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Multilayer wiring structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
출원번호 US-0208870 (1994-03-11)
우선권정보 JP-0051118 (1993-03-11)
발명자 / 주소
  • Fuchida Yumi,JPX
  • Hanari Jun,JPX
  • Matsumoto Kazuhiro,JPX
  • Kudo Junichi,JPX
  • Yoshihara Kunio,JPX
  • Takagi Ayako,JPX
출원인 / 주소
  • Kabushiki Kaisha Toshiba, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 259  인용 특허 : 0

초록 ▼

A multilayer wiring structure comprising a substrate, two line layers, and an interlayer insulating film. The first line layer consists of strip-shaped power/ground lines which extend parallel to one another. The second line layer is located above or below the first line layer, extends substantially

대표청구항 ▼

[ What is claimed is:] [1.] A multilayer wiring structure comprising:a substrate;a first line layer essentially consisting of at least one of a strip-shaped power line and a strip-shaped ground line extending in a first direction;a second line layer located above or below said first line layer and e

이 특허를 인용한 특허 (259)

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