$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Metal ceramic composites with improved interfacial properties and methods to make such composites 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/00
  • B32B-015/00
  • H01L-029/12
출원번호 US-0697739 (1996-08-29)
발명자 / 주소
  • deRochemont L. Pierre
  • Farmer Peter H.
출원인 / 주소
  • deRochemont
  • L. Pierre
대리인 / 주소
    Cohen
인용정보 피인용 횟수 : 56  인용 특허 : 0

초록

A metal-ceramic composite comprised of a metal member bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880.degree. C., and metal-ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member

대표청구항

[ What is claimed is:] [1.] A printed circuit board comprising a metal member directly bonded to a ceramic member via a covalent bond, the bond being formed at less than 500.degree. C., the metal member and the ceramic member providing heat dissipation for at least one SIC mounted on the metal membe

이 특허를 인용한 특허 (56)

  1. Caldwell, Barry, Adhesive pad having EMC shielding characteristics.
  2. Yiasoumi, Andreas; Blanchard, Jack, Aircraft electrical cable raceway.
  3. Renn, Michael J.; King, Bruce H.; Essien, Marcelino; Marquez, Gregory J.; Giridharan, Manampathy G.; Sheu, Jyh-Cherng, Apparatuses and methods for maskless mesoscale material deposition.
  4. Manthiram, Arumugam; Choi, Wonchang, Cation-substituted spinel oxide and oxyfluoride cathodes for lithium ion batteries.
  5. Manthiram, Arumugam; Choi, Wonchang, Cation-substituted spinel oxide and oxyfluoride cathodes for lithium ion batteries.
  6. de Rochemont, L. Pierre, Ceramic antenna module and methods of manufacture thereof.
  7. de Rochemont, L. Pierre, Ceramic antenna module and methods of manufacture thereof.
  8. de Rochemont, L. Pierre, Ceramic antenna module and methods of manufacture thereof.
  9. de Rochemont, L. Pierre, Ceramic antenna module and methods of manufacture thereof.
  10. deRochemont L. Pierre ; Farmer Peter H., Ceramic composite wiring structures for semiconductor devices and method of manufacture.
  11. de Rochemont, L. Pierre, Chemically complex ablative max-phase material and method of manufacture.
  12. Ai-Quoc Pham ; Robert S. Glass ; Tae H. Lee, Colloidal spray method for low cost thin coating deposition.
  13. Keicher, David M.; Brewer, Lucas B.; Grylls, Richard John, Deep deposition head.
  14. Blanchard, Jack; Bryant, Anthony, Electrical cable protector.
  15. de Rochemont, L. Pierre, Electrical components and method of manufacture.
  16. de Rochemont, L. Pierre, Electrical components and method of manufacture.
  17. Toh, Tze-Chuen, Electromagnetic interference reduction system.
  18. Symons, Walter T.; Polikarpus, Kaius K.; Gross, Kerry J., Exhaust gas sensor and the method of manufacture thereof.
  19. David M. Keicher ; James L. Bullen ; Pierrette H. Gorman ; James W. Love ; Kevin J. Dullea ; Mark E. Smith, Forming structures from CAD solid models.
  20. Keicher, David M.; Love, James W.; Dullea, Kevin J.; Bullen, James L.; Gorman, Pierrette H.; Smith, Mark E., Forming structures from CAD solid models.
  21. Renn, Michael J.; King, Bruce H., Forming structures using aerosol jet® deposition.
  22. de Rochemont, L. Pierre, Frequency-selective dipole antennas.
  23. de Rochemont, L. Pierre, Frequency-selective dipole antennas.
  24. de Rochemont, L. Pierre, Hybrid computing module.
  25. de Rochemont, L. Pierre, Hybrid computing module.
  26. Caulfeild, Stephen; Olver, Bryan, Hybrid metal/composite link rod for turbofan gas turbine engine.
  27. Furo,Masahiro; Osanai,Hideyo, Insulating substrate boards for semiconductor and power modules.
  28. Masters, Brett P.; Rodgers, John P.; van Schoor, Marthinus C., Laser machining of electroactive ceramics.
  29. de Rochemont, L. Pierre, Liquid chemical deposition apparatus and process and products therefrom.
  30. de Rochemont, L. Pierre; Kovacs, Alexander J., Liquid chemical deposition apparatus and process and products therefrom.
  31. Morris, Terrel L., Lossy RF shield for integrated circuits.
  32. Keicher, David M.; Love, James W., Manufacturable geometries for thermal management of complex three-dimensional shapes.
  33. King, Bruce H.; Marquez, Gregory James; Renn, Michael J., Mechanically integrated and closely coupled print head and mist source.
  34. Kida, Masahiro; Hayase, Toru; Katsuda, Yuji, Member for semiconductor manufacturing apparatus.
  35. Osanai,Hideyo; Furo,Masahiro, Metal-ceramic circuit board.
  36. deRochemont Pierre L. ; Ryder Daniel E. ; Suscavage Michael J. ; Klugerman Mikhail, Method for making ceramic-metal composites and the resulting composites.
  37. Brown Dennis P., Method of fabricating a laminated composite material.
  38. deRochemont,L. Pierre; Farmer,Peter H., Method of manufacture of ceramic composite wiring structures for semiconductor devices.
  39. Osanai, Hideyo; Furo, Masahiro, Method of manufacturing a metal-ceramic circuit board.
  40. Osanai,Hideyo; Furo,Masahiro, Method of manufacturing a metal-ceramic circuit board.
  41. Lee Kam Leung ; Lewis David Andrew ; Roy Ronnen Andrew ; Viswanathan Raman Gobichettipalayam, Microwave annealing.
  42. King, Bruce H.; Renn, Michael J.; Paulsen, Jason A., Miniature aerosol jet and aerosol jet array.
  43. de Rochemont, L. Pierre, Monolithic DC/DC power management module with surface FET.
  44. de Rochemont, L. Pierre, Photovoltaic devices with silicon dioxide encapsulation layer and method to make same.
  45. de Rochemont, L. Pierre, Power FET with a resonant transistor gate.
  46. deRochemont, L. Pierre, Power management module and method of manufacture.
  47. Ohya, Kazuyuki; Sayama, Norio; Nobukuni, Takeshi, Process for the production of composite ceramic printed wiring board.
  48. Grille, Thomas; Hedenig, Ursula; Plagmann, Joern; Schoenherr, Helmut; Muth, Ralph, Production of adhesion structures in dielectric layers using photoprocess technology and devices incorporating adhesion structures.
  49. Shih, Tung-Hsiu; Nieh, Kai Wei; Krasnov, Victor, Pulsed mode apparatus with mismatched battery.
  50. de Rochemont, L. Pierre, R.F. energy collection circuit for wireless devices.
  51. de Rochemont, L. Pierre, R.F. energy collection circuit for wireless devices.
  52. de Rochemont, L. Pierre, Semiconductor carrier with vertical power FET module.
  53. de Rochemont, L. Pierre, Semiconductor carrier with vertical power FET module.
  54. de Rochemont, L. Pierre, Semiconductor chip carriers with monolithically integrated quantum dot devices and method of manufacture thereof.
  55. Liang, Jiuh-Ming; Nieh, Kai Wei, Solid-state lithium battery with electrolyte.
  56. Hiroyuki Kushida JP; Mitsuharu Endo JP, Thermal transfer recording apparatus and method for thermal transfer recording.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로