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Heat pipe exchanger system for cooling a hinged computing device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-005/00
  • F28D-015/02
  • H05K-007/20
출원번호 US-0758897 (1996-12-02)
발명자 / 주소
  • Bhatia Rakesh
  • Haley Kevin
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman
인용정보 피인용 횟수 : 35  인용 특허 : 5

초록

A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edge. A heat exchang

대표청구항

[ What is claimed is:] [1.] A hinged computing device comprising:a first hinged member having a first edge;a second hinged member having a second edge, the first and second hinged members being rotatably attached along the first edge and the second edge;a first heat pipe coupled to the first hinged

이 특허에 인용된 특허 (5)

  1. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  2. Swindler Dan (Austin TX), Heat sink/component access door for portable computers.
  3. Holmberg ; Jr. Arthur (Cypress CA) Wilson David E. (Huntington Beach CA), Low torque hinged heat transfer joint.
  4. Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX), Packaging structure of small-sized computer.
  5. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.

이 특허를 인용한 특허 (35)

  1. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
  2. Bhatia, Rakesh, Apparatus for cooling a heat dissipating device located within a portable computer.
  3. Sagal, E. Mikhail, Capacitor post with improved thermal conductivity.
  4. Oyamada Takashi,JPX, Electronic device having a plug-in unit with a heat sink structure.
  5. Tanahashi Makoto,JPX ; Asawa Tsutomu,JPX ; Ichikawa Mitsuru,JPX, Electronic device with improved heat dissipation.
  6. Shigeo Ohashi JP; Takashi Naganawa JP; Tadakatsu Nakajima JP; Tsuyoshi Nakagawa JP; Masaaki Eishima JP; Yoshihiro Kondo JP, Electronic equipment.
  7. Rude Edward T. ; Carpenter David A., Friction hinge having high thermal conductivity.
  8. Koichi Inoue JP; Chiyoshi Sasaki JP, Heat conducting apparatus and electronic apparatus having the same.
  9. Chu, Hung-Chun; Lin, Hsi-Feng; Pan, Zhi-Houng, Heat dissipation module and detachable expansion card using the same.
  10. Hsu Richard T., Heat dissipation system for a laptop computer using a heat pipe.
  11. Hurbi, Erin; Taylor, Joe, Heat pipe having a predetermined torque resistance.
  12. Sasaki, Chiyoshi; Maekawa, Hiroaki; Sotani, Junji; Ohmi, Masaru; Tsukada, Isao; Arimoto, Toru, Heat pipe hinge structure for electronic device.
  13. Miller, James D.; Sagal, E. Mikhail; McCullough, Kevin A., Highly thermally conductive electronic connector.
  14. Bhatia Rakesh, Keyboard having an integral heat pipe.
  15. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  16. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  17. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  18. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  19. Sagal, E. Mikhail, Method of making a capacitor post with improved thermal conductivity.
  20. McCullough, Kevin A., Method of manufacturing a structural frame.
  21. Noble,Scott; Lee,Seri, Method, apparatus and system for enclosure enhancement.
  22. Ali, Ihab A., Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies.
  23. Miller,James D.; Sagal,E. Mikhail; McCullough,Kevin A., Molded electronic connector formed from a thermally conductive polymer composition and method of making the same.
  24. Moore David A., Molded heat exchanger structure for portable computer.
  25. Progl Curtis L. ; Zhang Allen P., Portable computer with flexible heat spreader plate structure therein.
  26. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  27. Holung Joseph Anthony ; Wong Tin-Lup ; Kamath Vinod, Quick-release hinge joint for heat pipe.
  28. Grayson, Gary D.; Henley, Mark W., Rotary thermal switch.
  29. Rossi,Thomas M.; Pokharna,Himanshu, System to improve display efficiency based on recycling local heat source.
  30. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
  31. Kevin A. McCullough ; E. Mikhail Sagal ; James D. Miller, Thermally conductive electronic device case.
  32. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient computer incorporating deploying CPU module.
  33. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  34. Tuma, Phillip E., Variable position cooling apparatus.
  35. Tao Chian,TWX ; Chang Eric,TWX ; Lin Chia-Jui,TWX, Winding chain dissipating unit suitable for electronic device.
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