초록

A semiconductor interconnection consists of a corrosion resistant integrated fuse and Controlled, Collapse Chip Connection (C4) structure for the planar copper Back End of Line (BEOL). Non copper fuse material is directly connected to copper wiring.

대표청구항 ▼

[ Having thus described our invention, what we claim as new and desire to secure by Letters Patent is as follows:] [1.] An interconnection structure for a semiconductor circuit comprising:a first interconnection layer including a first non-self-passivating conductor, said layer having its upper surf

[ Having thus described our invention, what we claim as new and desire to secure by Letters Patent is as follows:] [1.] An interconnection structure for a semiconductor circuit comprising:a first interconnection layer including a first non-self-passivating conductor, said layer having its upper surface coplanar with a first insulator; anda second interconnection layer overlying said first interconnection layer and comprising a coplanar layer including a self-passivating conductor and second insulator, said self-passivating conductor electrically contacting said non-self-passivating conductor.