초록 ▼

A vacuum-metallizing machine including a metal platter base (17) having an obverse side and a face side. A substrate-receiving platter (2) is resiliently disposed (3, 3b) in a recess on the face side of the platter base (17). The platter (2) receives a substrate to be metallized. A circumferentially

A vacuum-metallizing machine including a metal platter base (17) having an obverse side and a face side. A substrate-receiving platter (2) is resiliently disposed (3, 3b) in a recess on the face side of the platter base (17). The platter (2) receives a substrate to be metallized. A circumferentially-arranged rigid ring (27) of predetermined dimensions and location is disposed on the face side and mates with a ring (29) around a port (11) on the wall of the vacuum chamber which surrounds an opening in the wall. Engagement of these rings aligns the platter base (17) relative to the port (11, 12, 13 and 14). A compliant ring (42) is disposed between the wall and the platter base (17). The obverse side of the platter base (17) and the chamber are resiliently forced (37a, 37b, 37c) into contact with each other with a toggling action (24, 22b, 22) whereby to align the platter base (17) relative to the port, to force the outer diameter of the platter base (17) into metal-to-metal contact with the periphery of the port (11), to align the substrate relative to the port (11) and also to force the compliant ring into sealing engagement with the wall, thus, to form a vacuum tight seal.

대표청구항 ▼

[ As our invention we claim:] [11.] Apparatus for vacuum metallizing compact discs, said apparatus comprising:a vacuum chamber, said vacuum chamber having at least one loading-unloading station and at least one sputtering station disposed on walls of said chamber, each of said stations being entered

[ As our invention we claim:] [11.] Apparatus for vacuum metallizing compact discs, said apparatus comprising:a vacuum chamber, said vacuum chamber having at least one loading-unloading station and at least one sputtering station disposed on walls of said chamber, each of said stations being entered through ports;at least two platter bases disposed within said vacuum chamber, each platter base being formed of a rigid material and having an obverse side and a face side, each platter base having a recess disposed in said face side to receive a platter;a platter disposed within each of said recesses, said platters each having an obverse side and a face side, said face sides each comprising longitudinally-extending, substrate-receiving surfaces, each of said obverse sides being resiliently attached to a platter base;a circumferentially-arranged ring disposed on the face side of each platter and another ring disposed around the ports, the rings on said face sides being adapted to engage the rings around the ports whereby to align said platters and relative to said ports;an articulated push rod extending from and resiliently attached to each of said platter bases, said push rod being arranged to receive non-axial forces and translate said forces into axial forces to urge said platter base and said platter towards said wall in an axial direction, each push rod being reciprocatable with a platter base whereby to force the perimeter of the platter base into sealing face-to-face contact with said ports;means to rotate said platters on an axis of rotation whereby to index said platters from said loading-unloading station to said sputtering station and thence to a loading-unloading station;a toggle shaft and a linkage extending between each toggle shaft and each push rod;means to rotate said toggle shaft in one direction to move said platters normal to said axis of rotation and means to toggle said linkages whereby to force the perimeters of said platter bases against said walls and engage said walls with face-to-face sealing contact; andmeans to rotate said toggle shaft in the opposite direction to withdraw said platters from engagement with said walls for further rotation of said platters about said axis.