., Semiconductor package having a heat-activated source of releasable hydrogen.

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52. McKinnell,James C.; Chen,Chien Hua; Diest,Kenneth; Kramer,Kenneth M.; Kearl,Daniel A., Semiconductor package with getter formed over an irregular structure.

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53. Lane, William A.; Hynes, Eamon; Coyne, Edward John, Sensor.

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54. Hynes,Eamon; Coyne,Edward John; Lane,William A., Sensor and cap arrangement.

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55. Pillans, Luke Alexander, Sensor device with improved sensitivity to temperature variation in a semiconductor substrate.

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56. Nonaka Ken-Ichi,JPX ; Yokoyama Seiichi,JPX ; Suzuki Toshifumi,JPX, Sensor element with small area light detecting section of bridge structure.

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57. Gooch,Roland W.; Syllaios,Athanasios J.; Schimert,Thomas R.; McCardel,William L., Systems and methods for bonding.

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58. Syllaios,Athanasios J.; Schimert,Thomas R.; McCardel,William L.; Gooch,Roland W.; Brady,John F., Systems and methods for integrating focal plane arrays.

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59. Syllaios, Athanasios J.; Taylor, Michael F.; Ajmera, Sameer K., Transitioned film growth for conductive semiconductor materials.

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60. Ramamoorthi,Sriram; Chen,Zhizhang; Liebeskind,John; Enck,Ronald L.; Shih,Jennifer, Vacuum device having a getter.

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61. Ramamoorthi, Sriram; Chen, Zhizhang; Liebeskind, John; Enck, Ronald L.; Shih, Jennifer, Vacuum device having non-evaporable getter component with increased exposed surface area.

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62. Gooch, Roland W.; Schimert, Thomas R., Vacuum package fabrication of integrated circuit components.

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63. Gooch, Roland W.; Schimert, Thomas R., Vacuum package fabrication of integrated circuit components.

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64. Syllaios, Athanasios J.; Gooch, Roland W.; Schimert, Thomas R., Vacuum package fabrication of integrated circuit components.

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65. Syllaios,Athanasios J.; Gooch,Roland W.; Schimert,Thomas R., Vacuum package fabrication of integrated circuit components.

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66. Roland W. Gooch, Vacuum package fabrication of microelectromechanical system devices with integrated circuit components.

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67. Kierse, Oliver, Wafer level CSP sensor.

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68. Gooch, Roland W.; Diep, Buu Q.; Kennedy, Adam M.; Black, Stephen H.; Kocian, Thomas A., Wafer level package solder barrier used as vacuum getter.

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69. Blackwell, Jr., Richard J., Wafer-level intrapixel getter reflector whole die encapsulation device and method.

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