초록 ▼

Connectors are provided for propagation of electrical signals in a plurality of closely spaced propagation paths, such as between circuits connected to conductive pads of circuit boards, each circuit presenting a certain characteristic impedance at a pad connected thereto. For example, each connecto

Connectors are provided for propagation of electrical signals in a plurality of closely spaced propagation paths, such as between circuits connected to conductive pads of circuit boards, each circuit presenting a certain characteristic impedance at a pad connected thereto. For example, each connector includes a plurality of resilient and electrically conductive signal-propagating interconnect means having opposite ends engageable with conductive pads on a pair of the circuit boards. The interconnect means are supported by insulating means of a support structure which also provides conductive ground means in adjacent relation to the conductive interconnect means. The conductive ground means are arranged for connection to grounding elements of the circuit boards. The configuration and characteristics of the ground conductor means and the insulating means in relation to each signal-propagating interconnect means are such as to obtain a certain characteristic impedance for matching the characteristic impedances of circuits interconnected by each signal-propagating interconnect means.

대표청구항 ▼

[ What is claimed is:] [1.] An electrical connector for propagation of electrical signals in a plurality of propagation paths between circuit connections and ground conductors of a pair of circuit components, each circuit presenting a certain characteristic impedance at an interconnect thereof, said

[ What is claimed is:] [1.] An electrical connector for propagation of electrical signals in a plurality of propagation paths between circuit connections and ground conductors of a pair of circuit components, each circuit presenting a certain characteristic impedance at an interconnect thereof, said connector comprising: support means having openings therethrough and electrically conductive signal-propagating interconnect means arranged in said openings of said support means for engagement with interconnects of said components adjacent said support means, ground conductor means included in said support means and having portions in adjacent relation to said signal-propagating interconnect means, ground connection means for connecting said ground conductor means to ground conductors of interconnected circuit components, and insulating means of dielectric material included in said support means for supporting said signal-propagating interconnect means within said openings and in electrically insulated relation to adjacent portions of said ground conductor means, the configuration and characteristics of said ground conductor means and said insulating means in relation to each signal-propagating interconnect means being such as to obtain a certain characteristic impedance for matching the characteristic impedances of circuits interconnected by each signal-propagating interconnect means.