초록 ▼

The invention provides a circuit element mounting structure including (a) a substrate having a pattern A of wirings therein, (b) at least one cavity formed at a surface the substrate, and (c) a cap for covering the cavity therewith, the cap including a pattern B of wirings therein and a recess for e

The invention provides a circuit element mounting structure including (a) a substrate having a pattern A of wirings therein, (b) at least one cavity formed at a surface the substrate, and (c) a cap for covering the cavity therewith, the cap including a pattern B of wirings therein and a recess for electrically connecting the pattern B of wirings the pattern A of wirings. The substrate includes a protrusion for electrically connecting connection B to the pattern A of wirings. The recess and protrusion are configured to engage each other. In accordance with the invention, it is now possible to mount circuit elements on a cap which had been a dead space in prior circuit, and hence also possible to mount circuit elements in higher density on a substrate including a cap zone.

대표청구항 ▼

[ What is claimed is:] [1.] A circuit element mounting structure comprising:a substrate having a pattern A of wirings therein;at least one cavity formed at a surface of said substrate; anda cap for covering said cavity therewith, said cap including (a) a pattern B of wirings therein and (b) at least

[ What is claimed is:] [1.] A circuit element mounting structure comprising:a substrate having a pattern A of wirings therein;at least one cavity formed at a surface of said substrate; anda cap for covering said cavity therewith, said cap including (a) a pattern B of wirings therein and (b) at least one connection B for electrically connecting said pattern B of wirings to said pattern A of wirings;said substrate including at least one connection A for electrically connecting said connection B to said pattern A of wirings;said cap having a thickness equal to a depth of said cavity.